公开(公告)号：US08183088B2

公开(公告)日：2012-05-22

申请号：US12823411

申请日：2010-06-25

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Byoung-Ok Lee

IPC: H01L21/00

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US20090243078A1

公开(公告)日：2009-10-01

申请号：US12406757

申请日：2009-03-18

Applicant: Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

Inventor： Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/38 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L35/08 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract translation: 提供了功率器件封装，其包括使用珀尔帖效应的热电模块，并且因此可以通过快速耗散在外部产生的热量来提高操作可靠性及其制造方法。 一种示例性功率器件封装包括：具有第一表面和彼此相对的第二表面的热电模块，以及多个n型杂质元件和多个p型杂质元件串联交替和电连接 ; 引导框架，其通过粘合构件附接到热电模块的第一表面; 至少一个功率半导体芯片和至少一个控制半导体芯片，每个芯片安装在引线框架上并电连接到引线框架; 以及密封构件，其密封热电模块，芯片和引线框架的至少一部分，但暴露模块的第二表面。

公开(公告)号：US20090201256A1

公开(公告)日：2009-08-13

申请号：US11577685

申请日：2005-10-14

Applicant: Jong-Sik Jeong ,  Byoung-ok Lee

Inventor： Jong-Sik Jeong ,  Byoung-ok Lee

IPC: G06F3/041

CPC classification number: G06F3/042 ,  G06F3/04886 ,  H04M1/23

Abstract: The present invention is directed to a portable terminal having inputting means using an image sensor and its input method. The portable terminal according to an embodiment of the present invention comprises a transparent solid plate mounted in a keypad area; an image sensor having unit cells of lattice type outputting an electrical signal corresponding to the light irradiated through the transparent solid plate; and a key selection recognizer generating and outputting a key button selection signal corresponding to the location of a unit cell that outputted the least electrical signal value by making reference to the size of the value of the electrical signal inputted from the unit cells. The present invention enables compacting of portable terminals owing to eliminating the need to design key buttons to match the size of human fingers.

Abstract translation: 本发明涉及具有使用图像传感器的输入装置及其输入方法的便携式终端。 根据本发明的实施例的便携式终端包括安装在键盘区域中的透明固体板; 具有晶格型单位单元的图像传感器，输出与通过透明固体板照射的光对应的电信号; 以及键选择识别器，通过参照从单位单元输入的电信号的值的大小，生成并输出与输出最小电信号值的单元的位置对应的按键选择信号。 本发明能够实现便携式终端的压实，这是由于不需要设计按钮来匹配人的手指的尺寸。

公开(公告)号：US09141905B2

公开(公告)日：2015-09-22

申请号：US13423363

申请日：2012-03-19

Applicant: Dong-Hyun Baek ,  Byoung-Ok Lee ,  Jung-Hyun Cho ,  Eun-Su Kim

Inventor： Dong-Hyun Baek ,  Byoung-Ok Lee ,  Jung-Hyun Cho ,  Eun-Su Kim

IPC: G06K19/06 ,  G06K19/077

CPC classification number: G06K19/07783 ,  G06K19/07722 ,  G06K19/07769 ,  G06K19/07771 ,  Y10T29/49016

Abstract: A card-type information recording medium having an embedded antenna for NFC communication is provided. The card-type information recording medium includes: a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process; an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB; and a molding material that is formed on the top of the PCB to cover the NFC communication unit and the USIM card unit. Accordingly, it is possible to perform functions of NFC and RFID read/tag by only mounting a USIM device thereon without adding any module or any constituent having an antenna function to a mobile terminal.

Abstract translation: 提供一种具有用于NFC通信的嵌入式天线的卡型信息记录介质。 卡式信息记录介质包括：通过使用蚀刻工艺在其顶表面和底表面上形成环形天线图案和布线图案的PCB; 水平安装在PCB顶部的NFC通信单元和USIM卡单元; 以及形成在PCB的顶部以覆盖NFC通信单元和USIM卡单元的成型材料。 因此，通过仅在其上安装USIM设备就可以执行NFC和RFID读取/标签的功能，而不需要向移动终端添加具有天线功能的任何模块或任何组件。

公开(公告)号：US20100258925A1

公开(公告)日：2010-10-14

申请号：US12823411

申请日：2010-06-25

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US20070001278A1

公开(公告)日：2007-01-04

申请号：US11471291

申请日：2006-06-19

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Gooi ,  Maria Cristina Estacio ,  David Chong ,  Tan Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Lim ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Gooi ,  Maria Cristina Estacio ,  David Chong ,  Tan Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Lim ,  Byoung-Ok Lee

IPC: H01L21/00

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US07061080B2

公开(公告)日：2006-06-13

申请号：US10167067

申请日：2002-06-10

Applicant: Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

Inventor： Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

IPC: H01L23/495

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

公开(公告)号：US08664752B2

公开(公告)日：2014-03-04

申请号：US13430347

申请日：2012-03-26

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

IPC: H01L23/495

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US08552541B2

公开(公告)日：2013-10-08

申请号：US13101078

申请日：2011-05-04

Applicant: Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

Inventor： Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/34 ,  H01L21/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/38 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L35/08 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract translation: 提供了功率器件封装，其包括使用珀尔帖效应的热电模块，并且因此可以通过快速耗散在外部产生的热量来提高操作可靠性及其制造方法。 一种示例性功率器件封装包括：具有第一表面和彼此相对的第二表面的热电模块，以及多个n型杂质元件和多个p型杂质元件串联交替和电连接 ; 引导框架，其通过粘合构件附接到热电模块的第一表面; 至少一个功率半导体芯片和至少一个控制半导体芯片，每个芯片安装在引线框架上并电连接到引线框架; 以及密封构件，其密封热电模块，芯片和引线框架的至少一部分，但暴露模块的第二表面。

公开(公告)号：US20120034741A1

公开(公告)日：2012-02-09

申请号：US13278664

申请日：2011-10-21

Applicant: Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

Inventor： Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

IPC: H01L21/56

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract translation: 设置在引线框架和功率器件封装中的功率器件裸片之间的金属片裸片附着片（DAP）降低了由半导体功率器件的不同热膨胀系数（CTE）引起的施加在半导体功率器件裸片上的应力 模具和引线框架。 此外，功率器件封装基本上防止杂质通过增加由金属片DAP产生的密封剂的表面爬电距离和引线框架的可选的模锻而渗透到功率器件封装中。