Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12712890Application Date: 2010-02-25
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Publication No.: US08471341B2Publication Date: 2013-06-25
- Inventor: Yoshihiro Sato , Atsuhiro Kajiya
- Applicant: Yoshihiro Sato , Atsuhiro Kajiya
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-200880 20080804
- Main IPC: H01L27/092
- IPC: H01L27/092

Abstract:
A semiconductor device includes a first MIS transistor formed on a first active region, and a second MIS transistor formed on a second active region. The first MIS transistor includes a first gate insulating film, and a first gate electrode including a first metal film and a first silicon film. The second MIS transistor includes a second gate insulating film, and a second gate electrode including the first metal film, a second metal film, and a second silicon film.
Public/Granted literature
- US20100148275A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-06-17
Information query
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