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    Laminated integrated circuit package
    7.
    发明授权
    Laminated integrated circuit package 失效
    层压集成电路封装

    公开(公告)号：US6140707A

    公开(公告)日：2000-10-31

    申请号：US74126

    申请日：1998-05-07

    申请人： Anthony R. Plepys ,  Paul M. Harvey

    发明人： Anthony R. Plepys ,  Paul M. Harvey

    IPC分类号： H01L23/12 ,  H01L21/50 ,  H01L23/498 ,  H01L29/40

    CPC分类号： H01L21/50 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/15311

    摘要： A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads. This package provides a die attachment site having a high degree of planarity due to tensile stresses formed in the flexible circuit and adhesive layers during lamination of those layers to the stiffener. Embodiments of this invention may be used with TBGA, frangible lead, and other packaging technologies.

    摘要翻译： 提供了一种用于封装集成电路的低成本集成电路封装。 在优选实施例中，封装包括使用电介质粘合剂层压到加强件的柔性电路，柔性电路上的导电迹线面向加强件，但是通过粘合剂与其分离。 导电迹线包括倒装芯片附接焊盘的阵列。 在附着垫阵列上的加强件中形成窗口，例如通过蚀刻。 然后通过激光烧蚀在粘附垫上去除粘合剂，但留在垫之间的位置，从而形成倒装芯片附着部位。 在优选实施例中，本发明消除了对高分辨率图案化粘合剂的需要，并且也消除了在倒装芯片附接位置处施加焊接掩模的需要，因为剩余的粘合剂执行阻焊功能以防止附着之间的桥接 垫 该包装提供了由于在将这些层层压到加强件期间在柔性电路和粘合剂层中形成的拉伸应力而具有高度平坦度的模具附接部位。 本发明的实施例可以与TBGA，易碎引线和其他封装技术一起使用。

    Exhaust gas recirculation system with high rate valve
    9.
    发明授权
    Exhaust gas recirculation system with high rate valve 失效
    具有高速阀的排气回送系统

    公开(公告)号：US3901203A

    公开(公告)日：1975-08-26

    申请号：US38175473

    申请日：1973-07-23

    申请人： GEN MOTORS CORP

    发明人： POZNIAK DONALD J

    IPC分类号： F02B1/04 ,  F02M25/07 ,  F02M25/06

    CPC分类号： F02M26/58 ,  F02B1/04 ,  F02M26/55 ,  F02M26/70

    摘要： An exhaust gas recirculation system for an internal combustion engine with a carburetor and a throttle for controlling air-fuel flow to the intake manifold of the vehicle; an exhaust gas recirculation conduit is connected between the vehicle exhaust and an induction passageway between the carburetor and the throttle. Valve means are operated in accordance with the intake manifold pressure to vary the amount of exhaust gas recirculation into the induction manifold, the valve having a high rate flow area scheduled to produce an increasing ratio of exhaust gas recirculation to intake air flow so as to continually increase the exhaust gas recirculation on increasing engine load thereby to maintain reduced vehicle NOx emissions during all operating conditions.