公开(公告)号：US20240172393A1

公开(公告)日：2024-05-23

申请号：US18428991

申请日：2024-01-31

申请人： Intel Corporation

发明人： Sandeep Ahuja ,  Yang Yao ,  Ming Zhang ,  Yuehong Fan ,  Xiang Que ,  Mark MacDonald ,  Casey Jamesen Carte ,  Yue Yang ,  Eric D. McAfee ,  Satyam Saini ,  Suchismita Sarangi ,  Drew Damm ,  Jessica Gullbrand

IPC分类号： H05K7/20

CPC分类号： H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

摘要： Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

公开(公告)号：US10188931B2

公开(公告)日：2019-01-29

申请号：US15201358

申请日：2016-07-01

申请人： Intel Corporation

发明人： Andrew Larson ,  Mark E. Sprenger ,  Ralph V. Miele ,  Eric D. McAfee ,  Mark MacDonald

IPC分类号： A63B71/00 ,  A63B69/00 ,  A63B71/06 ,  A63B63/00 ,  A63B24/00 ,  A63B102/14 ,  A63B102/18

摘要： Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

申请人： Intel Corporation

发明人： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC分类号： H05K7/20

CPC分类号： H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

摘要： Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US09433132B2

公开(公告)日：2016-08-30

申请号：US14455337

申请日：2014-08-08

申请人： Intel Corporation

发明人： Shankar Krishnan ,  Eric D. McAfee ,  Tod A. Byquist

IPC分类号： H05K7/20 ,  H01L23/473

CPC分类号： H05K7/20818 ,  H05K7/203

摘要： Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及浸入式冷却的技术和配置。 在实施例中，配置用于浸没冷却的装置可以包括多个托盘和流体循环系统。 托盘的数量可以被配置为保持一个或多个电路板，并且可以具有第一开口以允许电介质流体被注入到托盘中，以及第二开口以允许电介质流体逸出。 流体循环系统可以包括收集从多个托盘逸出的介电流体的集水区域和与集水区域联接的分配歧管，以将收集在集水区域中的介电流体输送回多个托盘。 可以描述和/或要求保护其他实施例。

公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

申请人： Intel Corporation

发明人： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC分类号： H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC分类号： H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

摘要： An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US11184997B2

公开(公告)日：2021-11-23

申请号：US15960127

申请日：2018-04-23

申请人： Intel Corporation

发明人： Joseph Andrew Broderick ,  Barrett M. Faneuf ,  Eric D. McAfee ,  Juan G. Cevallos ,  Jaime A. Sanchez ,  Emery E. Frey

IPC分类号： H05K7/20 ,  H05K7/14 ,  H05K1/02 ,  H05K7/02

摘要： Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

申请人： Intel Corporation

发明人： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC分类号： H01L23/40 ,  H05K7/14 ,  H01L23/367

摘要： A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11842943B2

公开(公告)日：2023-12-12

申请号：US16986122

申请日：2020-08-05

申请人： Intel Corporation

发明人： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Fernando Gonzalez Lenero ,  Carlos Alvizo Flores

IPC分类号： H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC分类号： H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

摘要： An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20180001179A1

公开(公告)日：2018-01-04

申请号：US15201358

申请日：2016-07-01

申请人： Intel Corporation

发明人： Andrew Larson ,  Mark E. Sprenger ,  Ralph V. Miele ,  Eric D. McAfee ,  Mark MacDonald

IPC分类号： A63B71/06

CPC分类号： A63B71/0605 ,  A63B63/004 ,  A63B63/008 ,  A63B69/0013 ,  A63B71/0622 ,  A63B2024/0028 ,  A63B2071/0625 ,  A63B2071/0666 ,  A63B2102/14 ,  A63B2102/18 ,  A63B2102/182 ,  A63B2207/02 ,  A63B2220/40 ,  A63B2220/62 ,  A63B2220/801 ,  A63B2220/806 ,  A63B2220/89 ,  A63B2225/20 ,  A63B2225/50 ,  A63B2243/0025 ,  A63B2243/007

摘要： Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.

公开(公告)号：US20160044833A1

公开(公告)日：2016-02-11

申请号：US14455337

申请日：2014-08-08

申请人： Intel Corporation

发明人： Shankar Krishnan ,  Eric D. McAfee ,  Tod A. Byquist

IPC分类号： H05K7/20

CPC分类号： H05K7/20818 ,  H05K7/203

摘要： Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及浸入式冷却的技术和配置。 在实施例中，配置用于浸没冷却的装置可以包括多个托盘和流体循环系统。 托盘的数量可以被配置为保持一个或多个电路板，并且可以具有第一开口以允许电介质流体被注入到托盘中，以及第二开口以允许电介质流体逸出。 流体循环系统可以包括收集从多个托盘逸出的电介质流体的集水区域和与集水区域联接的分配歧管，以将收集在集水区域中的介电流体输送回多个托盘。 可以描述和/或要求保护其他实施例。