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公开(公告)号:US20190103483A1
公开(公告)日:2019-04-04
申请号:US16137235
申请日:2018-09-20
发明人: Hokyun AHN , Min Jeong SHIN , Jeong Jin KIM , Hae Cheon KIM , Jae Won DO , Byoung-Gue MIN , Hyung Sup YOON , Hyung Seok LEE , Jong-Won LIM , Sungjae CHANG , Hyunwook JUNG , Kyu Jun CHO , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Sang-Heung LEE , Jongmin LEE , Hong Gu JI
IPC分类号: H01L29/78 , H01L29/20 , H01L29/45 , H01L29/417 , H01L29/423 , H01L29/66 , H01L21/3065
摘要: Provided is a semiconductor device including a substrate in which an insulation layer is disposed between a first semiconductor layer and a second semiconductor layer, a through-hole penetrating through the substrate, the through-hole having a first hole penetrating through the first semiconductor layer and a second hole penetrating through the insulation layer and the second semiconductor layer from a bottom surface of the first hole, an epi-layer disposed inside the through-hole, a drain electrode disposed inside the second hole and contacting one surface of the epi-layer, and a source electrode and a gate electrode which are disposed on the other surface of the epi-layer.
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公开(公告)号:US20190081166A1
公开(公告)日:2019-03-14
申请号:US16028612
申请日:2018-07-06
发明人: Jae Won DO , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Hae Cheon KIM , Byoung-Gue MIN , Min Jeong SHIN , Hokyun AHN , Hyung Sup YOON , Sang-Heung LEE , Jongmin LEE , Jong-Won LIM , Sungjae CHANG , Yoo Jin JANG , Hyunwook JUNG , Kyu Jun CHO , Hong Gu JI
IPC分类号: H01L29/778 , H01L29/423 , H01L29/66 , H01L29/06 , H01L29/10 , H01L29/205
摘要: Provided is a gate-all-around device. The gate-all-around device includes a substrate, a pair of heterojunction source/drain regions provided on the substrate, a heterojunction channel region provided between the pair of heterojunction source/drain regions, and a pair of ohmic electrodes provided on the pair of heterojunction source/drain regions, respectively. Each of the pair of heterojunction source/drain regions includes a pair of two-dimensional electron gas layers. The pair of ohmic electrodes extends toward an upper surface of the substrate and pass through the pair of heterojunction source/drain regions, respectively.
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公开(公告)号:US20180145684A1
公开(公告)日:2018-05-24
申请号:US15654792
申请日:2017-07-20
发明人: Woojin CHANG , Jong-Won LIM , Dong Min KANG , Dong-Young KIM , Seong-il KIM , Hae Cheon KIM , Jae Won DO , BYOUNG-GUE MIN , Min Jeong SHIN , Hokyun AHN , Hyung Sup YOON , Sang-Heung LEE , JONGMIN LEE , Sungjae CHANG , Yoo Jin JANG , HYUNWOOK JUNG , Kyu Jun CHO , Hong Gu JI
IPC分类号: H03K17/687 , H03K17/693 , G11C5/14 , H03K19/0175 , H03K3/353
CPC分类号: H03K17/687 , G11C5/14 , H03K3/353 , H03K17/08122 , H03K17/102 , H03K17/122 , H03K17/145 , H03K17/162 , H03K17/28 , H03K17/693 , H03K19/0175
摘要: Provided is a cascode circuit including first and second transistors connected between a drain terminal and a source terminal in cascode form, a level sifter configured to change a voltage level of a switching control signal applied to a gate terminal and provide the changed switching control signal to a gate of the first transistor, a buffer configured to delay the switching control signal and provide the delayed switching control signal to a gate of the second transistor, and a first resistor connected between the level shifter and the gate of the first transistor.
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