公开(公告)号：US20080050267A1

公开(公告)日：2008-02-28

申请号：US11664058

申请日：2005-09-28

申请人： Hiroshi Murai ,  Jun Chiba ,  Satoshi Teshima

发明人： Hiroshi Murai ,  Jun Chiba ,  Satoshi Teshima

IPC分类号： C22C5/02

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/85439 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01205 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/01046 ,  H01L2924/01014 ,  H01L2924/01063 ,  H01L2924/01004 ,  H01L2924/01058 ,  H01L2924/01064 ,  H01L2924/01012 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01201 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01066 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01404 ,  H01L2924/01006

摘要： Provided is a thin Au alloy bonding wire having desired strength, good bondability and stability over time, and improved circularity of a squashed ball and sphericity of a melted ball. The Au alloy bonding wire contains, in an Au alloy matrix containing 0.05 to 2 mass % in total of at least one selected from Pd and Pt of high purity in Au of high purity, as trace elements, 10 to 100 ppm by mass of Mg, 5 to 100 ppm by mass of Ce, and 5 to 100 ppm by mass of each of at least one selected from Be, Y, Gd, La, Eu and Si, the total content of Be, Y, Gd, La, Eu and Si being 5 to 100 ppm by mass, or as trace elements, Mg, Be, and at least one selected from Y, La, Eu and Si, or as trace elements, 10 to 100 ppm by mass of Mg, 5 to 30 ppm by mass of Si, 5 to 30 ppm by mass of Be, and 5 to 30 ppm by mass of at least one selected from Ca, Ce and Sn.

摘要翻译： 提供具有期望强度，良好的粘合性和随时间稳定性的薄Au合金接合线，并且改善压扁球的圆形度和熔融球的球形度。 Au合金接合线含有0.05〜2质量％的Au系合金基体，作为微量元素，含有0.05〜2质量％的选自高纯度的Au中的高纯度的Pd和Pt中的至少1种，10〜100质量ppm的Mg ，Ce：5〜100质量ppm，Be，Y，Gd，La，Eu和Si中的至少一种中的至少一种为5〜100质量ppm，Be，Y，Gd，La，Eu的总含量 Si为5〜100质量ppm，作为微量元素，Mg，Be，选自Y，La，Eu，Si中的至少一种，微量元素为10〜100质量ppm，Mg为5〜30 Si为质量ppm，Be为5〜30质量ppm，选自Ca，Ce，Sn中的至少1种为5〜30质量ppm。

公开(公告)号：US09103001B2

公开(公告)日：2015-08-11

申请号：US13496327

申请日：2011-11-01

申请人： Jun Chiba ,  Satoshi Teshima ,  Tasuku Kobayashi ,  Yuki Antoku

发明人： Jun Chiba ,  Satoshi Teshima ,  Tasuku Kobayashi ,  Yuki Antoku

IPC分类号： C22C5/06 ,  B21C37/00 ,  H01L23/49 ,  H01L23/00

CPC分类号： C22C5/06 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/431 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85075 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01046 ,  H01L2924/01039 ,  H01L2924/01064 ,  H01L2924/0106 ,  H01L2924/01062 ,  H01L2924/01004 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/01205 ,  H01L2924/01022 ,  H01L2924/01077 ,  H01L2924/00013

摘要： An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999% or higher, 2-5 mass % of palladium having a purity of 99.99% or higher, and remaining mass % of silver (Ag) having a purity of 99.999% or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.

摘要翻译： 一种用于半导体器件的Ag-Au-Pd三元合金接合线，其由纯度为99.999％以上的纯度为4-10质量％，纯度为99.99％以上的钯为2-5质量％，剩余质量 ％纯度为99.999％以上的银（Ag） 该线材含有15-70质量ppm的氧化性非贵金属元素，并且在连续拉伸模具之前进行热退火，并且在连续拉伸模具之后进行热回火，并且该线材可用于球形粘合 氮气; 在Ag-Au-Pd三元合金线和铝焊盘之间的界面产生的Ag 2 Al和富Pd层抑制了Ag2Al金属间化合物层和电线之间的腐蚀发展。

公开(公告)号：US20120263624A1

公开(公告)日：2012-10-18

申请号：US13496327

申请日：2011-11-01

申请人： Jun Chiba ,  Satoshi Teshima ,  Tasuku Kobayashi ,  Yuki Antoku

发明人： Jun Chiba ,  Satoshi Teshima ,  Tasuku Kobayashi ,  Yuki Antoku

IPC分类号： C22C5/06

CPC分类号： C22C5/06 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/431 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85075 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01046 ,  H01L2924/01039 ,  H01L2924/01064 ,  H01L2924/0106 ,  H01L2924/01062 ,  H01L2924/01004 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/01205 ,  H01L2924/01022 ,  H01L2924/01077 ,  H01L2924/00013

摘要： An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.

摘要翻译： 由纯度为99.999质量％以上的4-10质量％的金，纯度为99.99质量％以上的钯的2-5质量％的半导体装置用Ag-Au-Pd三元合金接合线，以及 纯度为99.999质量％以上的银（Ag）的剩余质量％ 该线材含有15-70质量ppm的氧化性非贵金属元素，并且在连续拉伸模具之前进行热退火，并且在连续拉伸模具之后进行热回火，并且该线材可用于球形粘合 氮气; 在Ag-Au-Pd三元合金线和铝焊盘之间的界面产生的Ag 2 Al和富Pd层抑制了Ag2Al金属间化合物层和电线之间的腐蚀发展。

公开(公告)号：US20100171222A1

公开(公告)日：2010-07-08

申请号：US12297263

申请日：2008-03-26

申请人： Hiroshi Murai ,  Jun Chiba ,  Fujio Amada

发明人： Hiroshi Murai ,  Jun Chiba ,  Fujio Amada

IPC分类号： H01L23/49 ,  H01B5/00

CPC分类号： C22C5/02 ,  B23K35/0227 ,  B23K35/3013 ,  B23K2101/36 ,  B23K2103/10 ,  H01L24/02 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/4845 ,  H01L2224/48624 ,  H01L2224/85201 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20656 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

摘要： [Issues to be Solved] Providing enhanced bonding reliability of Au alloy bonding wire with low electrical resistivity to Al electrode of semiconductor device, and its application of semiconductor device is bonded with Al electrode pad by the same wire.[Solution Means] Au alloy bonding wire comprising: 0.02-0.3 mass % Ag, total amount of 10-200 mass ppm at least one element of Ge and/or Si, and/or total amount of 10-200 mass ppm at least one element of Al and/or Cu, with residual of Au. Moreover, Al and/or Al alloy pad bonded with the above Au alloy bonding wire.

摘要翻译： [待解决的问题]提供具有低电阻率的Au合金接合线对于半导体器件的Al电极的增强的接合可靠性，并且通过相同的导线将其半导体器件的应用与Al电极焊盘接合。 [解决方案] Au合金接合线包括：0.02-0.3质量％Ag，总量为10-200质量ppm的至少一种Ge和/或Si元素和/或总量为10-200质量ppm的至少一种 Al和/或Cu的元素，残余的Au。 此外，与上述Au合金接合线接合的Al和/或Al合金垫。

公开(公告)号：US20110058979A1

公开(公告)日：2011-03-10

申请号：US12740588

申请日：2008-09-11

申请人： Hiroshi Murai ,  Jun Chiba ,  Fujio Amada

发明人： Hiroshi Murai ,  Jun Chiba ,  Fujio Amada

IPC分类号： C22C5/02

CPC分类号： C22C5/02 ,  B23K35/3013 ,  H01L24/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78306 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/01071 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/20752 ,  H01L2924/00013 ,  H01L2924/01006

摘要： [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved.[Solution Means] Au alloy bonding wires comprising: 5-100 wt ppm Mg, 5-20 wt ppm In, 5-20 wt ppm Al, 5-20 wt ppm Yb, and residual Au of 99.995 wt % purity or higher, and adding 5-20 wt ppm Ca, and for these alloys adding at least one element among 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, 5-100 wt ppm Sr to the alloy, and/or, moreover, adding 0.01-1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements do not cause a disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding on the tip of the capillary, transferring to the wire at second bonding.

摘要翻译： [待解决的问题]解决了在高纯度Au接合线上附加元素的附着氧化物引起的第二次接合故障。 [解决方案]包括：5-100重量ppm的Mg，5-20重量ppm的In，5-20重量ppm的Al，5-20重量ppm的Yb和99.995重量％的纯度或更高的残余金，以及 添加5-20重量ppm的Ca，对于这些合金，在5-20重量ppm的La，5-20重量ppm的Lu，5-100重量ppm的Sn，5-100重量ppm的Sr中加入至少一种元素，并且 /或此外，向这些合金中添加0.01-1.2重量％的Pd。 含有这些微量添加元素的粘合线不会由于污染而引起累积污染的干扰，这是由于通过微量放电在第一次接合而形成的污染，并且在第二次接合时转移到导线。

公开(公告)号：US20130065882A1

公开(公告)日：2013-03-14

申请号：US13573673

申请日：2012-10-03

申请人： Nobuo Machinaga ,  Shin Iimura ,  Yoshiyuki Yoneda ,  Jun Chiba ,  Fumihito Muro ,  Hideko Hoh ,  Atsushi Nakayama

发明人： Nobuo Machinaga ,  Shin Iimura ,  Yoshiyuki Yoneda ,  Jun Chiba ,  Fumihito Muro ,  Hideko Hoh ,  Atsushi Nakayama

IPC分类号： A61K31/404 ,  C07D409/14 ,  A61K31/4025 ,  C07D405/14 ,  C07D401/14 ,  A61K31/4725 ,  C07D413/14 ,  A61K31/454 ,  A61K31/403 ,  A61K31/496 ,  A61K31/553 ,  A61P35/00 ,  A61P25/00 ,  A61P37/06 ,  A61P35/02 ,  A61P17/06 ,  A61P29/00 ,  A61P3/10 ,  A61P19/02 ,  A61P11/02 ,  A61P35/04 ,  C07D403/14

CPC分类号： C07D409/12 ,  C07D401/12 ,  C07D401/14 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D405/14 ,  C07D409/14 ,  C07D413/14 ,  C07D417/14 ,  C07D487/08 ,  C07D491/048 ,  C07D491/056 ,  C07D491/08 ,  C07D495/04

摘要： This invention relates to a VLA-4 inhibitory drug, having good oral absorbability and exhibiting sufficient anti-inflammatory effects when administered orally, wherein an active ingredient is represented by formula (I), or a salt thereof: Q represents an optionally-substituted monocyclic or bicyclic nitrogen-containing heterocyclic group having a nitrogen atom as the bonding site; Y represents an oxygen atom or CH2; W represents an optionally-substituted bicyclic aromatic hydrocarbon ring group or an optionally-substituted bicyclic aromatic heterocyclic group; A1 represents a nitrogen atom or C—R3d wherein R3d represents a hydrogen atom, a halogen atom, a C1-8 alkoxy group or a C1-8 alkyl group; R1 represents H or a C1-8 alkyl group; R2 represents H, a halogen, a C1-8 alkoxy

摘要翻译： 本发明涉及具有良好口服吸收性且口服给药时具有足够抗炎作用的VLA-4抑制药物，其中活性成分由式（I）表示，或其盐：Q表示任选取代的单环 或具有氮原子的双环含氮杂环基作为键合位置; Y表示氧原子或CH2; W表示任选取代的双环芳烃环基或任选取代的双环芳族杂环基; A1表示氮原子或C-R3d，其中R3d表示氢原子，卤素原子，C1-8烷氧基或C1-8烷基; R1表示H或C1-8烷基; R 2表示H，卤素，C 1-8烷氧基

公开(公告)号：US20120316170A1

公开(公告)日：2012-12-13

申请号：US13579791

申请日：2011-02-17

申请人： Nobuo Machinaga ,  Jun Chiba ,  Fumihito Muro ,  Hiroshi Yuita ,  Jun Watanabe

发明人： Nobuo Machinaga ,  Jun Chiba ,  Fumihito Muro ,  Hiroshi Yuita ,  Jun Watanabe

IPC分类号： A61K31/5377 ,  A61K31/4439 ,  A61K31/422 ,  A61K31/4178 ,  A61K31/4164 ,  C07D413/12 ,  C07D401/12 ,  C07D413/04 ,  C07D403/12 ,  C07D233/90 ,  A61P29/00 ,  A61P1/00 ,  A61P11/00 ,  A61P25/00 ,  A61P37/08 ,  A61P41/00 ,  A61P19/02 ,  A61P11/06 ,  A61K31/454

CPC分类号： C07D233/64 ,  C07D233/54 ,  C07D233/90 ,  C07D401/12 ,  C07D403/12 ,  C07D405/04 ,  C07D405/06 ,  C07D405/12 ,  C07D413/04

摘要： To provide a novel compound or an isotope thereof or a pharmaceutically acceptable salt thereof having S1P lyase inhibitory capacity and inducing the decrease in number of lymphocytes, and a pharmaceutical composition containing these as active ingredients. A compound represented by the general formula (I): or the general formula (II): or an isotope thereof or a pharmaceutically acceptable salt thereof.

摘要翻译： 提供具有S1P裂解酶抑制能力并诱导淋巴细胞数量减少的新化合物或其同位素或其药学上可接受的盐，以及含有它们作为活性成分的药物组合物。 由通式（I）表示的化合物或通式（II）表示的化合物或其同位素或其药学上可接受的盐。

公开(公告)号：US20070232601A1

公开(公告)日：2007-10-04

申请号：US11629354

申请日：2005-06-14

申请人： Yoshiyuki Yoneda ,  Atsushi Nakayama ,  Nobuo Machinaga ,  Jun Chiba ,  Fumihito Muro

发明人： Yoshiyuki Yoneda ,  Atsushi Nakayama ,  Nobuo Machinaga ,  Jun Chiba ,  Fumihito Muro

IPC分类号： A61K31/535 ,  A61K31/40 ,  A61K31/425 ,  C07D207/00 ,  C07D263/00 ,  C07D277/62 ,  C07D265/28 ,  C07D241/00 ,  A61K31/445 ,  A61K31/497

CPC分类号： C07D417/14 ,  C07D413/14

摘要： An object of the present invention is to provide a compound which selectively inhibits binding of a ligand and α4β1 integrin (VLA-4), a process for producing the compound, and a medicament containing the compound. A compound represented by the formula (I) etc. or a salt thereof, a process for producing the compound or a salt thereof, a medicament containing the compound or a salt thereof, as well as a preventive and/or a therapeutic agent for a disease caused by cell adhesion, for example, inflammatory reaction, autoimmune disease, cancer metastasis, bronchial asthma, nasal obstruction, diabetes, arthritis, psoriasis, multiple sclerosis, inflammatory bowel disease and rejection reaction at transplantation, containing the compound or a salt thereof as a primary component. [wherein Y1 represents a divalent aryl group etc., V1 represents an aryl group etc., and R11 to R14 represent H, OH or a halogen atom etc.]

摘要翻译： 本发明的目的是提供选择性抑制配体和α4β1整联蛋白（VLA-4）结合的化合物，该化合物的制备方法和含有该化合物的药物。 由式（I）等表示的化合物或其盐，化合物或其盐的制备方法，含有该化合物或其盐的药物以及用于治疗和/ 包含其化合物或其盐的细胞粘附引起的疾病，例如炎性反应，自身免疫性疾病，癌症转移，支气管哮喘，鼻塞，糖尿病，关节炎，银屑病，多发性硬化，炎症性肠病和移植排斥反应 主要组成部分。 [其中Y 1表示二价芳基等，V 1表示芳基等，R 11至R 11， 14表示H，OH或卤素原子等]

公开(公告)号：US06756378B2

公开(公告)日：2004-06-29

申请号：US10034585

申请日：2001-12-28

申请人： John J. Baldwin ,  Edward McDonald ,  Kevin Joseph Moriarty ,  Christopher Ronald Sarko ,  Nobuo Machinaga ,  Atsushi Nakayama ,  Jun Chiba ,  Shin Iimura ,  Yoshiyuki Yoneda

发明人： John J. Baldwin ,  Edward McDonald ,  Kevin Joseph Moriarty ,  Christopher Ronald Sarko ,  Nobuo Machinaga ,  Atsushi Nakayama ,  Jun Chiba ,  Shin Iimura ,  Yoshiyuki Yoneda

IPC分类号： C07D20712

CPC分类号： C07D207/08 ,  C07C275/42 ,  C07C2601/02 ,  C07D207/09 ,  C07D207/12 ,  C07D207/14 ,  C07D207/16 ,  C07D207/22 ,  C07D207/24 ,  C07D209/12 ,  C07D211/26 ,  C07D211/34 ,  C07D211/38 ,  C07D213/55 ,  C07D217/02 ,  C07D277/04 ,  C07D277/28 ,  C07D277/48 ,  C07D295/13 ,  C07D295/185 ,  C07D307/33 ,  C07D311/20 ,  C07D401/06 ,  C07D401/12 ,  C07D401/14 ,  C07D403/02 ,  C07D413/06 ,  C07D491/04

摘要： Compounds that selectively inhibit the binding of ligands to &agr;4&bgr;1 integrin (VLA-4) and methods for their preparation are disclosed. In one embodiment, compounds of the invention are represented by Formula I: As selective inhibitors of VLA-4 mediated cell adhesion, compounds of the present invention are useful in the treatment of conditions associated with such adhesion, including, but not limited to, such conditions as inflammatory and autoimmune responses, diabetes, asthma, psoriasis, inflammatory bowel disease, transplantation rejection, and tumor metastasis. Also disclosed are pharmaceutical compositions, methods of inhibiting VLA-4 mediated cell adhesion and methods of treating conditions associated with LA-4 mediated cell adhesion, which involve compounds of Formula I.

摘要翻译： 公开了选择性抑制配体与α4β1整联蛋白（VLA-4）的结合的化合物及其制备方法。 在一个实施方案中，本发明的化合物由式I表示：作为VLA-4介导的细胞粘附的选择性抑制剂，本发明的化合物可用于治疗与这种粘附相关的病症，包括但不限于此 作为炎症和自身免疫反应的病症，糖尿病，哮喘，牛皮癣，炎性肠病，移植排斥反应和肿瘤转移。 还公开了药物组合物，抑制VLA-4介导的细胞粘附的方法和治疗与LA-4介导的细胞粘附相关的病症的方法，涉及式I化合物。

公开(公告)号：US08653126B2

公开(公告)日：2014-02-18

申请号：US13579791

申请日：2011-02-17

申请人： Nobuo Machinaga ,  Jun Chiba ,  Fumihito Muro ,  Hiroshi Yuita ,  Jun Watanabe

发明人： Nobuo Machinaga ,  Jun Chiba ,  Fumihito Muro ,  Hiroshi Yuita ,  Jun Watanabe

IPC分类号： A61K31/4172 ,  C07D233/64

CPC分类号： C07D233/64 ,  C07D233/54 ,  C07D233/90 ,  C07D401/12 ,  C07D403/12 ,  C07D405/04 ,  C07D405/06 ,  C07D405/12 ,  C07D413/04

摘要： To provide a novel compound or an isotope thereof or a pharmaceutically acceptable salt thereof having S1P lyase inhibitory capacity and inducing the decrease in number of lymphocytes, and a pharmaceutical composition containing these as active ingredients. A compound represented by the general formula (I): or the general formula (II): or an isotope thereof or a pharmaceutically acceptable salt thereof.

摘要翻译： 提供具有S1P裂解酶抑制能力并诱导淋巴细胞数量减少的新化合物或其同位素或其药学上可接受的盐，以及含有它们作为活性成分的药物组合物。 由通式（I）表示的化合物或通式（II）表示的化合物或其同位素或其药学上可接受的盐。