公开(公告)号：US07923301B2

公开(公告)日：2011-04-12

申请号：US12699600

申请日：2010-02-03

Applicant: Lay Yeap Lim

Inventor： Lay Yeap Lim

IPC: H01L21/60

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.

Abstract translation: 公开了引线框架结构。 引线框架结构包括具有第一薄部分和第一厚部分的第一引线框架结构部分，其中第一薄部分部分地由第一凹部限定。 它还包括具有第二薄部分和第二厚部分的第二引线框架结构部分，其中第二薄部分由第二凹部部分限定。 第一薄部分面向第二凹部，第二薄部分面向第一凹部。

公开(公告)号：US07683463B2

公开(公告)日：2010-03-23

申请号：US11737630

申请日：2007-04-19

Applicant: Lay Yeap Lim

Inventor： Lay Yeap Lim

IPC: H01L23/495

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.

Abstract translation: 公开了引线框架结构。 引线框架结构包括具有第一薄部分和第一厚部分的第一引线框架结构部分，其中第一薄部分部分地由第一凹部限定。 它还包括具有第二薄部分和第二厚部分的第二引线框架结构部分，其中第二薄部分由第二凹部部分限定。 第一薄部分面向第二凹部，第二薄部分面向第一凹部。

公开(公告)号：US20090189261A1

公开(公告)日：2009-07-30

申请号：US12020286

申请日：2008-01-25

Applicant: Lay Yeap Lim ,  David Chong

Inventor： Lay Yeap Lim ,  David Chong

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L23/49562 ,  H01L21/4828 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48611 ,  H01L2224/48616 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48811 ,  H01L2224/48816 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/49111 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85051 ,  H01L2224/85191 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85411 ,  H01L2224/85416 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/0665 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/206

Abstract: Semiconductor packages with a reduced-height die pad and associated methods for making and using these semiconductor packages are described. The semiconductor packages include a lead frame with die pad of reduced height so the die pad has a height that is less than that of the lead frame. The semiconductor packages may comprise an isolated and/or a fused lead finger with a portion of an upper surface of the isolated lead finger that is removed to form a concavity to which one or more bond wires may be bonded. The upper surface of the isolated lead finger may be removed so the isolated lead finger has a height that is less than the height of the lead frame. And a perimeter of a bottom surface of the fused lead finger may be removed. Other embodiments are described.

Abstract translation: 描述了具有较低高度管芯焊盘的半导体封装以及用于制造和使用这些半导体封装件的相关方法。 半导体封装包括具有降低高度的管芯焊盘的引线框架，使得管芯焊盘的高度小于引线框架的高度。 半导体封装可以包括隔离的和/或熔合的引线指，其中隔离的引线指的上表面的一部分被去除以形成可以结合一个或多个接合线的凹面。 可以去除隔离的引线指的上表面，使得隔离的引线指的高度小于引线框架的高度。 并且可以去除熔融引线指的底表面的周边。 描述其他实施例。

公开(公告)号：US20100258925A1

公开(公告)日：2010-10-14

申请号：US12823411

申请日：2010-06-25

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US20090236711A1

公开(公告)日：2009-09-24

申请号：US12052871

申请日：2008-03-21

Applicant: Lay Yeap Lim ,  David Chong

Inventor： Lay Yeap Lim ,  David Chong

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L23/49558 ,  H01L21/4828 ,  H01L21/561 ,  H01L23/49572 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that lend structural support of the lead frame. The top is then etch through the lead frame to the pre-mold, except with the top conductive runs exist. In this manner the conductive runs are completed and isolated from each other so that the placement of the runs is flexible. The chips are mounted and the encapsulated and the lead frames are singulated. The pattern on the top and the bottom may be defined by first plated the patterns desired.

Abstract translation: 公开了一种在顶表面上具有带图案导电的导线框架，以接受导线接合或倒装芯片或COL构造。 顶部图案完成，底部被蚀刻掉，形成空腔。 这些空腔填充有借助引线框架的结构支撑的预模具材料。 然后将顶部通过引线框架蚀刻到预模具，除了存在顶部导电性运行。 以这种方式，导电运行完成并彼此隔离，使得运行的放置是柔性的。 芯片被安装，封装和引线框架被分割。 顶部和底部的图案可以通过首先电镀所需的图案来定义。

公开(公告)号：US08664752B2

公开(公告)日：2014-03-04

申请号：US13430347

申请日：2012-03-26

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

IPC: H01L23/495

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US20100136750A1

公开(公告)日：2010-06-03

申请号：US12699600

申请日：2010-02-03

Applicant: Lay Yeap Lim

Inventor： Lay Yeap Lim

IPC: H01L21/60 ,  B44C1/22

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.

Abstract translation: 公开了引线框架结构。 引线框架结构包括具有第一薄部分和第一厚部分的第一引线框架结构部分，其中第一薄部分部分地由第一凹部限定。 它还包括具有第二薄部分和第二厚部分的第二引线框架结构部分，其中第二薄部分由第二凹部部分限定。 第一薄部分面向第二凹部，第二薄部分面向第一凹部。

公开(公告)号：US20080258272A1

公开(公告)日：2008-10-23

申请号：US11737630

申请日：2007-04-19

Applicant: Lay Yeap Lim

Inventor： Lay Yeap Lim

IPC: H01L23/495 ,  H01L21/00 ,  H01L23/02

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.

Abstract translation: 公开了引线框架结构。 引线框架结构包括具有第一薄部分和第一厚部分的第一引线框架结构部分，其中第一薄部分部分地由第一凹部限定。 它还包括具有第二薄部分和第二厚部分的第二引线框架结构部分，其中第二薄部分由第二凹部部分限定。 第一薄部分面向第二凹部，第二薄部分面向第一凹部。

公开(公告)号：US20120181675A1

公开(公告)日：2012-07-19

申请号：US13430347

申请日：2012-03-26

Applicant: Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

Inventor： Oseob Jeon ,  Yoonhwa Choi ,  Boon Huan Gooi ,  Maria Cristina B. Estacio ,  David Chong ,  Tan Teik Keng ,  Shibaek Nam ,  Rajeev Joshi ,  Chung-Lin Wu ,  Venkat Iyer ,  Lay Yeap Lim ,  Byoung-Ok Lee

IPC: H01L23/495

CPC classification number: H01L24/29 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/4943 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。 示例性半导体管芯封装包括预成型衬底。 预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

公开(公告)号：US08110447B2

公开(公告)日：2012-02-07

申请号：US12052871

申请日：2008-03-21

Applicant: Lay Yeap Lim ,  David Chong

Inventor： Lay Yeap Lim ,  David Chong

IPC: H01L21/00

CPC classification number: H01L23/49558 ,  H01L21/4828 ,  H01L21/561 ,  H01L23/49572 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A lead frame with patterned conductive runs on the top surface to accept a wire bonded or flip-chip or COL configuration is disclosed. The top pattern is completed and the bottom is etched away creating cavities. The cavities are filled with a pre-mold material that lend structural support of the lead frame. The top is then etch through the lead frame to the pre-mold, except with the top conductive runs exist. In this manner the conductive runs are completed and isolated from each other so that the placement of the runs is flexible. The chips are mounted and the encapsulated and the lead frames are singulated. The pattern on the top and the bottom may be defined by first plated the patterns desired.

Abstract translation: 公开了一种在顶表面上具有带图案导电的导线框架，以接受导线接合或倒装芯片或COL构造。 顶部图案完成，底部被蚀刻掉，形成空腔。 这些空腔填充有借助引线框架的结构支撑的预模具材料。 然后将顶部通过引线框架蚀刻到预模具，除了存在顶部导电性运行。 以这种方式，导电运行完成并彼此隔离，使得运行的放置是柔性的。 芯片被安装，封装和引线框架被分割。 顶部和底部的图案可以通过首先电镀所需的图案来定义。