公开(公告)号：US09875987B2

公开(公告)日：2018-01-23

申请号：US15247393

申请日：2016-08-25

Applicant: Freescale Semiconductor, Inc.

Inventor： Lakshminarayan Viswanathan ,  Jaynal A. Molla

IPC: H01L23/00 ,  H01L29/16 ,  H01L21/48 ,  H01L29/20 ,  H01L23/66 ,  H01L23/48 ,  H01L21/78 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/482 ,  H01L21/683 ,  H01L23/495 ,  H01L21/56

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/4827 ,  H01L23/49513 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/741 ,  H01L24/743 ,  H01L24/92 ,  H01L24/94 ,  H01L29/16 ,  H01L29/2003 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/03312 ,  H01L2224/0332 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05009 ,  H01L2224/05018 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05551 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/05864 ,  H01L2224/05887 ,  H01L2224/0589 ,  H01L2224/05893 ,  H01L2224/27002 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/27505 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29117 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/741 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/1016 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/01015 ,  H01L2924/01048 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2224/03 ,  H01L2224/05099 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2221/68304 ,  H01L21/304 ,  H01L2224/83 ,  H01L2924/0781 ,  H01L2924/00 ,  H01L2224/034 ,  H01L2221/68368 ,  H01L2224/274

Abstract: An electronic device includes a semiconductor die having a lower surface, a sintered metallic layer underlying the lower surface of the semiconductor die, a conductive layer underlying the sintered metallic layer, and a conductive substrate underlying the conductive layer.

公开(公告)号：US20230191747A1

公开(公告)日：2023-06-22

申请号：US18173373

申请日：2023-02-23

Applicant: Immunolight, LLC

Inventor： Zakaryae FATHI ,  Frederic A. BOURKE, JR. ,  Harold WALDER

IPC: B32B7/12 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/06 ,  B32B9/02 ,  B32B9/04 ,  B32B17/00 ,  B32B18/00 ,  B32B21/04 ,  B32B25/04 ,  B32B27/08 ,  B32B27/16 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/00 ,  C09J11/06 ,  C09J133/00 ,  C09J133/06 ,  H01L23/00 ,  C09J7/10

CPC classification number: B32B7/12 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/06 ,  B32B9/025 ,  B32B9/04 ,  B32B9/043 ,  B32B17/00 ,  B32B18/00 ,  B32B21/042 ,  B32B25/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/0008 ,  C09J11/06 ,  C09J133/00 ,  C09J133/06 ,  H01L24/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/83 ,  C09J7/10 ,  B32B2037/1253 ,  B32B2255/26 ,  B32B2305/18 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/3065 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/422 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/548 ,  B32B2307/552 ,  B32B2307/706 ,  B32B2307/72 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2310/0806 ,  B32B2439/00 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2457/14 ,  B32B2479/00 ,  B32B2605/003 ,  B32B2605/08 ,  H01L24/27 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/0383 ,  H01L2224/03831 ,  H01L2224/04026 ,  H01L2224/05791 ,  H01L2224/05887 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27622 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83009 ,  H01L2224/83591 ,  H01L2224/83687 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2224/32258 ,  H01L2924/0569

Abstract: A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

公开(公告)号：US20160365323A1

公开(公告)日：2016-12-15

申请号：US15247393

申请日：2016-08-25

Applicant: Freescale Semiconductor, Inc.

Inventor： Lakshminarayan Viswanathan ,  Jaynal A. Molla

IPC: H01L23/00 ,  H01L29/16 ,  H01L21/48 ,  H01L23/48 ,  H01L23/495 ,  H01L21/78 ,  H01L29/20 ,  H01L23/66

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/4827 ,  H01L23/49513 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/741 ,  H01L24/743 ,  H01L24/92 ,  H01L24/94 ,  H01L29/16 ,  H01L29/2003 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/03312 ,  H01L2224/0332 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05009 ,  H01L2224/05018 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05551 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/05864 ,  H01L2224/05887 ,  H01L2224/0589 ,  H01L2224/05893 ,  H01L2224/27002 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/27505 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29117 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/741 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/1016 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/01015 ,  H01L2924/01048 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2224/03 ,  H01L2224/05099 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2221/68304 ,  H01L21/304 ,  H01L2224/83 ,  H01L2924/0781 ,  H01L2924/00 ,  H01L2224/034 ,  H01L2221/68368 ,  H01L2224/274

Abstract: An electronic device includes a semiconductor die having a lower surface, a sintered metallic layer underlying the lower surface of the semiconductor die, a conductive layer underlying the sintered metallic layer, and a conductive substrate underlying the conductive layer.

Abstract translation: 电子器件包括具有下表面的半导体管芯，位于半导体管芯的下表面下方的烧结金属层，位于烧结金属层下面的导电层，以及导电层下面的导电基底。

公开(公告)号：US20160099199A1

公开(公告)日：2016-04-07

申请号：US14508645

申请日：2014-10-07

Applicant: Lakshminarayan Viswanathan ,  Jaynal A. Molla

Inventor： Lakshminarayan Viswanathan ,  Jaynal A. Molla

IPC: H01L23/495

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4827 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/741 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/03312 ,  H01L2224/0332 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05009 ,  H01L2224/05018 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05551 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/05864 ,  H01L2224/05887 ,  H01L2224/0589 ,  H01L2224/05893 ,  H01L2224/27002 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/27505 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29117 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/741 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83815 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/1016 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/01015 ,  H01L2924/01048 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2224/03 ,  H01L2224/05099 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2221/68304 ,  H01L21/304 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/0781 ,  H01L2924/00 ,  H01L2224/034 ,  H01L2221/68368 ,  H01L2224/274

Abstract: An electronic device includes a semiconductor die having a lower surface, a sintered metallic layer underlying the lower surface of the semiconductor die, a thermally conductive flow layer underlying the sintered metallic layer, and a thermally conductive substrate underlying the thermally conductive flow layer.

Abstract translation: 电子器件包括具有下表面的半导体管芯，位于半导体管芯的下表面下方的烧结金属层，在烧结金属层下面的导热流动层，以及位于导热流动层下面的导热基底。

公开(公告)号：US11648750B2

公开(公告)日：2023-05-16

申请号：US16944877

申请日：2020-07-31

Applicant: IMMUNOLIGHT, LLC

Inventor： Zakaryae Fathi ,  Frederic A. Bourke, Jr. ,  Harold Walder

IPC: B32B7/12 ,  B32B27/16 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/06 ,  B32B9/02 ,  B32B9/04 ,  B32B17/00 ,  B32B18/00 ,  B32B21/04 ,  B32B25/04 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/00 ,  C09J11/06 ,  C09J133/00 ,  C09J133/06 ,  H01L23/00 ,  C09J7/10

CPC classification number: B32B7/12 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/06 ,  B32B9/025 ,  B32B9/04 ,  B32B9/043 ,  B32B17/00 ,  B32B18/00 ,  B32B21/042 ,  B32B25/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/0008 ,  C09J7/10 ,  C09J11/06 ,  C09J133/00 ,  C09J133/06 ,  H01L24/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/83 ,  B32B2037/1253 ,  B32B2255/26 ,  B32B2305/18 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/3065 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/422 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/548 ,  B32B2307/552 ,  B32B2307/706 ,  B32B2307/72 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2310/0806 ,  B32B2439/00 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2457/14 ,  B32B2479/00 ,  B32B2605/003 ,  B32B2605/08 ,  H01L24/27 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/0383 ,  H01L2224/03831 ,  H01L2224/04026 ,  H01L2224/05791 ,  H01L2224/05887 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27622 ,  H01L2224/293 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29083 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32258 ,  H01L2224/83009 ,  H01L2224/83591 ,  H01L2224/83687 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/0569

Abstract: A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

公开(公告)号：US20170154866A1

公开(公告)日：2017-06-01

申请号：US15322928

申请日：2015-06-29

Applicant: IMMUNOLIGHT, LLC

Inventor： Zakaryae FATHI ,  Frederic A. BOURKE ,  Harold WALDER

IPC: H01L23/00 ,  B32B7/06 ,  C09J133/00 ,  B32B38/00 ,  C09J11/06 ,  B32B7/12 ,  B32B37/12

CPC classification number: H01L24/83 ,  B32B5/02 ,  B32B5/18 ,  B32B5/26 ,  B32B7/06 ,  B32B7/12 ,  B32B9/025 ,  B32B9/04 ,  B32B9/043 ,  B32B17/00 ,  B32B18/00 ,  B32B21/042 ,  B32B25/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/0008 ,  B32B2037/1253 ,  B32B2255/26 ,  B32B2305/18 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/21 ,  B32B2307/3065 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2307/422 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/548 ,  B32B2307/552 ,  B32B2307/706 ,  B32B2307/72 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2310/0806 ,  B32B2439/00 ,  B32B2439/70 ,  B32B2439/80 ,  B32B2457/14 ,  B32B2479/00 ,  B32B2605/003 ,  B32B2605/08 ,  C09J11/06 ,  C09J133/00 ,  C09J133/06 ,  H01L24/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/0383 ,  H01L2224/03831 ,  H01L2224/04026 ,  H01L2224/05791 ,  H01L2224/05887 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27622 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83009 ,  H01L2224/83591 ,  H01L2224/83687 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781

Abstract: A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

公开(公告)号：US09589860B2

公开(公告)日：2017-03-07

申请号：US14508645

申请日：2014-10-07

Applicant: Lakshminarayan Viswanathan ,  Jaynal A. Molla

Inventor： Lakshminarayan Viswanathan ,  Jaynal A. Molla

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/36 ,  H01L23/367 ,  H01L23/00 ,  H01L23/482 ,  H01L21/683 ,  H01L23/66 ,  H01L21/56

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4827 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/741 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/03312 ,  H01L2224/0332 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05009 ,  H01L2224/05018 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05551 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/05864 ,  H01L2224/05887 ,  H01L2224/0589 ,  H01L2224/05893 ,  H01L2224/27002 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/27505 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/29017 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29117 ,  H01L2224/29118 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2918 ,  H01L2224/29184 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/296 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/741 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83815 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/1016 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/3512 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/01015 ,  H01L2924/01048 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2224/03 ,  H01L2224/05099 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2221/68304 ,  H01L21/304 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/0781 ,  H01L2924/00 ,  H01L2224/034 ,  H01L2221/68368 ,  H01L2224/274

Abstract: An electronic device includes a semiconductor die having a lower surface, a sintered metallic layer underlying the lower surface of the semiconductor die, a thermally conductive flow layer underlying the sintered metallic layer, and a thermally conductive substrate underlying the thermally conductive flow layer.

Abstract translation: 电子器件包括具有下表面的半导体管芯，位于半导体管芯的下表面下方的烧结金属层，在烧结金属层下面的导热流动层，以及位于导热流动层下面的导热基底。