公开(公告)号：US11670569B2

公开(公告)日：2023-06-06

申请号：US16437872

申请日：2019-06-11

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Peng Li ,  Bamidele Daniel Falola

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are channeled lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a die between a lid and a package substrate. A bottom surface of the lid may include a channel that at least partially overlaps the die.

公开(公告)号：US12166004B2

公开(公告)日：2024-12-10

申请号：US16406593

申请日：2019-05-08

Applicant: Intel Corporation

Inventor： Susmriti Das Mahapatra ,  Bamidele Daniel Falola ,  Amitesh Saha ,  Peng Li

IPC: H01L23/00 ,  H01L23/373

Abstract: Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.

公开(公告)号：US11798861B2

公开(公告)日：2023-10-24

申请号：US16504698

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC: H01L23/34 ,  H01L21/48 ,  H01L23/433 ,  H01L23/367

CPC classification number: H01L23/345 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/433

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US20220285288A1

公开(公告)日：2022-09-08

申请号：US17192770

申请日：2021-03-04

Applicant: Intel Corporation

Inventor： Valery Ouvarov-Bancalero ,  John Harper ,  Malavarayan Sankarasubramanian ,  Patrick Nardi ,  Bamidele Daniel Falola ,  Ravi Siddappa ,  James Mertens

IPC: H01L23/00 ,  H01L23/06 ,  H05K7/14

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

公开(公告)号：US11817369B2

公开(公告)日：2023-11-14

申请号：US16435355

申请日：2019-06-07

Applicant: INTEL CORPORATION

Inventor： Bamidele Daniel Falola ,  Susmriti Das Mahapatra ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Amitesh Saha

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0652 ,  H01L24/09 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

公开(公告)号：US20210013117A1

公开(公告)日：2021-01-14

申请号：US16504698

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US12183688B2

公开(公告)日：2024-12-31

申请号：US17192770

申请日：2021-03-04

Applicant: Intel Corporation

Inventor： Valery Ouvarov-Bancalero ,  John Harper ,  Malavarayan Sankarasubramanian ,  Patrick Nardi ,  Bamidele Daniel Falola ,  Ravi Siddappa ,  James Mertens

IPC: H01L23/00 ,  H01L23/06 ,  H05K7/14

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

公开(公告)号：US20210398871A1

公开(公告)日：2021-12-23

申请号：US16905731

申请日：2020-06-18

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sergio Antonio Chan Arguedas ,  Bamidele Daniel Falola

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L21/48

Abstract: A hybrid integrated heat spreader suitable for an integrated circuit (IC) die package. The hybrid integrated heat spreader includes a top sheet material and a sealant interface material located where the heat spreader is to contact an assembly substrate. The sealant interface material may offer greater adhesion to a sealant employed between the interface material and the package substrate. In some examples, the sealant interface material has a greater surface roughness and/or a different composition than a surface of the integrated heat spreader that is in close thermal contact with an IC die through a thermal interface material. With the sealant interface material improving adhesion, the sealant may have a higher bulk modulus, enabling the integrated heat spreader to impart greater stiffness to the IC die package assembly.