公开(公告)号：US20080164589A1

公开(公告)日：2008-07-10

申请号：US11970911

申请日：2008-01-08

Applicant: Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

Inventor： Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract translation: 设置在引线框架和功率器件封装中的功率器件裸片之间的金属片裸片附着片（DAP）降低了由半导体功率器件的不同热膨胀系数（CTE）引起的施加在半导体功率器件裸片上的应力 模具和引线框架。 此外，功率器件封装基本上防止杂质通过增加由金属片DAP产生的密封剂的表面爬电距离和引线框架的可选的模锻而渗透到功率器件封装中。

公开(公告)号：US08945992B2

公开(公告)日：2015-02-03

申请号：US13278664

申请日：2011-10-21

Applicant: Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

Inventor： Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

IPC: H01L21/00 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract translation: 设置在引线框架和功率器件封装中的功率器件裸片之间的金属片裸片附着片（DAP）降低了由半导体功率器件的不同热膨胀系数（CTE）引起的施加在半导体功率器件裸片上的应力 模具和引线框架。 此外，功率器件封装基本上防止杂质通过增加由金属片DAP产生的密封剂的表面爬电距离和引线框架的可选的模锻而渗透到功率器件封装中。

公开(公告)号：US08067826B2

公开(公告)日：2011-11-29

申请号：US11970911

申请日：2008-01-08

Applicant: Joon-Seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

Inventor： Joon-Seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

IPC: H01L23/495

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract translation: 设置在引线框架和功率器件封装中的功率器件裸片之间的金属片裸片附着片（DAP）降低了由半导体功率器件的不同热膨胀系数（CTE）引起的施加在半导体功率器件裸片上的应力 模具和引线框架。 此外，功率器件封装基本上防止杂质通过增加由金属片DAP产生的密封剂的表面爬电距离和引线框架的可选的模锻而渗透到功率器件封装中。

公开(公告)号：US20120034741A1

公开(公告)日：2012-02-09

申请号：US13278664

申请日：2011-10-21

Applicant: Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

Inventor： Joon-seo Son ,  O-seob Jeon ,  Taek-keun Lee ,  Byoung-ok Lee

IPC: H01L21/56

CPC classification number: H01L23/49562 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract translation: 设置在引线框架和功率器件封装中的功率器件裸片之间的金属片裸片附着片（DAP）降低了由半导体功率器件的不同热膨胀系数（CTE）引起的施加在半导体功率器件裸片上的应力 模具和引线框架。 此外，功率器件封装基本上防止杂质通过增加由金属片DAP产生的密封剂的表面爬电距离和引线框架的可选的模锻而渗透到功率器件封装中。

公开(公告)号：US07061080B2

公开(公告)日：2006-06-13

申请号：US10167067

申请日：2002-06-10

Applicant: Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

Inventor： Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

IPC: H01L23/495

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

公开(公告)号：US07208819B2

公开(公告)日：2007-04-24

申请号：US10974357

申请日：2004-10-26

Applicant: Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

Inventor： Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

IPC: H01L23/495

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Abstract translation: 提供电源模块封装。 功率模块封装包括电源电路元件，控制电路元件，引线框架，散热器和环氧树脂模塑料（EMC）。 控制电路元件连接到电源电路并控制电源电路中的芯片。 引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。 引线框架具有安装电源电路和控制电路的第一表面，并且用作散热路径的第二表面，特别地，电源电路附接到下降部件。 通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路，控制电路，引线框架和散热器，并将引线框架的外部连接装置和散热片的一侧曝光。

公开(公告)号：US20050056918A1

公开(公告)日：2005-03-17

申请号：US10974357

申请日：2004-10-26

Applicant: Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

Inventor： Gi-young Jeun ,  Sung-min Park ,  Joo-sang Lee ,  Sung-won Lim ,  O-seob Jeon ,  Byoung-ok Lee ,  Young-gil Kim ,  Gwi-gyeon Yang

IPC: H01L21/56 ,  H01L23/433 ,  H01L23/495

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Abstract translation: 提供电源模块封装。 功率模块封装包括电源电路元件，控制电路元件，引线框架，散热器和环氧树脂模塑料（EMC）。 控制电路元件连接到电源电路并控制电源电路中的芯片。 引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。 引线框架具有安装电源电路和控制电路的第一表面，并且用作散热路径的第二表面，特别地，电源电路附接到下降部件。 通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路，控制电路，引线框架和散热器，并将引线框架的外部连接装置和散热片的一侧曝光。

公开(公告)号：US20090243078A1

公开(公告)日：2009-10-01

申请号：US12406757

申请日：2009-03-18

Applicant: Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

Inventor： Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/38 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L35/08 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract translation: 提供了功率器件封装，其包括使用珀尔帖效应的热电模块，并且因此可以通过快速耗散在外部产生的热量来提高操作可靠性及其制造方法。 一种示例性功率器件封装包括：具有第一表面和彼此相对的第二表面的热电模块，以及多个n型杂质元件和多个p型杂质元件串联交替和电连接 ; 引导框架，其通过粘合构件附接到热电模块的第一表面; 至少一个功率半导体芯片和至少一个控制半导体芯片，每个芯片安装在引线框架上并电连接到引线框架; 以及密封构件，其密封热电模块，芯片和引线框架的至少一部分，但暴露模块的第二表面。

公开(公告)号：US20110204500A1

公开(公告)日：2011-08-25

申请号：US13101078

申请日：2011-05-04

Applicant: Seung-won Lim ,  O-soeb Jeon ,  Joon-Seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

Inventor： Seung-won Lim ,  O-soeb Jeon ,  Joon-Seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

IPC: H01L25/07 ,  H01L21/60

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/38 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L35/08 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract translation: 提供了功率器件封装，其包括使用珀尔帖效应的热电模块，并且因此可以通过快速耗散在外部产生的热量来提高操作可靠性及其制造方法。 一种示例性功率器件封装包括：具有第一表面和彼此相对的第二表面的热电模块，以及多个n型杂质元件和多个p型杂质元件串联交替和电连接 ; 引导框架，其通过粘合构件附接到热电模块的第一表面; 至少一个功率半导体芯片和至少一个控制半导体芯片，每个芯片安装在引线框架上并电连接到引线框架; 以及密封构件，其密封热电模块，芯片和引线框架的至少一部分，但暴露模块的第二表面。

公开(公告)号：US08552541B2

公开(公告)日：2013-10-08

申请号：US13101078

申请日：2011-05-04

Applicant: Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

Inventor： Seung-won Lim ,  O-soeb Jeon ,  Joon-seo Son ,  Byoung-ok Lee ,  Man-kyo Jong

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/34 ,  H01L21/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/38 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L35/08 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract translation: 提供了功率器件封装，其包括使用珀尔帖效应的热电模块，并且因此可以通过快速耗散在外部产生的热量来提高操作可靠性及其制造方法。 一种示例性功率器件封装包括：具有第一表面和彼此相对的第二表面的热电模块，以及多个n型杂质元件和多个p型杂质元件串联交替和电连接 ; 引导框架，其通过粘合构件附接到热电模块的第一表面; 至少一个功率半导体芯片和至少一个控制半导体芯片，每个芯片安装在引线框架上并电连接到引线框架; 以及密封构件，其密封热电模块，芯片和引线框架的至少一部分，但暴露模块的第二表面。