公开(公告)号：US12133357B2

公开(公告)日：2024-10-29

申请号：US17123760

申请日：2020-12-16

申请人： Intel Corporation

发明人： Jin Yang ,  David Shia ,  Mohanraj Prabhugoud ,  Olaotan Elenitoba-Johnson ,  Craig Jahne ,  Phil Geng

IPC分类号： H05K7/20

CPC分类号： H05K7/20254 ,  H05K7/20418 ,  H05K7/20509

摘要： Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US11678444B2

公开(公告)日：2023-06-13

申请号：US16726681

申请日：2019-12-24

申请人： Intel Corporation

发明人： Olaotan Elenitoba-Johnson ,  Mark Hemmeyer ,  Mengqi Liu

IPC分类号： H05K5/00 ,  H05K7/20 ,  H05K1/02

CPC分类号： H05K5/006 ,  H05K1/0209 ,  H05K7/20154

摘要： Examples described herein relate to a tool-less manner of forming an assembly with a circuit board carrier enclosure that provide leaf springs that provide a force against a circuit board to maintain a level surface of the circuit board. Multiple leaf springs can be used to apply a desired force to the circuit board. A heat sink can be mounted in the enclosure at a distance from the circuit board. The circuit board with carrier can be inserted without tools into an electrical connection for communications with other devices.