公开(公告)号：US20180266877A1

公开(公告)日：2018-09-20

申请号：US15984278

申请日：2018-05-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: G01J1/02 ,  H01L31/173

CPC classification number: G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  G01J1/0295 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US20170229505A1

公开(公告)日：2017-08-10

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

CPC classification number: H01L27/14618 ,  H01L25/042 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

公开(公告)号：US11422291B2

公开(公告)日：2022-08-23

申请号：US16611338

申请日：2018-05-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Han Nee Ng ,  Tobias Senn ,  John A. Vidallon ,  Ramon Opeda, Jr. ,  Attilio Ferrari ,  Hartmut Rudmann ,  Martin Schubert

IPC: G02B3/00 ,  B29D11/00 ,  G03F7/00 ,  B29C43/36

Abstract: The method for manufacturing a multitude of devices comprises: providing a replication tool comprising a tool material; conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

公开(公告)号：US11009660B2

公开(公告)日：2021-05-18

申请号：US16483987

申请日：2018-02-09

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Qichuan Yu ,  Choon Hein Law ,  Ji Wang

IPC: G02B6/00 ,  G02B6/13 ,  G02B6/122 ,  F21V8/00

Abstract: The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.

公开(公告)号：US10199412B2

公开(公告)日：2019-02-05

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

公开(公告)号：US20180239116A1

公开(公告)日：2018-08-23

申请号：US15755221

申请日：2016-08-25

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Kam Wah Leong ,  Ji Wang

IPC: G02B13/00 ,  B29C45/14 ,  B29C45/17

Abstract: This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.

公开(公告)号：US20190097066A1

公开(公告)日：2019-03-28

申请号：US15772581

申请日：2016-11-15

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Ghana Sambandam

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：US20190051762A1

公开(公告)日：2019-02-14

申请号：US16073418

申请日：2017-02-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/00 ,  H01L33/44 ,  H01L33/58 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US20180329175A1

公开(公告)日：2018-11-15

申请号：US15775232

申请日：2016-11-04

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  Bojan Tesanovic ,  Qichuan Yu ,  Tobias Senn ,  Nicola Spring ,  Robert Lenart

IPC: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  G02B7/02

CPC classification number: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  B29K2995/0031 ,  B29L2011/00 ,  B29L2011/0016 ,  G02B7/021

Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

公开(公告)号：US20180006192A1

公开(公告)日：2018-01-04

申请号：US15631361

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L31/02 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.