Invention Application
US20120292083A1 METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD
审中-公开
通过添加方法生产电路板的方法，以及由方法获得的电路板和多层电路板
- Patent Title: METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD
- Patent Title (中): 通过添加方法生产电路板的方法，以及由方法获得的电路板和多层电路板
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Application No.: US13562500Application Date: 2012-07-31
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Publication No.: US20120292083A1Publication Date: 2012-11-22
- Inventor: Shingo YOSHIOKA , Hiroaki FUJIWARA
- Applicant: Shingo YOSHIOKA , Hiroaki FUJIWARA
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2008-118818 20080430; JP2008-193931 20080728; JP2008-217091 20080826; JP2008-246431 20080925; JP2009-104086 20090422
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/02 ; H05K3/10
Abstract:
The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step.
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