公开(公告)号：US08659135B2

公开(公告)日：2014-02-25

申请号：US11572873

申请日：2005-07-21

申请人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vllsmeler ,  Holger Woerner ,  Bernhard Zuhr

发明人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vllsmeler ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/488

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate, which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，其一方面通过布线基板与布线基板的下侧上的外部触点电连接，另一方面与布线基板 接线基板的边缘区域的端子区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。

公开(公告)号：US07700956B2

公开(公告)日：2010-04-20

申请号：US10561819

申请日：2004-06-04

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L27/15

CPC分类号： H04N5/2253 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0411 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H04N5/2254 ,  H04N5/2257

摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

摘要翻译： 公开了用于生产传感器部件和面板。 除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。 它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。

公开(公告)号：US07692283B2

公开(公告)日：2010-04-06

申请号：US11938658

申请日：2007-11-12

申请人： Michael Bauer ,  Holger Woerner ,  Simon Jerebic

发明人： Michael Bauer ,  Holger Woerner ,  Simon Jerebic

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.

摘要翻译： 公开了一种包括半导体芯片的壳体的装置。 一个实施例提供多个引线。 第一引线在第一壳体侧形成外部接触元件，并且在第一壳体侧沿相反的第二壳体侧的方向延伸到壳体中。 壳体内的第一引线的长度大于第一和第二壳体侧之间的距离的一半。

公开(公告)号：US07638418B2

公开(公告)日：2009-12-29

申请号：US11676869

申请日：2007-02-20

申请人： Michael Bauer ,  Rainer Steiner ,  Holger Woerner

发明人： Michael Bauer ,  Rainer Steiner ,  Holger Woerner

IPC分类号： H01L21/44

CPC分类号： H05K1/111 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/114 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/091 ,  H05K2203/0278 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.

摘要翻译： 半导体部件的布线基板包括：具有布线结构的下侧; 顶部有切口; 布置在所述切口中的橡胶弹性材料; 以及设置在橡胶弹性材料上并且被配置为联接到外部触点的外部接触垫。 制造这种布线基板的方法涉及在生产过程中将橡胶弹性材料垫压入聚合物塑料的前体中。

公开(公告)号：US07622733B2

公开(公告)日：2009-11-24

申请号：US11685005

申请日：2007-03-12

申请人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

发明人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

IPC分类号： H01L35/24 ,  H01L51/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

摘要翻译： 半导体结构包括：载板; 耦合到所述载体板的顶表面的热敏粘合剂，其在所述热敏粘合剂失去其粘合作用的预定的限定温度下可从所述载体板移除; 半导体芯片具有有效的顶表面和后表面，其中活性顶表面包括设置在热敏粘合剂上的接触表面; 以及嵌入半导体芯片的载体板上的塑料嵌入化合物。

公开(公告)号：US07545047B2

公开(公告)日：2009-06-09

申请号：US11593150

申请日：2006-11-06

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

IPC分类号： H01L29/40

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

摘要翻译： 这里描述了具有布线基板作为半导体器件堆叠的堆叠元件的半导体器件。 布线基板包括第一塑料化合物的塑料框架和第二塑料化合物的中心区域。 半导体芯片的后侧和其边缘侧嵌入第二塑料化合物中，半导体器件的有源上侧与第一和第二塑料化合物在共面区域中。

公开(公告)号：US07391103B2

公开(公告)日：2008-06-24

申请号：US10928458

申请日：2004-08-27

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

IPC分类号： H01L23/02

CPC分类号： H01L24/82 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/96 ,  H01L2224/82

摘要： The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

摘要翻译： 本发明涉及一种具有插头触点的电子模块，其具有嵌入塑料组合物中的半导体芯片，其后侧及其边缘侧。 半导体芯片的有源顶侧与塑料组合物一起形成整个顶侧，其上布置有具有插头接触区域的重新布线层和将插头接触区域连接到顶侧的接触区域的重新布线 的半导体芯片。

公开(公告)号：US20060255435A1

公开(公告)日：2006-11-16

申请号：US11388551

申请日：2006-03-24

申请人： Edward Fuergut ,  Holger Woerner

发明人： Edward Fuergut ,  Holger Woerner

IPC分类号： H01L23/495

CPC分类号： B29C45/14655 ,  B29C45/02 ,  H01L21/565 ,  H01L23/16 ,  H01L23/31 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H03H9/10 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One aspect of the invention relates to a method for encapsulating a semiconductor device which has at least one semiconductor chip arranged on a substrate. The method includes application of an elastic dam to the semiconductor chip, introduction of the semiconductor chip arranged on the substrate into a mold including a lower mold half and an upper mold half, closing of the mold so that the elastic dam is completely contacted by an inner surface of the upper mold half, and encapsulation of the semiconductor device with a molding compound.

摘要翻译： 本发明的一个方面涉及一种用于封装半导体器件的方法，该半导体器件具有布置在衬底上的至少一个半导体芯片。 该方法包括向半导体芯片施加弹性坝，将布置在基板上的半导体芯片引入包括下半模和上半模的模具中，关闭模具，使得弹性坝完全接触 上半模的内表面，以及用模塑料封装半导体器件。

公开(公告)号：US20060175419A1

公开(公告)日：2006-08-10

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/06

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

公开(公告)号：US20050098871A1

公开(公告)日：2005-05-12

申请号：US10985051

申请日：2004-11-10

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L21/98 ,  H01L23/498 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/19 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/82 ,  H01L24/86 ,  H01L24/92 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73277 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

摘要翻译： 本发明涉及具有半导体芯片和再布线层的半导体器件，其半导体芯片通过其后侧接触嵌入壳体塑料组合物中。 半导体芯片的有源顶侧与外壳塑料组合物的顶侧形成共面整体顶侧。 后侧接触件通过扁平导体片带被引导到整个顶侧，从而可以从整个顶侧接近半导体芯片的后侧接触。