公开(公告)号：US11894282B2

公开(公告)日：2024-02-06

申请号：US16446538

申请日：2019-06-19

Applicant: Intel Corporation

Inventor： Zhimin Wan ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Chandra Mohan Jha ,  Aravindha R. Antoniswamy ,  Cheng Xu ,  Junnan Zhao ,  Ying Wang

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/053

CPC classification number: H01L23/3675 ,  H01L23/053 ,  H01L23/433 ,  H01L23/49816

Abstract: Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.

公开(公告)号：US11861219B2

公开(公告)日：2024-01-02

申请号：US16712703

申请日：2019-12-12

Applicant: Intel Corporation

Inventor： Peng Li ,  Jawad B. Khan ,  Sanjeev N. Trika

IPC: G06F3/06

CPC classification number: G06F3/0659 ,  G06F3/0614 ,  G06F3/0646 ,  G06F3/0653 ,  G06F3/0656 ,  G06F3/0679

Abstract: Examples herein relate to a storage system that separately handles portions of a write operation that are aligned and misaligned with respect to retrievable segments from a storage device. For misaligned portions, a buffer can be used to store misaligned retrievable segments and update the segments with content provided with the write operation. Aligned portions of content associated with a write request can be written directly to the storage medium or overwrite corresponding retrievable segments present in the buffer. A table or array can track logical block addresses that correspond to content in the buffer or in the storage. Content in the buffer can be kept in the buffer without being backed-up or persisted to the storage until a triggering event occurs such as power loss or low space in the buffer.

公开(公告)号：US11817369B2

公开(公告)日：2023-11-14

申请号：US16435355

申请日：2019-06-07

Applicant: INTEL CORPORATION

Inventor： Bamidele Daniel Falola ,  Susmriti Das Mahapatra ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Amitesh Saha

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0652 ,  H01L24/09 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

公开(公告)号：US11682605B2

公开(公告)日：2023-06-20

申请号：US16423664

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Karthik Visvanathan ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Peng Li

IPC: H01L23/42 ,  H01L23/373 ,  H05K1/18 ,  H01L25/065 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0655 ,  H05K1/18 ,  H01L24/09 ,  H01L24/17 ,  H05K2201/10734

Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.

公开(公告)号：US20210342103A1

公开(公告)日：2021-11-04

申请号：US17234157

申请日：2021-04-19

Applicant: Intel Corporation

Inventor： Jawad Basit Khan ,  Peng Li ,  Sanjeev Trika

IPC: G06F3/06 ,  G06F13/38 ,  G06F9/34

Abstract: In one embodiment, a storage device comprises non-volatile storage media; a controller to receive, from a host, an object definition command that identifies a first data object and a second data object and a transformation to apply to the first data object and the second data object to generate a first transformed object and store the first transformed object in the non-volatile storage media; and a transformation engine to apply the transformation to the first data object and the second data object.

公开(公告)号：US10970207B2

公开(公告)日：2021-04-06

申请号：US16585892

申请日：2019-09-27

Applicant: Intel Corporation

Inventor： Peng Li ,  Jawad B. Khan ,  Sanjeev N. Trika

IPC: G06F12/06 ,  G11C7/10 ,  G05B19/045

Abstract: An embodiment of a semiconductor package apparatus may include technology to provide a first interface between a first storage device and a host device, and provide a second interface directly between the first storage device and a second storage device. Other embodiments are disclosed and claimed.

公开(公告)号：US10908825B2

公开(公告)日：2021-02-02

申请号：US15939432

申请日：2018-03-29

Applicant: Intel Corporation

Inventor： Peng Li ,  Sanjeev Trika ,  Jawad Khan ,  Myron Loewen

IPC: G06F3/06 ,  G06F1/26 ,  G06F1/30 ,  G06F12/0868

Abstract: An embodiment of a semiconductor apparatus may include technology to determine a persistent region and a non-persistent region of a volatile media based on an amount of power available from one or more backup power sources, and periodically backup only the non-persistent region of the volatile media to a non-volatile media. Other embodiments are disclosed and claimed.

公开(公告)号：US20210013117A1

公开(公告)日：2021-01-14

申请号：US16504698

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US10678768B2

公开(公告)日：2020-06-09

申请号：US15639651

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Peng Li ,  Sanjeev Trika

IPC: G06F16/22

Abstract: Systems, apparatuses and methods may store data. A system may include a processor communicatively coupled to an indexing structure and a datastore log separate from the indexing structure. The indexing structure may store key data corresponding to a key of a key-value pair and an address for the key-value pair. The datastore log may store the key-value pair at the address in a logical band of a plurality of independent logical bands. In addition, the system may include a memory device coupled to the processor. The memory device may include instructions, which when executed by the processor, may cause the system to execute an operation involving the key-value pair.

公开(公告)号：US10592408B2

公开(公告)日：2020-03-17

申请号：US15703907

申请日：2017-09-13

Applicant: INTEL CORPORATION

Inventor： Peng Li ,  Sanjeev N. Trika

IPC: G06F12/02 ,  H04L29/08 ,  G11C16/34 ,  G11C13/00

Abstract: Provided are an apparatus, computer program product, system, and method for managing multiple regions of a non-volatile memory device. A first group of logical bands is assigned to a first memory region in which metadata will be stored and a second group of logical bands is assigned to a second memory region to which host data is written, wherein the second group of logical bands is larger than the first group of logical bands. Physical bands are mapped to the first number of logical bands and the second number of logical bands. Indication is returned to the host system of the first and second groups of logical bands assigned to the first and second memory regions, respectively. The host system directs requests for metadata to logical addresses in the first group of logical bands and directs request for file data to logical addresses in the second group of logical bands.