发明授权
- 专利标题： Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same
- 专利标题（中）： 包括嵌入所述布线基板中的橡胶弹性垫的半导体部件的布线基板及其制造方法
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申请号： US11676869申请日： 2007-02-20
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公开(公告)号： US07638418B2公开(公告)日： 2009-12-29
- 发明人: Michael Bauer , Rainer Steiner , Holger Woerner
- 申请人： Michael Bauer , Rainer Steiner , Holger Woerner
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Edell, Shapiro & Finnan, LLC
- 优先权： DE102004040414 20040819
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.
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