公开(公告)号：US5994222A

公开(公告)日：1999-11-30

申请号：US845786

申请日：1997-04-25

申请人： John W. Smith ,  Thomas H. DiStefano

发明人： John W. Smith ,  Thomas H. DiStefano

IPC分类号： H01L23/31 ,  H01L21/00

CPC分类号： H01L23/3107 ,  H01L24/97 ,  H01L2224/50 ,  H01L2224/97 ,  H01L2924/01082 ,  H01L2924/12042

摘要： A bonding component for electrically connecting a semiconductor chip or wafer to a support substrate includes a dielectric layer having a central region, elongated slots defining the central region, and a peripheral region surrounding the slots. Metallic bonding pads are arranged on the central region, and leads extend from the bonding pads to the edge of the central region and extending partially across the elongated slots. The leads are detached from the peripheral region of the dielectric layer on the side of the slots opposite the central region. The leads are adapted to be deformed during bonding to a semiconductor chip or wafer. To form the bonding component, a dielectric layer is first provided having a central region, slots and a peripheral region. A metallic structure is also provided having bonding pads on the central region, and leads electrically connected to the bonding pads and to a plating bus disposed in the peripheral region. A resist is applied to the metallic structure in zones separating the leads, the metallic structure is plated in regions outside the zones with an etch resistant metal, the resist is removed and the leads are etched so as to form gaps in the metallic structure over the elongated slots.

摘要翻译： 用于将半导体芯片或晶片电连接到支撑衬底的接合部件包括具有中心区域的介电层，限定中心区域的细长槽和围绕槽的周边区域。 金属接合焊盘布置在中心区域上，并且引线从焊盘延伸到中心区域的边缘并且部分延伸穿过细长槽。 引线与介质层的与中心区域相对的一侧的外围区域分离。 引线适于在与半导体芯片或晶片接合期间变形。 为了形成接合部件，首先提供具有中心区域，槽和周边区域的电介质层。 还提供了一种金属结构，在中心区域具有接合焊盘，并且引线电连接到接合焊盘和设置在周边区域中的电镀母线。 在分离引线的区域中将金属结构施加抗蚀剂，金属结构用耐蚀刻金属镀在区域外的区域中，去除抗蚀剂并蚀刻引线以在金属结构上形成间隙 细长的槽。

公开(公告)号：US5812378A

公开(公告)日：1998-09-22

申请号：US511131

申请日：1995-08-04

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H05K7/12 ,  H01R9/09

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/72 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06733 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

摘要翻译： 用于微电子的连接器包括具有多个孔的片状体，理想地布置成规则的格子图案。 每个孔设置有弹性层状接触，例如金属板的环，其具有在主体的第一主表面的孔的内部向内延伸的多个突起。 连接器主体的第二表面上的端子电连接到触点。 连接器可以附接到诸如多层电路板的基板，使得连接器上的端子电连接到基板内的引线。 具有凸起引线的微电子元件可以与连接器接合并且因此连接到基板，通过将凸块引线推进到连接器的孔中以与触点接合凸起引线。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US5801441A

公开(公告)日：1998-09-01

申请号：US440665

申请日：1995-05-15

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52 ,  H01R4/58 ,  H01R9/09

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

公开(公告)号：US5590460A

公开(公告)日：1997-01-07

申请号：US277336

申请日：1994-07-19

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K3/36

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  H05K3/0032 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

摘要翻译： 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件具有垂直于表面的中心轴线和适于根据由接合电路板上的焊盘施加的力而从中心轴线径向向外扩张的外围部分。 因此，当电路板被内插件压缩时，触头径向膨胀并擦过焊盘。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身上承载的导电接合材料。

公开(公告)号：US07368818B2

公开(公告)日：2008-05-06

申请号：US11259398

申请日：2005-10-26

申请人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

公开(公告)号：US06357112B1

公开(公告)日：2002-03-19

申请号：US09200100

申请日：1998-11-25

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC分类号： H01R906

CPC分类号： H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

摘要： A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

摘要翻译： 用于制造微电子元件组件的连接部件具有形成在电介质支撑结构上的可剥离引线。 每个引线的一端永久地连接到支撑结构，并且引线的相对端可释放地连接到支撑结构。 当引线的可释放端接合到半导体芯片上的触点时，引线的可释放端可以从支撑结构剥离，使得芯片可以从支撑结构移开。 柔性层可以设置在芯片和支撑结构之间。 如果柔性材料在芯片和支撑结构之间注入以形成顺应性层，柔性材料将使芯片从支撑结构上提升，并促进引线从支撑结构的剥离。

公开(公告)号：US06265759B1

公开(公告)日：2001-07-24

申请号：US09120006

申请日：1998-07-21

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L23495

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB.

摘要翻译： 一种具有内部横向弯曲引线的半导体芯片封装，以补偿半导体芯片和诸如PWB的支撑基板之间的CTE失配。

公开(公告)号：US06255723B1

公开(公告)日：2001-07-03

申请号：US09179273

申请日：1998-10-27

申请人： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

发明人： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

IPC分类号： H01L23495

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

摘要： A layered lead is disclosed including a layer of structural material which has top and bottom sides, a layer of fatigue-resistant material on the top and bottom surfaces and a layer of bonding material covering the fatigue-resistant layer on the bottom surface for connection to a contact on a chip. An asymmetrical distribution of bonding material on the top and bottom sides may be used to provide reinforcement of the lead against stress. The fatigue-resistant material also acts as a barrier against diffusion between the metal layers.

摘要翻译： 公开了一种分层引线，其包括具有顶侧和底侧的结构材料层，在顶表面和底表面上的耐疲劳材料层，以及覆盖底表面上的抗疲劳层的接合材料层，用于连接到 芯片上的一个接触。 可以使用顶部和底部上的接合材料的不对称分布来提供引线抵抗应力的增强。 耐疲劳材料还用作阻挡金属层之间扩散的屏障。

公开(公告)号：US5859472A

公开(公告)日：1999-01-12

申请号：US927601

申请日：1997-09-12

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/498 ,  H05K3/40 ,  H01L23/48 ,  H01L29/06

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H05K3/4092 ,  H01L2224/73203 ,  H01L2924/01079 ,  H01L2924/01322

摘要： A microelectronic assembly includes first and second microelectronic elements having confronting surfaces that are spaced apart from one another. Vertically extensive flexible lead elements interconnect electrical connections on the microelectronic elements. Each of the flexible lead elements may include a plurality of curved conductors that are electrically connected and parallel to one another. The lead elements may initially be formed on a lead bearing surface, and have a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element. The terminal end is disposed on the lead bearing surface and fixed to it, while the tip end is releasably connected to the lead bearing surface, and spaced apart from the terminal end on an offset axis. Curved leads interconnect the tip end and the terminal end.

摘要翻译： 微电子组件包括具有彼此间隔开的相对表面的第一和第二微电子元件。 垂直广泛的柔性引线元件互连微电子元件上的电连接。 每个柔性引线元件可以包括电连接并彼此平行的多个弯曲导体。 引线元件可以最初形成在引线轴承表面上，并且具有用于连接到第一微电子元件的终端和用于连接到第二微电子元件的末端。 终端设置在引导轴承表面上并固定在其上，而前端可释放地连接到引导轴承表面，并且在偏移轴线上与终端间隔开。 弯曲导线将尖端和终端互连。