发明授权
US07692283B2 Device including a housing for a semiconductor chip including leads extending into the housing
有权
装置包括用于半导体芯片的壳体，其包括延伸到壳体中的引线
- 专利标题： Device including a housing for a semiconductor chip including leads extending into the housing
- 专利标题（中）： 装置包括用于半导体芯片的壳体，其包括延伸到壳体中的引线
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申请号： US11938658申请日： 2007-11-12
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公开(公告)号： US07692283B2公开(公告)日： 2010-04-06
- 发明人: Michael Bauer , Holger Woerner , Simon Jerebic
- 申请人： Michael Bauer , Holger Woerner , Simon Jerebic
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 优先权： DE102007050608 20071023
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L23/495
摘要：
A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.
公开/授权文献
- US20090102044A1 DEVICE INCLUDING A HOUSING FOR A SEMICONDUCTOR CHIP 公开/授权日：2009-04-23
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