Invention Grant
- Patent Title: Etched leadframe structure
- Patent Title (中): 蚀刻引线框架结构
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Application No.: US12699600Application Date: 2010-02-03
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Publication No.: US07923301B2Publication Date: 2011-04-12
- Inventor: Lay Yeap Lim
- Applicant: Lay Yeap Lim
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.
Public/Granted literature
- US20100136750A1 Etched Leadframe Structure Public/Granted day:2010-06-03
Information query
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