公开(公告)号：US20190051762A1

公开(公告)日：2019-02-14

申请号：US16073418

申请日：2017-02-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/00 ,  H01L33/44 ,  H01L33/58 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US10180235B2

公开(公告)日：2019-01-15

申请号：US14413887

申请日：2013-07-09

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: F21V1/00 ,  F21V7/00 ,  G02B7/00 ,  G02B7/02 ,  G02B17/02 ,  G02B27/42 ,  H01L31/0232 ,  H01L27/146 ,  F21V13/02 ,  G01J1/02 ,  G01J1/04 ,  G02B7/182 ,  G01J3/02 ,  G01J3/18 ,  G02B5/10

Abstract: The optical module (1) comprises—a first member (O) having a first face (F1) which is substantially planar;—a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face;—a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4);—a mirror element (31′; 31′″) present on the second face (F2); and—an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31′. . . ) are present; c) providing a third wafer, wherein the third wafer is comprised in the first wafer or is comprised in the second wafer or is distinct from these, and wherein the third wafer comprises openings (4); e) forming a wafer stack comprising these wafers; wherein at least one of the first wafer and the second wafer comprises transparent portions (t) through which light can pass.

公开(公告)号：US10171918B2

公开(公告)日：2019-01-01

申请号：US15788267

申请日：2017-10-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jens Geiger ,  Markus Rossi ,  Hartmut Rudmann

IPC: H04R19/04 ,  H04R3/00 ,  H04R31/00 ,  H04R19/00 ,  B81C1/00 ,  B81B7/00

Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.

公开(公告)号：US20180329187A1

公开(公告)日：2018-11-15

申请号：US15755817

申请日：2016-08-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Nicola Spring ,  Hartmut Rudmann ,  Markus Rossi

IPC: G02B17/08 ,  H05K1/11 ,  H05K1/02 ,  G02B26/08 ,  H05K1/18 ,  H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L31/0232 ,  H01L31/02 ,  H01L33/48 ,  H01L31/0203

CPC classification number: G02B17/0864 ,  G02B6/00 ,  G02B6/10 ,  G02B6/12 ,  G02B6/42 ,  G02B19/0028 ,  G02B26/0833 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0274 ,  H05K1/03 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2054

Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).

公开(公告)号：US10101555B2

公开(公告)日：2018-10-16

申请号：US14905391

申请日：2014-07-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirnio ,  Hartmut Rudmann ,  Mario Cesana ,  Stephan Heimgartner

IPC: H04N5/225 ,  G02B7/02 ,  G03B17/02 ,  G03B29/00

Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

公开(公告)号：US10096644B2

公开(公告)日：2018-10-09

申请号：US15487132

申请日：2017-04-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H04N5/225 ,  H01L27/146 ,  G02B13/00 ,  H01L31/0203 ,  H01L31/0232 ,  G02B21/36 ,  H01L31/054

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

公开(公告)号：US20180261585A1

公开(公告)日：2018-09-13

申请号：US15973714

申请日：2018-05-08

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L25/16 ,  H01L27/146 ,  H01L25/075 ,  H01L33/58 ,  H01L23/544

CPC classification number: H01L25/167 ,  H01L23/544 ,  H01L25/0753 ,  H01L25/162 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L33/58 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

公开(公告)号：US20180205857A1

公开(公告)日：2018-07-19

申请号：US15742567

申请日：2016-06-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Sai Mun Chan ,  Hartmut Rudmann ,  Tae Yong Ahn ,  Kyu Won Hwang

IPC: H04N5/225 ,  H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  G02B13/00 ,  G02B7/02 ,  G02B7/04 ,  H04N5/232

CPC classification number: H04N5/2257 ,  G02B7/021 ,  G02B7/028 ,  G02B7/04 ,  G02B13/0085 ,  H01L21/561 ,  H01L21/566 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H01L2224/45099

Abstract: Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.

公开(公告)号：US20180136434A1

公开(公告)日：2018-05-17

申请号：US15564255

申请日：2016-04-05

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Kyu Won Hwang ,  Hartmut Rudmann

IPC: G02B7/09 ,  G03B3/10 ,  H04N5/225 ,  G02B7/02

CPC classification number: G02B7/09 ,  G02B7/023 ,  G03B3/10 ,  G03B17/12 ,  H04N5/2253 ,  H04N5/2254

Abstract: The present disclosure describes image sensor modules that can include auto focus control. The modules also include features that can help reduce or eliminate tilt of the module's optical sub-assembly with respect to the plane of the image sensor. In some instances, the modules include features to facilitate highly precise positioning of the optical sub-assembly, and also can result in modules having a very small z height.

公开(公告)号：US20180102394A1

公开(公告)日：2018-04-12

申请号：US15828664

申请日：2017-12-01

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L33/58 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.