公开(公告)号：US12133357B2

公开(公告)日：2024-10-29

申请号：US17123760

申请日：2020-12-16

申请人： Intel Corporation

发明人： Jin Yang ,  David Shia ,  Mohanraj Prabhugoud ,  Olaotan Elenitoba-Johnson ,  Craig Jahne ,  Phil Geng

IPC分类号： H05K7/20

CPC分类号： H05K7/20254 ,  H05K7/20418 ,  H05K7/20509

摘要： Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US20230137684A1

公开(公告)日：2023-05-04

申请号：US17517348

申请日：2021-11-02

申请人： Intel Corporation

发明人： Jin Yang ,  David Shia ,  Jimmy Chuang

IPC分类号： H01L23/427 ,  H01L23/373

摘要： A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation assembly thermally coupled to at least one integrated circuit device, wherein the heat dissipation assembly includes a heat dissipation device having a boiling enhancement structure attached thereto with a chemically soluble adhesive material; and a thermal interface material between the boiling enhancement structure and the heat dissipation device. Utilizing a chemically soluble adhesive material allows for the boiling enhancement structure to be removed by dissolving the adhesive material, thus allowing for testing, rework, and/or replacement.

公开(公告)号：US12094800B2

公开(公告)日：2024-09-17

申请号：US16721809

申请日：2019-12-19

申请人： Intel Corporation

发明人： Zhimin Wan ,  Jin Yang ,  Chia-Pin Chiu ,  Peng Li ,  Deepak Goyal

IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/373 ,  H01L23/538

CPC分类号： H01L23/3675 ,  H01L23/3121 ,  H01L23/3185 ,  H01L25/0652 ,  H01L25/18 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/538 ,  H01L24/32 ,  H01L2224/32225

摘要： Embodiments include semiconductor packages. A semiconductor package includes first and second bottom dies on a package substrate, first top dies on the first bottom die, and second top dies on the second bottom die. The semiconductor package includes thermally conductive slugs on the first bottom die and the second bottom die. The thermally conductive slugs are comprised of a high thermal conductive material. The thermally conductive slugs are positioned directly on outer edges of top surfaces of the first and second bottom dies, inner edges of the top surfaces of the first and second bottom dies, and/or a top surface of the package substrate. The high thermal conductive material of the thermally conductive slugs is comprised of copper, silver, boron nitride, or graphene. The thermally conductive slugs may have two different thicknesses. The semiconductor package may include an active die and/or an integrated heat spreader with the pedestals.

公开(公告)号：US20210216121A1

公开(公告)日：2021-07-15

申请号：US17214230

申请日：2021-03-26

申请人： Intel Corporation

发明人： Kristin L. Weldon ,  David Rodriguez ,  Jin Yang ,  David Shia ,  Jimmy Chuang ,  Mohanraj Prabhugoud ,  Mark Edmund Sprenger

IPC分类号： G06F1/20 ,  H05K7/20

摘要： Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

公开(公告)号：US20190101569A1

公开(公告)日：2019-04-04

申请号：US15720742

申请日：2017-09-29

申请人： Intel Corporation

发明人： Todd Albertson ,  Jin Yang ,  Donald E. Edenfeld

IPC分类号： G01R1/067 ,  G01R31/26

摘要： Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

公开(公告)号：US20160299174A1

公开(公告)日：2016-10-13

申请号：US14683742

申请日：2015-04-10

申请人： INTEL CORPORATION

发明人： Jin Pan ,  Jin Yang ,  Erkan Acar

IPC分类号： G01R1/073 ,  G01R3/00 ,  G01R1/04

CPC分类号： G01R3/00 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889

摘要： A microelectronic test device comprising an organic substrate, a probe holder, and an interposer disposed between the organic substrate and the probe holder, wherein the interposer has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the organic substrate. The interposer may effectively decouple the organic substrate from probes in the probe holder, which may substantially reduce or eliminate probe misalignment due to the coefficient of thermal expansion mismatch between the organic substrate and other components of the microelectronic test device and to provide require stiffness to the organic substrate.

摘要翻译： 一种微电子测试装置，包括有机衬底，探针保持器和设置在有机衬底和探针支架之间的插入器，其中插入器的热膨胀系数小于有机衬底的热膨胀系数。 插入器可以有效地将有机衬底与探针保持器中的探针分离，这可以由于有机衬底和微电子测试装置的其它部件之间的热膨胀失配系数而大大减少或消除探针不对准，并且为 有机底物。

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

申请人： Intel Corporation

发明人： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC分类号： H05K7/20

CPC分类号： H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

摘要： Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20230170327A1

公开(公告)日：2023-06-01

申请号：US17538603

申请日：2021-11-30

申请人： Intel Corporation

发明人： Jin Yang ,  David Shia ,  Adel A. Elsherbini ,  Christopher M. Pelto ,  Kimin Jun ,  Bradley A. Jackson ,  Robert J. Munoz ,  Shawna M. Liff ,  Johanna M. Swan

IPC分类号： H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L25/0652 ,  H01L2225/06517 ,  H01L24/08

摘要： A microelectronic assembly is provided, comprising: a first IC die coupled to a surface with first interconnects having a first pitch; and a second IC die coupled to the surface with second interconnects having a second pitch. The second pitch is greater than the first pitch, and the first pitch is less than 10 micrometers. In another embodiment, a microelectronic assembly is provided, comprising: a first stack coupled to a surface, the first stack comprising a first number of IC dies; and a second stack coupled to the surface, the second stack comprising a second number of IC dies, in which: the first stack and the second stack are laterally surrounded by a dielectric, the first stack and the second stack have a same thickness, and the first number is less than the second number.

公开(公告)号：US20180113794A1

公开(公告)日：2018-04-26

申请号：US15569331

申请日：2015-06-10

申请人： Intel Corporation

发明人： Jin Yang ,  Junchao Han ,  Zidong Jiang ,  Yongnian Le

IPC分类号： G06F11/36 ,  G06F9/54

CPC分类号： G06F11/3668 ,  G06F8/447 ,  G06F9/54 ,  G06T11/00

摘要： Various systems and methods for analyzing WebGL applications are described herein. A system comprises a recorder service module to intercept a plurality of graphics application programming interface (API) function calls, each of the plurality of graphics API functions calls having an associated execution context; a command translator module to translate the plurality of graphics API functions calls to a set of generic API invocations; a code generator module to generate executable code from the set of generic API invocations; and a replayer service module to test the executable code.

公开(公告)号：US09366482B2

公开(公告)日：2016-06-14

申请号：US13631957

申请日：2012-09-29

申请人： INTEL CORPORATION

发明人： Jin Yang ,  David Shia

IPC分类号： F28D15/02 ,  H01L23/433 ,  H01L23/40 ,  H01L23/427 ,  H01L23/00 ,  F28F13/00

CPC分类号： B23P15/26 ,  B23P2700/09 ,  F28D15/02 ,  F28D15/0241 ,  F28F2013/005 ,  F28F2280/08 ,  H01L23/427 ,  H01L23/4338 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

摘要： Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.

摘要翻译： 描述装配和方法。 一个组件包括第一板和第二板。 组件还包括位于第一板和第二板之间的可调热管，可调热管与第一板和第二板热接触。 在另一方面，多个弹簧可以位于第一板和第二板之间。 描述和要求保护其他实施例。