发明授权
- 专利标题： Electronic systems with inverted circuit board with heat sink to chassis attachment
-
申请号： US18498891申请日： 2023-10-31
-
公开(公告)号： US12131977B2公开(公告)日： 2024-10-29
- 发明人: Barrett M. Faneuf , Phil Geng , Kenan Arik , David Shia , Casey Winkel , Sandeep Ahuja , Eric D. McAfee , Jeffory L Smalley , Minh T. D. Le , Ralph V. Miele , Marc Milobinski , Aaron P. Anderson , Brendan T. Pavelek , Carlos Alvizo Flores , Fernando Gonzalez Lenero
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Hanley, Flight & Zimmerman, LLC
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; G11C5/06 ; H05K7/14 ; H05K7/20
摘要：
An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.
公开/授权文献
信息查询
IPC分类:
