公开(公告)号：US09386701B2

公开(公告)日：2016-07-05

申请号：US14092188

申请日：2013-11-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yeon Seop Yu ,  Moon Il Kim ,  Jun Young Kim

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2924/3511 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.

Abstract translation: 电子部件嵌入式印刷电路板包括具有空腔的芯体; 插入腔内的电子部件; 绝缘层层叠在芯的顶部和底部，并与具有分别作用在有机材料和无机材料上的官能团的偶联剂混合以结合到电子部件的外周表面; 以及设置在绝缘层上的电路图案。

公开(公告)号：US09330807B2

公开(公告)日：2016-05-03

申请号：US14088737

申请日：2013-11-25

Applicant: Empire Technology Development LLC

Inventor： Kazufumi Ogawa ,  Kazuhiro Soejima

IPC: H05K1/09 ,  H01B1/12 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12

CPC classification number: H01B1/12 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2998

Abstract: The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.

Abstract translation: 本发明涉及一种导电膏，其中细金属颗粒分散在由至少烷氧基硅烷化合物，硅烷醇缩合催化剂和非水有机溶剂的混合物制成的化学吸附液体中，以形成包含分子共价的有机薄膜 通过使细金属颗粒的表面与烷氧基硅烷化合物反应而与金属微粒表面结合，从而产生赋予表面的反应性功能的细小金属颗粒，同时几乎保持细金属的原始导电性 颗粒，然后用有机溶剂粘贴颗粒。

公开(公告)号：US09253911B2

公开(公告)日：2016-02-02

申请号：US13702485

申请日：2011-11-30

Applicant: Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

Inventor： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC: H05K7/04 ,  H01R43/00 ,  H01B1/10 ,  H01B1/08 ,  H01B1/20 ,  H01L23/00 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K7/04 ,  H01B1/08 ,  H01B1/10 ,  H01B1/20 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R43/00 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

Abstract translation: 本发明提供了一种各向异性导电材料及其制造方法，其中连续性较低，粘合强度较高。 当玻璃基板和金属布线材料被热压和粘合时，在玻璃基板和各向异性导电材料之间的界面中，玻璃基板的表面上的Si与二硫化硅烷末端的烷氧基（OR）反应 通过疏水性二氧化硅改性，并与其化学结合。 此外，在金属配线材料和各向异性导电材料之间的界面处，二硫化硅烷中的一部分S-S键（二硫键）由于热压接合时的热量而解离，并且解离的硫化硅化合物与 金属我。

公开(公告)号：US09175151B2

公开(公告)日：2015-11-03

申请号：US14496709

申请日：2014-09-25

Applicant: PANASONIC CORPORATION

Inventor： Yuko Konno ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: C08K5/34 ,  H05K1/03 ,  H05K3/00 ,  C09D125/08 ,  C09D133/08 ,  C08K5/3475 ,  H05K3/10 ,  H05K3/18 ,  C08L33/02 ,  C08K5/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US09148953B2

公开(公告)日：2015-09-29

申请号：US14046408

申请日：2013-10-04

Applicant: Tyco Electronics Japan G. K.

Inventor： Katsunori Fukuda ,  Akira Torigoe

IPC: H05K1/03 ,  H05K3/24 ,  H05K3/38

CPC classification number: H05K1/0306 ,  H05K3/246 ,  H05K3/387 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239

Abstract: A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.

Abstract translation: 提供一种玻璃布线板，其包括玻璃基板和底漆层。 主层设置在玻璃基板上，并且包括设置在中间层上的中间层和镀铜层。 中间层包括树脂偶联剂和分散在树脂偶联剂中的金属元素。

公开(公告)号：US20150240132A1

公开(公告)日：2015-08-27

申请号：US14189302

申请日：2014-02-25

Applicant: The Boeing Company

Inventor： Peter Babilo ,  Randall Jay Moss

IPC: C09J11/06 ,  C09J163/00 ,  H05K3/30 ,  C09K5/14 ,  B32B37/12 ,  B32B37/18

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

Abstract translation: 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。

公开(公告)号：US08865049B2

公开(公告)日：2014-10-21

申请号：US13060692

申请日：2009-09-07

Applicant: Jun Taniguchi ,  Norio Yoshino

Inventor： Jun Taniguchi ,  Norio Yoshino

IPC: B28B7/36 ,  B29C33/56 ,  H05K3/20 ,  H05K3/02 ,  B29C33/60 ,  B29C37/00 ,  B29C33/42

CPC classification number: B29C33/56 ,  B29C33/424 ,  B29C33/60 ,  B29C37/0053 ,  H05K3/025 ,  H05K3/20 ,  H05K2201/0239 ,  H05K2201/0373 ,  H05K2203/1152 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24926 ,  Y10T428/31663

Abstract: There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material. In formula (I), n represents an integer of 8, 10, 12 or 14; m represents an integer of 3 or 4; and X, Y and Z each independently represent a hydrolyzable group that is a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, or a halogen atom.

Abstract translation: 提供了一种转印结构的制造方法，其中可以容易地实现转印接收材料与基体之间的剥离而不破坏精细图案，矩阵的转印图案令人满意地转印到转印接收材料上，并且 在重复转印过程中，矩阵的耐久性能够保持很长时间; 以及用于该方法的矩阵。 在具有形成在其表面上的转印图案的基体的表面上形成由下式（I）表示的硅烷偶联剂的膜，在其上施加转印接收材料以将图案转印到 基质，并且转移接收材料从基质上分离以获得由转印接收材料形成的转印结构。 在式（I）中，n表示8,10,12或14的整数; m表示3或4的整数; X，Y和Z各自独立地表示甲氧基，乙氧基，丙氧基，异丙氧基或卤素原子的可水解基团。

公开(公告)号：US20140182908A1

公开(公告)日：2014-07-03

申请号：US13837933

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hye Shim ,  Yong Jin Park ,  Hwa Young Lee ,  Hyung Mi Jung

IPC: H05K1/03 ,  B29D7/01 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B29C39/14 ,  B29K2063/00 ,  C08G59/5086 ,  C08G59/56 ,  C08K9/06 ,  C08L2205/02 ,  H05K1/0353 ,  H05K1/036 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/269 ,  C08L63/00

Abstract: This invention relates to an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board including the same. Particularly in a printed circuit board using a build-up process, a skin layer and a roughness are formed on the surface of the insulating film using different curing starting temperatures, so that peel strength can be enhanced, thus enabling the formation of a fine pattern, and also, a coefficient of thermal expansion of the insulating film is low, thus preventing the deformation of the film.

Abstract translation: 本发明涉及一种用于绝缘膜的环氧树脂组合物，绝缘膜和包括该环氧树脂的印刷电路板。 特别是在使用积聚方法的印刷电路板中，使用不同的固化开始温度在绝缘膜的表面上形成表层和粗糙度，从而可以提高剥离强度，从而能够形成精细图案 ，并且绝缘膜的热膨胀系数低，从而防止膜的变形。

公开(公告)号：US20140170305A1

公开(公告)日：2014-06-19

申请号：US14176890

申请日：2014-02-10

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takahiro MATSUMOTO ,  Hirotaka TSURUYA ,  Hajime BAN ,  Reiki AKITA

IPC: C09C1/56

CPC classification number: C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

Abstract translation: 提供一种通过将液体金属醇盐加入到其中分散有包含碳材料的导电超细粉末并进一步加入水的含甲醇的有机溶剂中获得的绝缘超微粉及其制备方法。 此外，提供了通过将液体金属醇盐添加到其中分散有包含碳材料的导电性超微粉末的含甲醇的有机溶剂中而进一步添加具有醇盐基团的偶联剂然后向其中加入水而获得的绝缘超细粉末， 其制造方法 此外，提供了通过将本发明的绝缘超细粉末与体积比（绝缘超细粉末/树脂）的树脂混合在5/95至50/50的范围内而获得的高介电常数树脂复合材料。

公开(公告)号：US20130135838A1

公开(公告)日：2013-05-30

申请号：US13702485

申请日：2011-11-30

Applicant: Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

Inventor： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC: H05K7/04 ,  H01R43/00

CPC classification number: H05K7/04 ,  H01B1/08 ,  H01B1/10 ,  H01B1/20 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R43/00 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

Abstract translation: 本发明提供了一种各向异性导电材料及其制造方法，其中连续性较低，粘合强度较高。 当玻璃基板和金属布线材料被热压和粘合时，在玻璃基板和各向异性导电材料之间的界面中，玻璃基板的表面上的Si与二硫化硅烷末端的烷氧基（OR）反应 通过疏水性二氧化硅改性，并与其化学结合。 此外，在金属配线材料和各向异性导电材料之间的界面处，二硫化硅烷中的一部分SS键（二硫键）由于热压接合时的热量而解离，并且解离的硫化硅化合物与金属Me化学结合 。