- 专利标题: Cold plate architecture for liquid cooling of devices
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申请号: US17123760申请日: 2020-12-16
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公开(公告)号: US12133357B2公开(公告)日: 2024-10-29
- 发明人: Jin Yang , David Shia , Mohanraj Prabhugoud , Olaotan Elenitoba-Johnson , Craig Jahne , Phil Geng
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Hanley, Flight & Zimmerman, LLC
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.
公开/授权文献
- US20210105911A1 COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES 公开/授权日:2021-04-08
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