公开(公告)号：US10199412B2

公开(公告)日：2019-02-05

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

公开(公告)号：US20170229505A1

公开(公告)日：2017-08-10

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

CPC classification number: H01L27/14618 ,  H01L25/042 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

公开(公告)号：US20170322376A1

公开(公告)日：2017-11-09

申请号：US15587687

申请日：2017-05-05

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Guo Xiong Wu ,  Cris Calsena ,  James Eilertsen ,  Qichuan Yu ,  Tobias Senn ,  Han Nee Ng

IPC: G02B6/13 ,  B29C65/48 ,  B29C65/14 ,  G02B6/12 ,  G02B6/122 ,  B29L11/00

CPC classification number: G02B6/13 ,  F16B11/006 ,  G02B6/12002 ,  G02B6/122 ,  G02B2006/121

Abstract: The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.