公开(公告)号：US11791237B2

公开(公告)日：2023-10-17

申请号：US16019899

申请日：2018-06-27

申请人： Intel Corporation

发明人： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L24/29

摘要： Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

公开(公告)号：US20210013117A1

公开(公告)日：2021-01-14

申请号：US16504698

申请日：2019-07-08

申请人： Intel Corporation

发明人： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48

摘要： Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US20170176173A1

公开(公告)日：2017-06-22

申请号：US14973131

申请日：2015-12-17

申请人： Intel Corporation

发明人： Yanmei Song ,  Yongmei Liu ,  Deepak Goyal ,  Donglai David Lu ,  Marcel A. Wall

IPC分类号： G01B11/06

CPC分类号： G01B11/065

摘要： Described herein are devices and techniques for measuring a thickness of a surface layer. A device can include a detector, a processor, and a memory. The detector can be arranged to receive reflected light from a surface of a sample. The processor can be in electrical communication with the detector. The memory can store instructions that, when executed by the processor, can cause the processor to perform operations. The operations can include receiving optical data from the detector, determining a polarization change of the reflected light, the polarization change being a function of the optical data, and determining a thickness of the surface layer using the polarization change and the wavelength of the incident light. The optical data can include information regarding the phase difference of the reflected light and the incident light. Also described are other embodiments.

公开(公告)号：US11798861B2

公开(公告)日：2023-10-24

申请号：US16504698

申请日：2019-07-08

申请人： Intel Corporation

发明人： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC分类号： H01L23/34 ,  H01L21/48 ,  H01L23/433 ,  H01L23/367

CPC分类号： H01L23/345 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/433

摘要： Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US20200006192A1

公开(公告)日：2020-01-02

申请号：US16019899

申请日：2018-06-27

申请人： Intel Corporation

发明人： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC分类号： H01L23/42 ,  H01L23/373 ,  H01L23/367

摘要： Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.