知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

5 records (took 0.026 seconds)

    Fastening techniques for electronic devices
    1.
    发明授权
    Fastening techniques for electronic devices 有权
    紧固技术的电子设备

    公开(公告)号：US09086852B2

    公开(公告)日：2015-07-21

    申请号：US13725705

    申请日：2012-12-21

    Applicant: Intel Corporation

    Inventor： Patrick S. Johnson ,  Robert R. Atkinson, Jr. ,  Tod A. Byquist ,  Ben M. Broili

    IPC: G06F1/16

    CPC classification number: G06F1/1662 ,  Y10T29/49002 ,  Y10T29/49948

    Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

    Abstract translation: 包括紧固特征的计算设备。 计算设备可以包括上壳体，其包括从上壳体突出的上凸台，上凸台限定空腔。 计算设备可以包括下壳体，其包括从下壳体突出的下凸台。 计算设备可以包括螺纹插入件，其包括容纳在上凸台的空腔处的插入部分。 螺纹插入件可以包括比插入部分更宽的凸缘部分和横向移动减少特征。 计算设备可以包括通过下凸台接收并通过螺纹插入件的紧固件，以将上壳体和下壳体彼此紧固。

    RECIRCULATING DIELECTRIC FLUID COOLING
    2.
    发明申请
    RECIRCULATING DIELECTRIC FLUID COOLING 有权
    再生电介质流体冷却

    公开(公告)号：US20160044833A1

    公开(公告)日：2016-02-11

    申请号：US14455337

    申请日：2014-08-08

    Applicant: Intel Corporation

    Inventor： Shankar Krishnan ,  Eric D. McAfee ,  Tod A. Byquist

    IPC: H05K7/20

    CPC classification number: H05K7/20818 ,  H05K7/203

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及浸入式冷却的技术和配置。 在实施例中，配置用于浸没冷却的装置可以包括多个托盘和流体循环系统。 托盘的数量可以被配置为保持一个或多个电路板，并且可以具有第一开口以允许电介质流体被注入到托盘中，以及第二开口以允许电介质流体逸出。 流体循环系统可以包括收集从多个托盘逸出的电介质流体的集水区域和与集水区域联接的分配歧管，以将收集在集水区域中的介电流体输送回多个托盘。 可以描述和/或要求保护其他实施例。

    HINGE ASSEMBLY
    3.
    发明申请
    HINGE ASSEMBLY 有权
    铰链装配

    公开(公告)号：US20150227174A1

    公开(公告)日：2015-08-13

    申请号：US14126285

    申请日：2013-07-30

    Applicant: INTEL CORPORATION

    Inventor： Tod A. Byquist ,  Peter Bristol ,  Michael S. Brazel ,  Kristin L. Weihl ,  Stella Latscha ,  Alexander D. Williams ,  Nicolas Kurczewski ,  Barry T. Dale ,  Robert R. Atkinson, JR. ,  Stephen J. Allen ,  Patrick S. Johnson

    IPC: G06F1/16 ,  E05D11/08

    CPC classification number: G06F1/1681 ,  E05D11/08 ,  G06F1/1618 ,  G06F1/162 ,  G06F1/1679 ,  Y10T16/5403

    Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

    Abstract translation: 在一个实施例中，用于电子设备的底架包括第一部分和第二部分以及将底盘的第一部分连接到用于电子设备的底盘的第二部分的组件，包括第一铰链组件，其被联接到第一部分 用于电子设备的底架的一部分，第二铰链组件，用于联接到用于电子设备的底盘的第二部分;第一刚性连接构件，其联接到第一铰链组件和第二铰链组件;第一电阻 以在所述第一铰链组件和所述第一刚性连接构件的第一端之间提供第一旋转阻力，以及在所述第二铰链组件和所述第一刚性连接构件的第二端之间提供第二旋转阻力的第一阻力元件。 可以描述其他实施例。

    Recirculating dielectric fluid cooling
    5.
    发明授权
    Recirculating dielectric fluid cooling 有权
    循环介质流体冷却

    公开(公告)号：US09433132B2

    公开(公告)日：2016-08-30

    申请号：US14455337

    申请日：2014-08-08

    Applicant: Intel Corporation

    Inventor： Shankar Krishnan ,  Eric D. McAfee ,  Tod A. Byquist

    IPC: H05K7/20 ,  H01L23/473

    CPC classification number: H05K7/20818 ,  H05K7/203

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及浸入式冷却的技术和配置。 在实施例中，配置用于浸没冷却的装置可以包括多个托盘和流体循环系统。 托盘的数量可以被配置为保持一个或多个电路板，并且可以具有第一开口以允许电介质流体被注入到托盘中，以及第二开口以允许电介质流体逸出。 流体循环系统可以包括收集从多个托盘逸出的介电流体的集水区域和与集水区域联接的分配歧管，以将收集在集水区域中的介电流体输送回多个托盘。 可以描述和/或要求保护其他实施例。

Patent Agency Ranking