Modular thermal energy management designs for data center computing

    公开(公告)号:US11032941B2

    公开(公告)日:2021-06-08

    申请号:US16368341

    申请日:2019-03-28

    申请人: Intel Corporation

    IPC分类号: H05K7/20

    摘要: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.

    Cold plate architecture for liquid cooling of devices

    公开(公告)号:US12133357B2

    公开(公告)日:2024-10-29

    申请号:US17123760

    申请日:2020-12-16

    申请人: Intel Corporation

    IPC分类号: H05K7/20

    摘要: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.