公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US12057370B2

公开(公告)日：2024-08-06

申请号：US17030137

申请日：2020-09-23

Applicant: Intel Corporation

Inventor： Paul Diglio ,  Pooya Tadayon ,  David Shia

IPC: H01L23/34 ,  C23C16/00 ,  H01L23/473

CPC classification number: H01L23/4735

Abstract: Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.

公开(公告)号：US11976671B2

公开(公告)日：2024-05-07

申请号：US17030141

申请日：2020-09-23

Applicant: Intel Corporation

Inventor： Paul Diglio ,  Pooya Tadayon ,  David Shia

IPC: B05C11/00 ,  F04D29/58 ,  C23C16/458 ,  C23C16/46 ,  H01L21/66

CPC classification number: F04D29/588 ,  C23C16/4586 ,  C23C16/46 ,  H01L22/12

Abstract: Embodiments disclosed herein include temperature control systems. In an embodiment, a temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber, and where the fluid reservoir is between the vacuum source and the spray chamber.

公开(公告)号：US20230180434A1

公开(公告)日：2023-06-08

申请号：US17542907

申请日：2021-12-06

Applicant: Intel Corporation

Inventor： David Shia ,  Jin Yang ,  Jimmy Chuang ,  Mohanraj Prabjugoud ,  Michael T. Crocker

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20381

Abstract: A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.

公开(公告)号：US20230038805A1

公开(公告)日：2023-02-09

申请号：US17956624

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Ralph Miele ,  Sandeep Ahuja ,  Jeffory Smalley

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/40

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

公开(公告)号：US11449111B2

公开(公告)日：2022-09-20

申请号：US15942280

申请日：2018-03-30

Applicant: INTEL CORPORATION

Inventor： Eric W. Buddrius ,  Ralph V. Miele ,  Mohanraj Prabhugoud ,  David Shia ,  Jeffory L. Smalley

IPC: G06F1/18 ,  H05K7/14 ,  H05K7/18 ,  H05K7/16 ,  H05K7/10

Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

公开(公告)号：US20210351108A1

公开(公告)日：2021-11-11

申请号：US17030137

申请日：2020-09-23

Applicant: Intel Corporation

Inventor： Paul Diglio ,  Pooya Tadayon ,  David Shia

IPC: H01L23/473

Abstract: Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.

公开(公告)号：US20190310287A1

公开(公告)日：2019-10-10

申请号：US16461387

申请日：2016-12-23

Applicant: Intel Corporation

Inventor： Pooya Tadayon ,  David Shia

IPC: G01R1/073 ,  G01R31/28

Abstract: An embodiment includes an apparatus comprising: a substrate including a surface that comprises first, second, and third apertures; and first, second, and third probes comprising proximal ends that are respectively included within and project from the first, second, and third apertures; wherein the first, second, and third probes: (a)(i) intersect a plane that is generally coplanar with the surface, (a)(ii) include distal ends configured to contact electrical contacts of a device under test (DUT), and (a)(iii) are generally linear and each include a major axis that is non-orthogonal to the plane. Other embodiments are described herein.

公开(公告)号：US12063759B2

公开(公告)日：2024-08-13

申请号：US16927701

申请日：2020-07-13

Applicant: Intel Corporation

Inventor： Berhanu Wondimu ,  David Shia ,  Xudong Tang

IPC: H05K7/20 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20

CPC classification number: H05K7/20781 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20 ,  G05B2219/25252 ,  G05B2219/25258 ,  G06F2200/201

Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.