COMPONENT PACKAGE INCLUDING MATCHING CIRCUIT AND MATCHING METHOD THEREOF
    2.
    发明申请
    COMPONENT PACKAGE INCLUDING MATCHING CIRCUIT AND MATCHING METHOD THEREOF 有权
    组件包括匹配电路及其匹配方法

    公开(公告)号:US20150270822A1

    公开(公告)日:2015-09-24

    申请号:US14478295

    申请日:2014-09-05

    Abstract: Provided herein is a component package including a matching unit and a matching method thereof, the matching unit including: a substrate; a transmission line formed on the substrate, the transmission line being connected to a terminal of the component package; a bonding wire electrically connecting the transmission line and a central component; and a capacitor unit having a plurality of capacitors electrically connected with the transmission line by wiring connection, wherein an inductance of the matching unit is variable by adjusting a length of the bonding wire, and a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line, of among the capacitors inside the capacitor unit, by extending or cutting off the wiring connection.

    Abstract translation: 本文提供了一种包括匹配单元及其匹配方法的组件封装,所述匹配单元包括:衬底; 形成在所述基板上的传输线,所述传输线连接到所述部件封装的端子; 电连接所述传输线和中心部件的接合线; 以及具有通过布线连接与传输线电连接的多个电容器的电容器单元,其中匹配单元的电感通过调整接合线的长度而变化,并且匹配单元的电容可通过增加或减小而变化 通过延长或切断布线连接,在电容器单元内的电容器之间电连接到传输线的电容器的数量。

    SWITCH CIRCUIT FOR ULTRA-HIGH FREQUENCY BAND

    公开(公告)号:US20230115787A1

    公开(公告)日:2023-04-13

    申请号:US17879047

    申请日:2022-08-02

    Abstract: Disclosed is a switch circuit for an ultra-high frequency band, which includes a transistor including a first terminal connected to an input stage, a second terminal connected to an output stage, and a gate terminal, an inductor connected to the transistor in parallel, between the input stage and the output stage, a variable gate driver to apply a gate input voltage to the gate terminal and, an input resistor connected between the variable gate driver and the gate terminal. The variable gate driver adjusts the gate input voltage to be in one of a first voltage level for turning on the transistor and a second voltage level for turning off the transistor. The second voltage level varies depending on a capacitance between the first terminal and the second terminal, when the transistor is in a turn-off state.

    FEEDBACK AMPLIFIER
    7.
    发明申请
    FEEDBACK AMPLIFIER 有权
    反馈放大器

    公开(公告)号:US20150349736A1

    公开(公告)日:2015-12-03

    申请号:US14666163

    申请日:2015-03-23

    CPC classification number: H03G1/0088 H03F1/083 H03F3/08 H03F2200/153 H03G3/12

    Abstract: Provided herein is a feedback amplifier including an amplifier circuit configured to amplify an input signal input from an input terminal and output the amplified input signal to an output terminal; a feedback circuit configured to apply a feedback resistance value to a signal output to the output terminal, and to control a gain of the amplifier circuit by adjusting the input signal by a bias voltage applied with a feedback resistance value determined; a packet signal sensor configured to generate a fixed resistance control signal for controlling a fixed resistance value included in the feedback resistance value through a comparison between the output from the output terminal with a minimum signal level; and a fixed resistance controller configured to control the fixed resistance value included in the feedback resistance value in response to the fixed resistance control signal.

    Abstract translation: 本文提供了一种反馈放大器,包括:放大器电路,被配置为放大从输入端输入的输入信号,并将放大的输入信号输出到输出端; 反馈电路,被配置为向输出端子输出的信号施加反馈电阻值,并且通过利用所确定的反馈电阻值施加的偏置电压来调节所述输入信号来控制所述放大器电路的增益; 分组信号传感器,被配置为通过比较来自所述输出端子的输出与最小信号电平之间的比较,产生用于控制所述反馈电阻值中包括的固定电阻值的固定电阻控制信号; 以及固定电阻控制器,其被配置为响应于所述固定电阻控制信号来控制包括在所述反馈电阻值中的所述固定电阻值。

    HIGH ELECTRON MOBILITY TRANSISTOR AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTOR AND MANUFACTURING METHOD THEREOF 有权
    高电子移动晶体管及其制造方法

    公开(公告)号:US20150087142A1

    公开(公告)日:2015-03-26

    申请号:US14555182

    申请日:2014-11-26

    Abstract: Disclosed is a manufacturing method of a high electron mobility transistor. The method includes: forming a source electrode and a drain electrode on a substrate; forming a first insulating film having a first opening on an entire surface of the substrate, the first opening exposing a part of the substrate; forming a second insulating film having a second opening within the first opening, the second opening exposing a part of the substrate; forming a third insulating film having a third opening within the second opening, the third opening exposing a part of the substrate; etching a part of the first insulating film, the second insulating film and the third insulating film so as to expose the source electrode and the drain electrode; and forming a T-gate electrode on a support structure including the first insulating film, the second insulating film and the third insulating film.

    Abstract translation: 公开了一种高电子迁移率晶体管的制造方法。 该方法包括:在基板上形成源电极和漏电极; 在所述基板的整个表面上形成具有第一开口的第一绝缘膜,所述第一开口暴露所述基板的一部分; 在所述第一开口内形成具有第二开口的第二绝缘膜,所述第二开口暴露所述基板的一部分; 在所述第二开口内形成具有第三开口的第三绝缘膜,所述第三开口暴露所述基板的一部分; 蚀刻第一绝缘膜,第二绝缘膜和第三绝缘膜的一部分,以使源电极和漏电极露出; 以及在包括第一绝缘膜,第二绝缘膜和第三绝缘膜的支撑结构上形成T栅电极。

    PACKAGE
    9.
    发明申请
    PACKAGE 审中-公开

    公开(公告)号:US20140160689A1

    公开(公告)日:2014-06-12

    申请号:US13959666

    申请日:2013-08-05

    Abstract: A package includes a ground plate, a chip mounting plate disposed at a side of the ground plate and having a top surface lower than a top surface of the ground plate, a chip on the chip mounting plate, a first input/output terminal opposite to the chip mounting plate and disposed at another side of the ground plate, and a second input/output terminal opposite to the ground plate and disposed at a side of the chip mounting plate. The first and second input/output terminals are electrically connected to the chip.

    Abstract translation: 一种封装,包括接地板,设置在接地板一侧的芯片安装板,具有比接地板的顶表面低的顶表面,芯片安装板上的芯片,与第一输入/输出端子相对的第一输入/输出端子 芯片安装板并且设置在接地板的另一侧,以及与接地板相对的第二输入/输出端子,并且设置在芯片安装板的一侧。 第一和第二输入/输出端子与芯片电连接。

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