公开(公告)号：US12062592B2

公开(公告)日：2024-08-13

申请号：US16419827

申请日：2019-05-22

申请人： Intel Corporation

发明人： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC分类号： H01L23/42 ,  H01L23/373 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

CPC分类号： H01L23/42 ,  H01L23/3736 ,  H01L23/538 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/16157 ,  H01L2224/16227

摘要： Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US11935799B2

公开(公告)日：2024-03-19

申请号：US16451973

申请日：2019-06-25

申请人： Intel Corporation

发明人： Elah Bozorg-Grayeli ,  Taylor William Gaines ,  Frederick W. Atadana ,  Sergio Antonio Chan Arguedas ,  Robert F. Cheney

IPC分类号： H01L23/06 ,  H01L23/053 ,  H01L23/498 ,  H01L23/367 ,  H01L23/42 ,  H01L25/065

CPC分类号： H01L23/06 ,  H01L23/053 ,  H01L23/49816 ,  H01L23/3672 ,  H01L23/42 ,  H01L25/0655

摘要： Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

公开(公告)号：US20200381332A1

公开(公告)日：2020-12-03

申请号：US16423700

申请日：2019-05-28

申请人： Intel Corporation

发明人： Amitesh Saha ,  Sergio Antonio Chan Arguedas ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Peng Li

IPC分类号： H01L23/373 ,  H01L23/367

摘要： Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.

公开(公告)号：US11791237B2

公开(公告)日：2023-10-17

申请号：US16019899

申请日：2018-06-27

申请人： Intel Corporation

发明人： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L24/29

摘要： Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

公开(公告)号：US11735552B2

公开(公告)日：2023-08-22

申请号：US16451754

申请日：2019-06-25

申请人： Intel Corporation

发明人： Debendra Mallik ,  Sergio Antonio Chan Arguedas ,  Jimin Yao ,  Chandra Mohan Jha

IPC分类号： H01L23/00 ,  H01L23/16 ,  H01L23/367

CPC分类号： H01L24/17 ,  H01L23/16 ,  H01L23/3675 ,  H01L23/562 ,  H01L2224/1713 ,  H01L2224/17051 ,  H01L2224/17163 ,  H01L2224/17181 ,  H01L2224/17519

摘要： Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.

公开(公告)号：US20210407884A1

公开(公告)日：2021-12-30

申请号：US16912432

申请日：2020-06-25

申请人： Intel Corporation

发明人： Feras Eid ,  Xavier Brun ,  Paul Diglio ,  Joe Walczyk ,  Sergio Antonio Chan Arguedas

IPC分类号： H01L23/373 ,  B33Y80/00 ,  B33Y70/00

摘要： An integrated circuit assembly may be fabricated to include an integrated circuit device having a backside surface and a backside metallization layer on the backside surface of the integrated circuit device, wherein the backside metallization layer comprises a bond layer on the backside surface of the integrated circuit device, a high thermal conductivity layer on the bond layer, and a cap layer on the high thermal conductivity layer. The bond layer may be a layered stack comprising an adhesion promotion layer on the backside of the integrated circuit device and at one least metal layer. The high thermal conductivity layer may be an additively deposited material having a thermal conductivity greater than silicon, such as copper, silver, aluminum, diamond, silicon carbide, boron nitride, aluminum nitride, and combinations thereof.

公开(公告)号：US20240222288A1

公开(公告)日：2024-07-04

申请号：US18090140

申请日：2022-12-28

申请人： Intel Corporation

发明人： David Shia ,  Timothy Gosselin ,  Aravindha Antoniswamy ,  Sergio Antonio Chan Arguedas ,  Elah Bozorg-Grayeli ,  Johnny Cook, JR. ,  Steven Klein ,  Rick Canham

IPC分类号： H01L23/544 ,  H01L23/00 ,  H01L23/427 ,  H01L23/49

CPC分类号： H01L23/544 ,  H01L23/427 ,  H01L23/49 ,  H01L24/08 ,  H01L24/48 ,  H01L2224/08113 ,  H01L2224/48229 ,  H01L2924/15165 ,  H01L2924/1711 ,  H01L2924/173 ,  H01L2924/17724 ,  H01L2924/1776

摘要： Integrated circuit (IC) device substrates and structures for mating and aligning with sockets. An IC device may include a frame on and around a substrate, which may include glass or silicon. The frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. A heat spreader may be coupled to an IC die and extend beyond the substrate or be coupled to the frame. The heat spreader may include a heat pipe. The IC device may be part of an IC system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.

公开(公告)号：US11798861B2

公开(公告)日：2023-10-24

申请号：US16504698

申请日：2019-07-08

申请人： Intel Corporation

发明人： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC分类号： H01L23/34 ,  H01L21/48 ,  H01L23/433 ,  H01L23/367

CPC分类号： H01L23/345 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/433

摘要： Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US20210028084A1

公开(公告)日：2021-01-28

申请号：US16518643

申请日：2019-07-22

申请人： Intel Corporation

发明人： Sergio Antonio Chan Arguedas ,  Edvin Cetegen ,  Baris Bicen ,  Aravindha R. Antoniswamy

IPC分类号： H01L23/367 ,  H01L23/00

摘要： Embodiments may relate to a microelectronic package that includes a die, a thermal interface material (TIM) coupled with the die, and an integrated heat spreader (IHS) coupled with the TIM. The IHS may include a feature with a non-uniform cross-sectional profile that includes a thin point and a thick point as measured in a direction perpendicular to a face of the die to which the TIM is coupled. Other embodiments may be described or claimed.

公开(公告)号：US20200381334A1

公开(公告)日：2020-12-03

申请号：US16423664

申请日：2019-05-28

申请人： Intel Corporation

发明人： Karthik Visvanathan ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Peng Li

IPC分类号： H01L23/42 ,  H01L23/373 ,  H05K1/18 ,  H01L25/065 ,  H01L23/522

摘要： Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.