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59 条记录 (耗时 0.025 秒)

    Connector with staggered pin orientation
    1.
    发明授权
    Connector with staggered pin orientation 有权

    公开(公告)号：US12040568B2

    公开(公告)日：2024-07-16

    申请号：US17128803

    申请日：2020-12-21

    申请人： Intel Corporation

    发明人： Xiang Li ,  Konika Ganguly ,  George Vergis

    IPC分类号： H01R13/6461 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24

    CPC分类号： H01R12/7076 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2435

    摘要： Connectors with a staggered pin orientation can reduce crosstalk amongst signal pins. In one example, a connector to couple a card or module to a motherboard includes connector housing and a plurality of pins. Each of the plurality of pins includes two ends including a card or module-facing end to couple with the card or module and a motherboard-facing end to couple with the motherboard. Each of the plurality of pins includes a middle section in the connector housing. One or both of the ends include one or more bends relative to the middle section. The plurality of pins includes alternating signal pins and ground pins, wherein the signal pins having an opposite orientation relative to the ground pins.

    Universal Serial Bus (USB) cable paddle card design for wire termination
    2.
    发明申请
    Universal Serial Bus (USB) cable paddle card design for wire termination 有权

    公开(公告)号：US20220337004A1

    公开(公告)日：2022-10-20

    申请号：US17854436

    申请日：2022-06-30

    申请人： Intel Corporation

    发明人： Xiang Li

    IPC分类号： H01R13/66 ,  H01R24/60

    摘要： Methods and apparatus relating to a Universal Serial Bus (USB) cable paddle card design for wire termination are described. In one embodiment, a cable paddle card includes: a first plug connector pad coupled to a first transmission line; a second plug connector pad coupled to a second transmission line; a third plug connector pad coupled to a third transmission line; and a fourth plug connector pad coupled to a fourth transmission line. The first transmission line and the second transmission line are to transmit signals received from a cable and the third transmission line and the fourth transmission line are to receive signals to be transmitted to the cable. Other embodiments are also claimed and disclosed.

    MEMORY MODULE AND CONNECTOR FORM FACTOR TO REDUCE CROSSTALK
    3.
    发明申请
    MEMORY MODULE AND CONNECTOR FORM FACTOR TO REDUCE CROSSTALK 有权

    公开(公告)号：US20210408704A1

    公开(公告)日：2021-12-30

    申请号：US17470552

    申请日：2021-09-09

    申请人： Intel Corporation

    发明人： Xiang Li ,  George Vergis ,  James McCall ,  Qin Li

    IPC分类号： H01R12/71 ,  H01R12/55 ,  H05K1/18 ,  H01R13/24

    摘要： Systems, apparatuses and methods may provide for a memory module that includes a dynamic random access memory (DRAM), a first plurality of contact pads positioned along a first side of the DRAM, a first plurality of L-shaped contacts, wherein each of the first plurality of L-shaped contacts is soldered to one of the first plurality of contact pads, a second plurality of contact pads positioned along a second side of the DRAM, and a second plurality of L-shaped contacts, wherein each of the second plurality of L-shaped contacts is soldered to one of the second plurality of contact pads.

    Connector with relaxation mechanism for latch
    5.
    发明授权
    Connector with relaxation mechanism for latch 有权

    公开(公告)号：US10790603B2

    公开(公告)日：2020-09-29

    申请号：US16264944

    申请日：2019-02-01

    申请人： Intel Corporation

    发明人： Phil Geng ,  Xiang Li ,  George Vergis ,  Mani Prakash

    IPC分类号： H01R12/70 ,  H01R12/73

    摘要： An embodiment of a connector housing for a circuit board may include a connector body to receive the circuit board, and a relaxation mechanism mechanically coupled to the connector body to relax stress on the connector housing and maintain the circuit board received in the connector body under a load which exceeds a load threshold. Other embodiments are disclosed and claimed.

    Stepped slot connector to enable low height platforms
    7.
    发明授权
    Stepped slot connector to enable low height platforms 有权

    公开(公告)号：US10109941B1

    公开(公告)日：2018-10-23

    申请号：US15640394

    申请日：2017-06-30

    申请人： INTEL CORPORATION

    发明人： Xiang Li ,  George Vergis

    IPC分类号： H01R12/70 ,  H01R12/73 ,  H01R13/66 ,  H01R43/26

    摘要： One embodiment relates to a memory module connector comprising a housing defining a stepped slot configured to accept a memory module. Another embodiment includes a memory module defining a stepped slot configured to accept a memory module, and a memory module comprising a printed circuit board and a plurality of components mounted on the printed circuit board, wherein the wherein the stepped slot in the memory module connector is configured so that at least one of the plurality of components mounted on the printed circuit board is positioned in the stepped slot. Other embodiments are described and claimed.