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公开(公告)号：US20220246751A1
公开(公告)日：2022-08-04
申请号：US17508933
申请日：2021-10-22
Inventor： Sungjae CHANG , Hokyun AHN , Hyunwook JUNG
IPC: H01L29/778 , H01L29/78
Abstract: Provided is a compound semiconductor device. The compound semiconductor device according to embodiments of the inventive concept includes a first semiconductor layer having a fin extending in a first direction on a substrate, an upper gate electrode extending in a second direction perpendicular to the first direction on the first semiconductor layer, a second semiconductor layer disposed between a sidewall of the fin and the upper gate electrode, a dielectric layer disposed between a top surface of the fin and the upper gate electrode, and a lower gate structure connected to a bottom surface of the first semiconductor layer by passing through the substrate.
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公开(公告)号：US20150171188A1
公开(公告)日：2015-06-18
申请号：US14633984
申请日：2015-02-27
Inventor： Hyung Sup YOON , Byoung-Gue MIN , Jong-Won LIM , Hokyun AHN , Seong-Il Kim , Sang Heung LEE , Dong Min KANG , Chull Won JU , Jae Kyoung MUN
IPC: H01L29/66 , H01L29/201 , H01L21/02 , H01L21/28 , H01L21/311 , H01L29/423 , H01L29/20 , H01L29/205
CPC classification number: H01L29/66462 , H01L21/02118 , H01L21/0217 , H01L21/02178 , H01L21/0254 , H01L21/28264 , H01L21/28593 , H01L21/31111 , H01L21/31144 , H01L29/2003 , H01L29/201 , H01L29/205 , H01L29/404 , H01L29/42316 , H01L29/42376 , H01L29/778 , H01L29/7786
Abstract: A field effect transistor is provided. The field effect transistor may include a capping layer on a substrate, a source ohmic electrode and a drain ohmic electrode on the capping layer, a first insulating layer and a second insulating layer stacked on the capping layer to cover the source and drain ohmic electrodes, a Γ-shaped gate electrode including a leg portion and a head portion, the leg portion being connected to the substrate between the source ohmic electrode and the drain ohmic electrode, and the head portion extending from the leg portion to cover a top surface of the second insulating layer, a first planarization layer on the second insulating layer to cover the Γ-shaped gate electrode, and a first electrode on the first planarization layer, the first electrode being connected to the source ohmic electrode or the drain ohmic electrode.
Abstract translation: 提供场效应晶体管。 场效应晶体管可以包括衬底上的覆盖层，覆盖层上的源欧姆电极和漏极欧姆电极，堆叠在覆盖层上以覆盖源极和漏极欧姆电极的第一绝缘层和第二绝缘层， 包括脚部和头部的栅格电极，所述脚部分连接到所述源欧姆电极和所述漏极欧姆电极之间的衬底，并且所述头部从所述腿部延伸以覆盖所述源极欧姆电极和所述漏极欧姆电极的顶表面 所述第二绝缘层，在所述第二绝缘层上覆盖所述栅格电极的第一平坦化层和所述第一平坦化层上的第一电极，所述第一电极连接到所述源欧姆电极或所述漏极欧姆电极。
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公开(公告)号：US20140167111A1
公开(公告)日：2014-06-19
申请号：US13912350
申请日：2013-06-07
Inventor： Hokyun AHN , Jong-Won Lim , Jeong-Jin Kim , Hae Cheon Kim , Jae Kyoung Mun , Eun Soo Nam
IPC: H01L29/778 , H01L29/66
CPC classification number: H01L29/7787 , H01L29/2003 , H01L29/201 , H01L29/205 , H01L29/42316 , H01L29/4236 , H01L29/42376 , H01L29/51 , H01L29/518 , H01L29/66462 , H01L29/7786
Abstract: A field effect transistor includes an active layer and a capping layer sequentially stacked on a substrate, and a gate electrode penetrating the capping layer and being adjacent to the active layer. The gate electrode includes a foot portion adjacent to the active layer and a head portion having a width greater than a width of the foot portion. The foot portion of an end part of the gate electrode has a width less than a width of the head portion of another part of the gate electrode and greater than a width of the foot portion of the another part of the gate electrode. The foot portion of the end part of the gate electrode further penetrates the active layer so as to be adjacent to the substrate.
Abstract translation: 场效应晶体管包括依次层叠在基板上的有源层和覆盖层，以及贯穿封盖层并与活性层相邻的栅电极。 栅电极包括与有源层相邻的脚部和具有大于脚部的宽度的宽度的头部。 栅电极的端部的脚部的宽度小于栅电极的另一部分的头部的宽度，并且大于栅极的另一部分的脚部的宽度。 栅电极的端部的脚部进一步穿过有源层，以与衬底相邻。
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公开(公告)号：US20150380354A1
公开(公告)日：2015-12-31
申请号：US14845435
申请日：2015-09-04
Inventor： Byoung-Gue MIN , Sang Choon KO , Jong-Won LIM , Hokyun AHN , Hyung Sup YOON , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L23/535 , H01L23/48
CPC classification number: H01L23/535 , H01L21/02365 , H01L21/28 , H01L21/76877 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device may include a substrate having a lower via-hole, an epitaxial layer having an opening exposing a top surface of the substrate, a semiconductor chip disposed on the top surface of the substrate and including first, second, and third electrodes, an upper metal layer connected to the first electrode, a supporting substrate disposed on the upper metal layer and having an upper via-hole, an upper pad disposed on the substrate and extending into the upper via-hole, a lower pad connected to the second electrode in the opening, and a lower metal layer covering a bottom surface of the substrate and connected to the lower pad through the lower via-hole.
Abstract translation: 半导体器件可以包括具有下通孔的衬底，具有暴露衬底的顶表面的开口的外延层，设置在衬底的顶表面上并包括第一，第二和第三电极的半导体芯片， 连接到第一电极的上金属层，设置在上金属层上并具有上通孔的支撑基板，设置在基板上并延伸到上通孔中的上焊盘，连接到第二电极的下焊盘 以及覆盖基板的底面的下金属层，并且通过下通路孔与下焊盘连接。
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公开(公告)号：US20140103539A1
公开(公告)日：2014-04-17
申请号：US14021269
申请日：2013-09-09
Inventor： Byoung-Gue MIN , Sang Choon KO , Jong-Won Lim , Hokyun AHN , Hyung Sup YOON , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L21/768 , H01L23/48 , H01L21/28 , H01L21/02
CPC classification number: H01L23/535 , H01L21/02365 , H01L21/28 , H01L21/76877 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device may include a substrate having a lower via-hole, an epitaxial layer having an opening exposing a top surface of the substrate, a semiconductor chip disposed on the top surface of the substrate and including first, second, and third electrodes, an upper metal layer connected to the first electrode, a supporting substrate disposed on the upper metal layer and having an upper via-hole, an upper pad disposed on the substrate and extending into the upper via-hole, a lower pad connected to the second electrode in the opening, and a lower metal layer covering a bottom surface of the substrate and connected to the lower pad through the lower via-hole.
Abstract translation: 半导体器件可以包括具有下通孔的衬底，具有暴露衬底的顶表面的开口的外延层，设置在衬底的顶表面上并包括第一，第二和第三电极的半导体芯片， 连接到第一电极的上金属层，设置在上金属层上并具有上通孔的支撑基板，设置在基板上并延伸到上通孔中的上焊盘，连接到第二电极的下焊盘 以及覆盖基板的底面的下金属层，并且通过下通路孔与下焊盘连接。
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Patent Agency Ranking
公开(公告)号：US20150129890A1
公开(公告)日：2015-05-14
申请号：US14583858
申请日：2014-12-29
Inventor： Hokyun AHN , Jong-Won LIM , Jeong-Jin KIM , Hae Cheon KIM , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L29/778 , H01L29/51 , H01L29/205 , H01L29/20 , H01L29/201
CPC classification number: H01L29/7787 , H01L29/2003 , H01L29/201 , H01L29/205 , H01L29/42316 , H01L29/4236 , H01L29/42376 , H01L29/51 , H01L29/518 , H01L29/66462 , H01L29/7786
Abstract: A field effect transistor includes an active layer and a capping layer sequentially stacked on a substrate, and a gate electrode penetrating the capping layer and being adjacent to the active layer. The gate electrode includes a foot portion adjacent to the active layer and a head portion having a width greater than a width of the foot portion. The foot portion of an end part of the gate electrode has a width less than a width of the head portion of another part of the gate electrode and greater than a width of the foot portion of the another part of the gate electrode. The foot portion of the end part of the gate electrode further penetrates the active layer so as to be adjacent to the substrate.
Abstract translation: 场效应晶体管包括依次层叠在基板上的有源层和覆盖层，以及贯穿封盖层并与活性层相邻的栅电极。 栅电极包括与有源层相邻的脚部和具有大于脚部的宽度的宽度的头部。 栅电极的端部的脚部的宽度小于栅电极的另一部分的头部的宽度，并且大于栅极的另一部分的脚部的宽度。 栅电极的端部的脚部进一步穿过有源层，以与衬底相邻。
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公开(公告)号：US20190103483A1
公开(公告)日：2019-04-04
申请号：US16137235
申请日：2018-09-20
Inventor： Hokyun AHN , Min Jeong SHIN , Jeong Jin KIM , Hae Cheon KIM , Jae Won DO , Byoung-Gue MIN , Hyung Sup YOON , Hyung Seok LEE , Jong-Won LIM , Sungjae CHANG , Hyunwook JUNG , Kyu Jun CHO , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Sang-Heung LEE , Jongmin LEE , Hong Gu JI
IPC: H01L29/78 , H01L29/20 , H01L29/45 , H01L29/417 , H01L29/423 , H01L29/66 , H01L21/3065
Abstract: Provided is a semiconductor device including a substrate in which an insulation layer is disposed between a first semiconductor layer and a second semiconductor layer, a through-hole penetrating through the substrate, the through-hole having a first hole penetrating through the first semiconductor layer and a second hole penetrating through the insulation layer and the second semiconductor layer from a bottom surface of the first hole, an epi-layer disposed inside the through-hole, a drain electrode disposed inside the second hole and contacting one surface of the epi-layer, and a source electrode and a gate electrode which are disposed on the other surface of the epi-layer.
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公开(公告)号：US20190081166A1
公开(公告)日：2019-03-14
申请号：US16028612
申请日：2018-07-06
Inventor： Jae Won DO , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Hae Cheon KIM , Byoung-Gue MIN , Min Jeong SHIN , Hokyun AHN , Hyung Sup YOON , Sang-Heung LEE , Jongmin LEE , Jong-Won LIM , Sungjae CHANG , Yoo Jin JANG , Hyunwook JUNG , Kyu Jun CHO , Hong Gu JI
IPC: H01L29/778 , H01L29/423 , H01L29/66 , H01L29/06 , H01L29/10 , H01L29/205
Abstract: Provided is a gate-all-around device. The gate-all-around device includes a substrate, a pair of heterojunction source/drain regions provided on the substrate, a heterojunction channel region provided between the pair of heterojunction source/drain regions, and a pair of ohmic electrodes provided on the pair of heterojunction source/drain regions, respectively. Each of the pair of heterojunction source/drain regions includes a pair of two-dimensional electron gas layers. The pair of ohmic electrodes extends toward an upper surface of the substrate and pass through the pair of heterojunction source/drain regions, respectively.
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公开(公告)号：US20180145684A1
公开(公告)日：2018-05-24
申请号：US15654792
申请日：2017-07-20
Inventor： Woojin CHANG , Jong-Won LIM , Dong Min KANG , Dong-Young KIM , Seong-il KIM , Hae Cheon KIM , Jae Won DO , BYOUNG-GUE MIN , Min Jeong SHIN , Hokyun AHN , Hyung Sup YOON , Sang-Heung LEE , JONGMIN LEE , Sungjae CHANG , Yoo Jin JANG , HYUNWOOK JUNG , Kyu Jun CHO , Hong Gu JI
IPC: H03K17/687 , H03K17/693 , G11C5/14 , H03K19/0175 , H03K3/353
CPC classification number: H03K17/687 , G11C5/14 , H03K3/353 , H03K17/08122 , H03K17/102 , H03K17/122 , H03K17/145 , H03K17/162 , H03K17/28 , H03K17/693 , H03K19/0175
Abstract: Provided is a cascode circuit including first and second transistors connected between a drain terminal and a source terminal in cascode form, a level sifter configured to change a voltage level of a switching control signal applied to a gate terminal and provide the changed switching control signal to a gate of the first transistor, a buffer configured to delay the switching control signal and provide the delayed switching control signal to a gate of the second transistor, and a first resistor connected between the level shifter and the gate of the first transistor.
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公开(公告)号：US20140035044A1
公开(公告)日：2014-02-06
申请号：US14049816
申请日：2013-10-09
Inventor： Hokyun AHN , Jong-Won LIM , Hyung Sup YOON , Byoung-Gue MIN , Sang-Heung LEE , Hae Cheon KIM , Eun Soo NAM
IPC: H01L29/78
CPC classification number: H01L29/7831 , H01L29/2003 , H01L29/404 , H01L29/42316 , H01L29/66462 , H01L29/66863 , H01L29/7787 , H01L29/812
Abstract: Disclosed are a field-effect transistor and a manufacturing method thereof. The disclosed field-effect transistor includes: a semiconductor substrate; a source ohmic metal layer formed on one side of the semiconductor substrate; a drain ohmic metal layer formed on another side of the semiconductor substrate; a gate electrode formed between the source ohmic metal layer and the drain ohmic metal layer, on an upper portion of the semiconductor substrate; an insulating film formed on the semiconductor substrate's upper portion including the source ohmic metal layer, the drain ohmic metal layer and the gate electrode; and a plurality of field electrodes formed on an upper portion of the insulating film, wherein the insulating film below the respective field electrodes has different thicknesses.
Abstract translation: 公开了场效应晶体管及其制造方法。 所公开的场效应晶体管包括：半导体衬底; 源极欧姆金属层，形成在半导体衬底的一侧上; 形成在所述半导体衬底的另一侧上的漏极欧姆金属层; 在所述源极欧姆金属层和所述漏极欧姆金属层之间形成的栅电极，位于所述半导体衬底的上部; 形成在包括源极欧姆金属层，漏极欧姆金属层和栅电极的半导体衬底的上部上的绝缘膜; 以及形成在绝缘膜的上部的多个场电极，其中，各个场电极下方的绝缘膜具有不同的厚度。
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