Invention Application
- Patent Title: ETCHED LEADFRAME STRUCTURE
- Patent Title (中): 被蚀刻的LEADFRAME结构
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Application No.: US11737630Application Date: 2007-04-19
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Publication No.: US20080258272A1Publication Date: 2008-10-23
- Inventor: Lay Yeap Lim
- Applicant: Lay Yeap Lim
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/00 ; H01L23/02
Abstract:
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.
Public/Granted literature
- US07683463B2 Etched leadframe structure including recesses Public/Granted day:2010-03-23
Information query
IPC分类:
