Abstract:
A single evaluation portion is formed by disposing a plurality of MIS transistors used for evaluation having substantially the same structure as that of an actually used MIS transistor. In the evaluation portion, the respective source regions, drain regions, and gate electrodes of the MIS transistors used for evaluation are electrically connected in common to a source pad, a drain pad, and a gate pad, respectively. If the effective gate width of the single evaluation portion exceeds a given value, variations in characteristics evaluated by the evaluation portion approach variations in the characteristics of the entire semiconductor device. The accuracy of evaluating the characteristics of the semiconductor device can thus be improved by using the evaluation portion.
Abstract:
A semiconductor device includes a first MIS transistor formed on a first active region, and a second MIS transistor formed on a second active region. The first MIS transistor includes a first gate insulating film, and a first gate electrode including a first metal film and a first silicon film. The second MIS transistor includes a second gate insulating film, and a second gate electrode including the first metal film, a second metal film, and a second silicon film.
Abstract:
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
Abstract:
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
Abstract:
In a MIEET, an impurity which changes a lattice constant is introduced into part of a gate electrode located on an isolation region. A stress which is generated in part of the gate electrode as a starting point and improves the mobility of carries is applied to a channel region with the part of the gate electrode.
Abstract:
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
Abstract:
A first semiconductor region has a smaller width along a gate length direction than a second semiconductor region. In this case, the first semiconductor region has a larger width along a gate width direction than the second semiconductor region.
Abstract:
A first relational expression representing a relationship among gate bias Vd, carrier mobility μ, electric effective channel length Leff and transconductance Gm, and a second relational expression representing a relationship among maximum-transconductance ratio Gmmax L=Lref/Gmmax L=Ltar between a target transistor and a reference transistor and electric effective channel lengths Leff and Lref of the respective transistors are used. Maximum transconductance Gmmax obtained when gate bias Vd is changed is determined and electric effective channel length Leff is estimated by substituting the value of maximum transconductance Gmmax in the second relational expression. The correlation between 1/Gmmax and Lgsem is strong enough to allow maximum transconductance Gmmax to be used in monitoring a process variation of a physical gate length.
Abstract translation:表示栅极偏置V SUB,载流子迁移率μ,电有效沟道长度L eff和跨导G m之间的关系的第一关系表达式,以及 表示目标晶体管和参考晶体管之间的最大跨导比G max max L = L ref / N maxax L = 使用各个晶体管的L eff和L ref ref。 确定当栅极偏压V Sub1变化时获得的最大跨导G SUB>,并且通过将最大值的值代入最大值来估计有效通道长度L eff 第二关系表达式中的跨导G mmax SUB>。 1 / G SUB>和/或L> gsem SUB>之间的相关性足够强,以允许最大跨导G max max用于监测 物理门长度。
Abstract:
In a semiconductor device, a FET and an isolation are provided on a semiconductor substrate and a channel stop region is provided under the isolation. At least a region to which a high voltage is applied of a source region and a drain region of the FET is separated from the channel stop region, and a first buffer region doped with an impurity for adjusting the threshold level is provided therebetween. A region under a gate electrode and adjacent to the isolation serves as a second buffer region to which an impurity for adjusting the threshold level is doped. With the first buffer region, a depletion region at a boundary of the drain region and the channel stop region is ensured, obtaining a superior durability to high voltage of the source/drain region. With the second buffer region, leakage current between the source region and the drain region is prevented.
Abstract:
In a semiconductor device according to the present invention, the power source voltage Vdd1 of a core transistor Tr1, the power source voltage Vdd2 of an I/O transistor Tr2, and the power source voltage Vdd3 of an I/O transistor Tr3 satisfy Vdd1