Systems, apparatuses and methods may provide for technology including a memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an L-shaped load member extending through an opening in the first lever, a second lever coupled to the L-shaped load member via a second pivot point, and a spring to bias the L-shaped load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading,