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    TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY
    3.
    发明申请
    TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY 有权
    与包装装配相关的技术和配置

    公开(公告)号：US20160079150A1

    公开(公告)日：2016-03-17

    申请号：US14484896

    申请日：2014-09-12

    Applicant: Intel Corporation

    Inventor： Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Michael Garcia ,  Kuang C. Liu ,  Rajasekaran Swaminathan

    IPC: H01L23/498 ,  H01L23/36 ,  H01L21/48 ,  B23P15/26

    CPC classification number: H05K7/20 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

    Abstract translation: 本公开的实施例涉及与封装负载组件相关联的技术和配置。 在一个实施例中，包装负载组件可以包括框架，该框架被配置为围绕包装衬底的管芯区域形成周边，该封装衬底具有构造成与封装衬底的表面耦合的第一表面和与第一表面相对设置的第二表面 。 框架可以包括设置在第二表面上的可变形构件，其可以被配置为与散热器的底座相耦合，以经由框架分布施加在散热器和封装衬底之间的力，并且可以在应用 力，其可以允许散热器的底部接触在封装衬底的管芯区域内的集成散热器的表面。

    Interconnect cable with edge finger connector
    4.
    发明授权
    Interconnect cable with edge finger connector 有权
    互连电缆与边缘指接头

    公开(公告)号：US09118151B2

    公开(公告)日：2015-08-25

    申请号：US13870938

    申请日：2013-04-25

    Applicant: Intel Corporation

    Inventor： Donald T. Tran ,  Rajasekaran Swaminathan

    IPC: H01R12/00 ,  H01R12/71 ,  H01R12/81 ,  H01R13/6592

    CPC classification number: H01R12/721 ,  H01R12/714 ,  H01R12/81 ,  H01R13/6581 ,  H01R13/6592 ,  H01R43/205 ,  Y10T29/49174 ,  Y10T29/49176

    Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

    Abstract translation: 本公开的实施例涉及包括边缘指状连接器以及相关联的配置和方法的互连电缆。 边缘指状连接器可以设置在互连电缆的第一端处，并且可以将互连电缆连接到包括在封装衬底中或耦合到封装衬底的边缘指状物。 封装衬底可以包括在处理器封装组件中，并且处理器可以安装在衬底上。 互连电缆可以包括一个或多个细长导体，其中触点直接耦合到相应的导体。 第二连接器可以设置在互连电缆的第二端处，并且可以将互连电缆耦合到被配置为将互连电缆连接到SFP电缆的小型可插拔（SFP）壳体。 可以描述和要求保护其他实施例。

    CHIP WITH MAGNETIC INTERCONNECT ALIGNMENT
    6.
    发明申请
    CHIP WITH MAGNETIC INTERCONNECT ALIGNMENT 有权

    公开(公告)号：US20210066240A1

    公开(公告)日：2021-03-04

    申请号：US16644762

    申请日：2017-09-29

    Applicant: Intel Corporation

    Inventor： Rajasekaran Swaminathan

    IPC: H01L23/00 ,  H01L23/498

    Abstract: An electronic assembly, and a method for making the electronic assembly, includes a first electronic component, a second electronic component, and a plurality of interconnects. The plurality of interconnects electrically couple the first electronic component to the second electronic component. Each of the plurality of interconnects comprise one of a plurality of first magnetic components in physical alignment with an associated one of a plurality of second magnetic components, the plurality of second magnetic components being components of one of the second electronic component and the plurality of interconnects.

    Snap connector for socket assembly and associated techniques and configurations
    9.
    发明授权
    Snap connector for socket assembly and associated techniques and configurations 有权
    用于插座组件和相关技术和配置的卡口连接器

    公开(公告)号：US09478881B2

    公开(公告)日：2016-10-25

    申请号：US14642078

    申请日：2015-03-09

    Applicant: Intel Corporation

    Inventor： Zhichao Zhang ,  Gaurav Chawla ,  Rajasekaran Swaminathan ,  Kemal Aygun ,  Li Sun

    IPC: H01R13/193 ,  H01R12/51 ,  H01R12/70 ,  H01R43/20

    CPC classification number: H01R12/7076 ,  H01R43/205 ,  H05K7/1038

    Abstract: Embodiments of the present disclosure are directed towards a snap connector for socket assembly and associated techniques and configurations. In one embodiment, a socket assembly includes a socket body having a plurality of openings extending from a first side of the socket body to a second side of the socket body to provide an electrical pathway between the first side and the second side, the second side disposed opposite to the first side, wherein a holding portion of an individual opening of the plurality of openings adjacent to the first side of the socket body is shaped to hold a corresponding electrical contact of a die package by elastic force applied by the socket body to the electrical contact when the electrical contact is positioned within the holding portion. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及用于插座组件和相关技术和配置的卡扣连接器。 在一个实施例中，插座组件包括插座主体，该插座主体具有从插座本体的第一侧延伸到插座主体的第二侧的多个开口，以在第一侧和第二侧之间提供电路径，第二侧 与所述第一侧相对设置，其中所述多个开口的与所述插座主体的第一侧相邻的开口的保持部分成形为通过由所述插座主体施加的弹力来保持模具组件的对应电接触， 当电触点位于保持部分内时的电接触。 可以描述和/或要求保护其他实施例。

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