公开(公告)号：US20220285244A1

公开(公告)日：2022-09-08

申请号：US17562587

申请日：2021-12-27

Applicant: Electronics and Telecommunications Research Institute

Inventor： Il Gyu CHOI ,  Seong Il KIM ,  Hae Cheon KIM ,  Youn Sub NOH ,  Ho Kyun AHN ,  Sang Heung LEE ,  Jong Won LIM ,  Sung Jae CHANG ,  Hyun Wook JUNG

IPC: H01L23/373

Abstract: The present invention improves a heat dissipation property of a semiconductor device by transferring hexagonal boron nitride (hBN) with a two-dimensional nanostructure to the semiconductor device. A semiconductor device of the present invention includes a substrate having a first surface and a second surface, a semiconductor layer formed on the first surface of the substrate, an hBN layer formed on at least one surface of the first surface and the second surface of the substrate, and a heat sink positioned on the second surface of the substrate. A radiation rate of heat generated during driving of an element is increased to decrease a reduction in lifetime of a semiconductor device due to a temperature increase. The semiconductor device has a structure and configuration which are very effective in improving a rapid temperature increase due to heat generated by high-power semiconductor devices.

公开(公告)号：US20150236108A1

公开(公告)日：2015-08-20

申请号：US14328247

申请日：2014-07-10

Applicant: Electronics and Telecommunications Research Institute

Inventor： Seong Il KIM ,  Dong Min KANG ,  Sang Heung LEE ,  Ho Kyun AHN ,  Hyung Sup YOON ,  Byoung Gue MIN ,  Jong Won LIM

IPC: H01L29/423 ,  H01L21/283 ,  H01L29/778

CPC classification number: H01L29/42312 ,  H01L21/28114 ,  H01L21/28587 ,  H01L21/28593 ,  H01L29/42316 ,  H01L29/66863 ,  H01L29/778 ,  H01L29/812

Abstract: Disclosed are a semiconductor device having a stable gate structure, and a manufacturing method thereof, in which a gate structure is stabilized by additionally including a plurality of gate feet under a gate head in a width direction of the gate head so as to serve as supporters in a gate structure including a fine gate foot having a length of 0.2 μm or smaller, and the gate head having a predetermined size. Accordingly, it is possible to prevent the gate electrode of the semiconductor device from collapsing, and improve reliability of the semiconductor device during or after the process of the semiconductor device.

Abstract translation: 公开了一种具有稳定的栅极结构的半导体器件及其制造方法，其中通过在栅极头的宽度方向上的栅极头附近还包括多个栅极脚来稳定栅极结构，以作为支撑体 在包括具有0.2μm或更小的长度的精细栅极脚的栅极结构中，并且栅极头具有预定尺寸。 因此，可以防止半导体器件的栅电极塌陷，并且在半导体器件的处理期间或之后提高半导体器件的可靠性。

公开(公告)号：US20150270822A1

公开(公告)日：2015-09-24

申请号：US14478295

申请日：2014-09-05

Applicant: Electronics and Telecommunications Research Institute

Inventor： Dong Min KANG ,  Seong Il KIM ,  Sang Heung LEE ,  Chull Won JU ,  Ho Kyun AHN ,  Hyung Sup YOON ,  Jong Won LIM

IPC: H03H7/38

CPC classification number: H03H7/38 ,  H01L23/642 ,  H01L2224/49175 ,  H01P1/2039 ,  H01P5/12 ,  H05K1/025 ,  H05K2201/09781

Abstract: Provided herein is a component package including a matching unit and a matching method thereof, the matching unit including: a substrate; a transmission line formed on the substrate, the transmission line being connected to a terminal of the component package; a bonding wire electrically connecting the transmission line and a central component; and a capacitor unit having a plurality of capacitors electrically connected with the transmission line by wiring connection, wherein an inductance of the matching unit is variable by adjusting a length of the bonding wire, and a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line, of among the capacitors inside the capacitor unit, by extending or cutting off the wiring connection.

Abstract translation: 本文提供了一种包括匹配单元及其匹配方法的组件封装，所述匹配单元包括：衬底; 形成在所述基板上的传输线，所述传输线连接到所述部件封装的端子; 电连接所述传输线和中心部件的接合线; 以及具有通过布线连接与传输线电连接的多个电容器的电容器单元，其中匹配单元的电感通过调整接合线的长度而变化，并且匹配单元的电容可通过增加或减小而变化 通过延长或切断布线连接，在电容器单元内的电容器之间电连接到传输线的电容器的数量。

公开(公告)号：US20150194494A1

公开(公告)日：2015-07-09

申请号：US14243322

申请日：2014-04-02

Applicant: Electronics and Telecommunications Research Institute

Inventor： Ho Kyun AHN ,  Hae Cheon KIM ,  Zin Sig KIM ,  Sang Heung LEE ,  Byoung Gue MIN ,  Hyung Sup YOON ,  Dong Min KANG ,  Seong Il KIM ,  Jong Min LEE ,  Jong Won LIM ,  Yong Hwan KWON ,  Eun Soo NAM

IPC: H01L29/40 ,  H01L29/66 ,  H01L21/28 ,  H01L21/283 ,  H01L29/78 ,  H01L29/423

CPC classification number: H01L29/402 ,  H01L21/283 ,  H01L21/28593 ,  H01L29/2003 ,  H01L29/42312 ,  H01L29/42356 ,  H01L29/66462 ,  H01L29/66477 ,  H01L29/7787

Abstract: Disclosed are a field effect transistor for high voltage driving including a gate electrode structure in which a gate head extended in a direction of a drain is supported by a field plate embedded under a region of the gate head so as to achieve high voltage driving, and a manufacturing method thereof. Accordingly, the gate head extended in the direction of the drain is supported by the field plate electrically spaced by using an insulating layer, so that it is possible to stably manufacture a gate electrode including the extended gate head, and gate resistance is decreased by the gate head extended in the direction of the drain and an electric field peak value between the gate and the drain is decreased by the gate electrode including the gate head extended in the direction of the drain and the field plate proximate to the gate, thereby achieving an effect in that a breakdown voltage of a device is increased.

Abstract translation: 公开了一种用于高电压驱动的场效应晶体管，其包括栅极电极结构，其中在漏极方向上延伸的栅极头由嵌入在栅极头的区域内的场板支撑以实现高电压驱动，以及 其制造方法。 因此，在漏极方向上延伸的栅极头通过使用绝缘层而被电隔离的场板支撑，使得可以稳定地制造包括延伸栅极头的栅电极，并且栅极电阻通过 栅极头在漏极的方向上延伸，栅极和漏极之间的电场峰值由包括在漏极方向上延伸的栅极和靠近栅极的场板的栅电极减小，由此实现 效果是器件的击穿电压增加。