Invention Application
- Patent Title: Power module package having improved heat dissipating capability
- Patent Title (中): 功率模块封装具有改善的散热能力
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Application No.: US10974357Application Date: 2004-10-26
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Publication No.: US20050056918A1Publication Date: 2005-03-17
- Inventor: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
- Applicant: Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
- Applicant Address: KR Puchon Kyungki-Do
- Assignee: Fairchild Korea Semiconductor Ltd.
- Current Assignee: Fairchild Korea Semiconductor Ltd.
- Current Assignee Address: KR Puchon Kyungki-Do
- Priority: KR2001-32489 20010611; KR2002-20779 20020417
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/433 ; H01L23/495
Abstract:
A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
Public/Granted literature
- US07208819B2 Power module package having improved heat dissipating capability Public/Granted day:2007-04-24
Information query
IPC分类:
