Invention Application
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
-
Application No.: US11902391Application Date: 2007-09-21
-
Publication No.: US20080105929A1Publication Date: 2008-05-08
- Inventor: Masatomo Eimitsu , Takanori Saeki
- Applicant: Masatomo Eimitsu , Takanori Saeki
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Priority: JP2006-301302 20061107
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
According to an aspect of the present invention, there is provided a semiconductor IC that includes a plurality of standard cells arranged in a first direction on a semiconductor substrate, and a first diffusion layer connected to a first power source and a second diffusion layer connected to a second power source in the each standard cell, wherein the first diffusion layers as well as the second diffusion layers of neighboring standard cells are integrally formed.
Public/Granted literature
- US08039874B2 Semiconductor integrated circuit Public/Granted day:2011-10-18
Information query
IPC分类: