Abstract:
According to an aspect of the present invention, there is provided a semiconductor IC that includes a plurality of standard cells arranged in a first direction on a semiconductor substrate, and a first diffusion layer connected to a first power source and a second diffusion layer connected to a second power source in the each standard cell, wherein the first diffusion layers as well as the second diffusion layers of neighboring standard cells are integrally formed.
Abstract:
A single evaluation portion is formed by disposing a plurality of MIS transistors used for evaluation having substantially the same structure as that of an actually used MIS transistor. In the evaluation portion, the respective source regions, drain regions, and gate electrodes of the MIS transistors used for evaluation are electrically connected in common to a source pad, a drain pad, and a gate pad, respectively. If the effective gate width of the single evaluation portion exceeds a given value, variations in characteristics evaluated by the evaluation portion approach variations in the characteristics of the entire semiconductor device. The accuracy of evaluating the characteristics of the semiconductor device can thus be improved by using the evaluation portion.
Abstract:
A new test structure to locate bridging defects in a conductive layer of an integrated circuit device is achieved. The test structure comprises a line comprising a conductive layer overlying a substrate. The line is coupled to ground. A plurality of rectangles comprises the conductive layer. The rectangles are not connected to the line or to other rectangles. Near edges of the rectangles and of the line are parallel. The rectangles are floating. The test structure is used with a passive voltage contrast test in a scanning electron microscope. A test structure and method to measure critical dimensions is disclosed.
Abstract:
A semiconductor device implemented using a transistor (Q1) including at least one emitter (E1) and a transistor (Q2) which is larger than the transistor (Q1) including n emitters (E21 to E2n) each having the same area as the emitter (E1) of the transistor (Q1). The emitter (E1) of the transistor (Q1) is disposed between the emitters (E21 to E2n) of the transistor (Q2). When there is deflection of a substrate due to a stress to cause distortion in shape of the emitters, the emitter (E1) has much less distortion in shape than the emitters located on the end portions of the row region in the longitudinal direction. Since the transistor (Q2) has a number of emitters, the distortion in shape of the emitters (E21 to E2n) of the transistor (Q2), if any, has little effect on the whole.
Abstract:
A semiconductor-insulator-semiconductor (SIS) structure diode device for providing fast optoelectronic switching with stimulated emission. The device includes a substrate which has a buffer layer disposed on top thereof. An n-type cladding layer is disposed on top of the buffer layer. An undoped i-region is disposed on top of the buffer layer. The i-region includes at least one quantum well disposed between two waveguide layers. A lightly doped p-type cladding layer is disposed on top of the i-region. A contact layer is further disposed on top of the p-type cladding layer. First and second contact terminals are included for providing a two-terminal device. The diode advantageously provides good lasing performance, significant negative differential resistance and strong light sensitivity. In an alternate embodiment, a third terminal is connected to the undoped i-region to thereby form a three terminal device.
Abstract:
Boron is diffused into selected areas of each main face of an N silicon substrate and gallium is diffused into the entire main face to form a P-N junction including deeper portions alternating shallower portion. Selective etching is effected to form grooves in the shallower junction portions for dividing the P-N junction. Both main faces of the substrate except for the grooves are metallized and a passivation layer is applied to each groove. Alternatively, in order to form the P-N junction as above described, gallium is selectively diffused in the substrate followed by a further diffusion of the gallium.
Abstract:
A single evaluation portion is formed by disposing a plurality of MIS transistors used for evaluation having substantially the same structure as that of an actually used MIS transistor. In the evaluation portion, the respective source regions, drain regions, and gate electrodes of the MIS transistors used for evaluation are electrically connected in common to a source pad, a drain pad, and a gate pad, respectively. If the effective gate width of the single evaluation portion exceeds a given value, variations in characteristics evaluated by the evaluation portion approach variations in the characteristics of the entire semiconductor device. The accuracy of evaluating the characteristics of the semiconductor device can thus be improved by using the evaluation portion.
Abstract:
A current reference, which may be fabricated independently, on a die, as part of an integrated circuit, or a system, or in various other forms, is disclosed. The current reference may include a voltage source having a substantially temperature stable output voltage, a first semiconductor device biased by the substantially temperature stable output voltage to provide a first output current, and a second semiconductor device providing a second output current, wherein a reference current is provided approximately equal to the difference between the first and second output currents.
Abstract:
A technique is disclosed which facilitates the layout of op amp cells, for example, two-stage op amp cells or three-stage op amp cells, to provide larger operational amplifiers. In accordance with one aspect, the op amp cells can be suitably coupled in parallel to provide a larger operational amplifier. This paralleling aspect can be facilitated by connecting the respective negative and positive inputs of a predetermined number of input gm stages together, connecting the outputs of a predetermined number of output gm stages together, and connecting a predetermined number of intermediate internal nodes between the input gm stages and the output gm stages together, without the occurrence of saturation of the internal nodes. In addition, the input and output characteristics of operational amplifier can be suitably improved. Further, the plurality of op amp cells can be selectively configurable to be connected in parallel with other op amp cells through the use of, for example, manual switches or other suitable electrical contacts, jumpers and the like, or programmable switches. Moreover, the op amp cells can be suitably configured in various arrangements, such as a two-stage cell having a first gm stage with a single-ended output, a two-stage cell having a first gm stage with a differential output, or a three-stage op amp cell. As a result, the method of the present invention can provide a substantial advantage in the design of integrated circuits in which the development costs are high, and multiple custom mask sets are too expensive to be practical.
Abstract:
A current reference, which may be fabricated on a die, as part of an integrated circuit, or in various other forms, is disclosed. The current reference includes two current sources, both of which provide a substantially temperature stable output current, which may use a differencing circuit to provide a reference output current having a magnitude approximately equal to the difference between the magnitudes of the two substantially temperature stable output currents.