Abstract:
A recording apparatus and a recording method that can record both moving picture data and still picture data in a form reproducible by various reproducing apparatus. The moving picture data is compressed by an MPEG system by an MPEG encoder, formed into data for recording corresponding to a predetermined recording format by a format forming unit, and then recorded on a DVD. The still picture data is compressed by a JPEG system by a JPEG encoder, and recorded on the DVD separately from the moving picture data. In predetermined timing, the still picture data compressed by the JPEG system and recorded on the DVD is read, the still picture data is converted into I-pictures of the MPEG system by a format converting unit, and then the I-pictures of the MPEG system are recorded onto the DVD in the predetermined format via the format forming unit.
Abstract:
An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film.
Abstract:
A circuit board H10 according to the present invention is a circuit board H10 in which an electric circuit H6 including a wiring section H6a and a pad section H6b is provided in the surface of an insulating base substrate H1. The electric circuit H6 is configured such that a conductor H5 is embedded in a circuit recess H3 formed in the surface of the insulating base substrate H1, and the surface roughness of the conductor H5 is different in the wiring section H6a and the pad section H6b of the electric circuit H6. In this case, it is preferable that the surface roughness of the conductor H5 in the pad section H6b is greater than the surface roughness of the conductor H5 in the wiring section H6a.
Abstract:
In a ROW-based DVD-RW, a DVD video file is managed according to provisional VMGI (TMP_VMGI) and an extension file other than the DVD video file, such as a JPEG file or the like is managed according to intermediate management information (TMP_EXTI), and temporary space bitmap (TMP_SBM) used in UDF and the like is added to provisional VMGI (TMP_VMGI to record a combination of the DVD video file and extension file such as JPEG file and manage the temporary space. Thereby, the temporary space can be known from TMP_SBM, and even when the extension file has been deleted, the DVD-RW is made interchangeable with a read-only optical disk through finalization. Thus, the present invention allows to record a file of still pictures other than moving pictures and also pad information in a temporary space resulted from deletion of any recorded area.
Abstract:
The present invention relates to a recording apparatus for improving operability of a DVD camcorder that performs recording in a video format. When an instruction for starting recording is given at a time T11 and then an instruction for stopping the recording is given at a time T12, a DVD camcorder is brought into a pause state at the time T12. An address and the like of an optical disk at that time are stored in a recording RAM. When an instruction for resuming recording is given at a time T13, the address stored in the recording RAM is read, and rerecording is started at a position on the optical disk which position corresponds to the address. The present invention is applicable to DVD camcorders.
Abstract:
A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer.
Abstract:
The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the film.
Abstract:
The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).
Abstract:
A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.
Abstract:
The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step.