Abstract:
An apparatus includes first means for routing current coupled to a bit cell. The apparatus includes third means for routing current. The third means for routing current includes a write word line coupled to the bit cell. The apparatus includes second means for routing current. The second means for routing current is between the first means for routing current and the third means for routing current. The second means for routing current includes two read word lines coupled to the bit cell.
Abstract:
An apparatus includes a first metal layer coupled to a bit cell. The apparatus also includes a third metal layer including a write word line that is coupled to the bit cell. The apparatus further includes a second metal layer between the first metal layer and the third metal layer. The second metal layer includes two read word lines coupled to the bit cell.
Abstract:
Systems and methods relate to a seven transistor static random-access memory (7T SRAM) bit cell which includes a first inverter having a first pull-up transistor, a first pull-down transistor, and a first storage node, and a second inverter having a second pull-up transistor, a second pull-down transistor, and a second storage node. The second storage node is coupled to gates of the first pull-up transistor and the first pull-down transistor. A transmission gate is configured to selectively couple the first storage node to gates of the second pull-up transistor and the second pull-down transistor during a write operation, a standby mode, and a hold mode, and selectively decouple the first storage node from gates of the first pull-up transistor and a first pull-down transistor during a read operation. The 7T SRAM bit cell can be read or written through an access transistor coupled to the first storage node.
Abstract:
A method and apparatus for balancing voltage stress at a silicon-oxide-nitride-oxide-silicon (SONOS) flash memory array is disclosed. A particular cell of the SONOS flash memory array is selected for programming. A first voltage stress associated with a first SONOS transistor is determined if the particular cell is programmed. The first SONOS transistor is included in a first unselected cell of the SONOS flash memory array. A second voltage stress associated with a second SONOS transistor is determined if the particular cell is programmed. The first voltage stress and the second voltage stress are balanced prior to programming the particular cell.
Abstract:
An apparatus includes a first metal layer coupled to a bit cell. The apparatus also includes a third metal layer including a write word line that is coupled to the bit cell. The apparatus further includes a second metal layer between the first metal layer and the third metal layer. The second metal layer includes two read word lines coupled to the bit cell.
Abstract:
In a particular embodiment, a method includes forming a second hardmask layer adjacent to a first sidewall structure and adjacent to a mandrel of a semiconductor device. A top portion of the mandrel is exposed prior to formation of the second hardmask layer. The method further includes removing the first sidewall structure to expose a first portion of a first hardmask layer. The method also includes etching the first portion of the first hardmask layer to expose a second portion of a dielectric material. The method also includes etching the second portion of the dielectric material to form a first trench. The method also includes forming a first metal structure within the first trench.
Abstract:
An apparatus includes a static random-access memory and circuitry configured to initiate a corrective action associated with the static random-access memory. The corrective action may be initiated based on a number of static random-access memory cells that have a particular state responsive to a power-up of the static random-access memory.
Abstract:
Aspects disclosed include static random access memory (SRAM) arrays having substantially constant operational yields across multiple modes of operation. In one aspect, a method of designing SRAM arrays with multiple modes operation is provided. The method includes determining performance characteristics associated with each mode of operation. SRAM bit cells configured to operate in each mode of operation are provided to the SRAM array. SRAM bit cells are biased to operate in a mode of operation using dynamic adaptive assist techniques, wherein the SRAM bit cells achieve a substantially constant operational yield across the modes. The SRAM bit cells have a corresponding type, wherein the number of SRAM bit cell types in the method is less than the number of modes of operation. Thus, each SRAM array may achieve a particular mode of operation without requiring a separate SRAM bit cell type for each mode, thereby reducing costs.
Abstract:
A semiconductor device includes a gate and a first active contact adjacent to the gate. Such a device further includes a first stacked contact electrically coupled to the first active contact, including a first isolation layer on sidewalls electrically isolating the first stacked contact from the gate. The device also includes a first via electrically coupled to the gate and landing on the first stacked contact. The first via electrically couples the first stacked contact and the first active contact to the gate to ground the gate.
Abstract:
Static random access memory (SRAM) bit cells with wordline landing pads split across boundary edges of the SRAM bit cells are disclosed. In one aspect, an SRAM bit cell is disclosed employing write wordline in second metal layer, first read wordline in third metal layer, and second read wordline in fourth metal layer. Employing wordlines in separate metal layers allows wordlines to have wider widths, which decrease wordline resistance, decrease access time, and increase performance of SRAM bit cell. To employ wordlines in separate metal layers, multiple tracks in first metal layer are employed. To couple read wordlines to the tracks to communicate with SRAM bit cell transistors, landing pads are disposed on corresponding tracks inside and outside of a boundary edge of the SRAM bit cell. Landing pads corresponding to the write wordline are placed on corresponding tracks within the boundary edge of the SRAM bit cell.