公开(公告)号：US20240222288A1

公开(公告)日：2024-07-04

申请号：US18090140

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： David Shia ,  Timothy Gosselin ,  Aravindha Antoniswamy ,  Sergio Antonio Chan Arguedas ,  Elah Bozorg-Grayeli ,  Johnny Cook, JR. ,  Steven Klein ,  Rick Canham

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/427 ,  H01L23/49

CPC classification number: H01L23/544 ,  H01L23/427 ,  H01L23/49 ,  H01L24/08 ,  H01L24/48 ,  H01L2224/08113 ,  H01L2224/48229 ,  H01L2924/15165 ,  H01L2924/1711 ,  H01L2924/173 ,  H01L2924/17724 ,  H01L2924/1776

Abstract: Integrated circuit (IC) device substrates and structures for mating and aligning with sockets. An IC device may include a frame on and around a substrate, which may include glass or silicon. The frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. A heat spreader may be coupled to an IC die and extend beyond the substrate or be coupled to the frame. The heat spreader may include a heat pipe. The IC device may be part of an IC system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.