公开(公告)号：US10147167B2

公开(公告)日：2018-12-04

申请号：US15350214

申请日：2016-11-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Florin Cutu ,  James Eilertsen

IPC: G06K9/32 ,  G06T3/40 ,  H04N5/208 ,  H04N9/64 ,  G06T5/50 ,  H04N5/349 ,  H04N9/04

Abstract: Generating a super-resolved reconstructed image includes acquiring a multitude of monochromatic images of a scene and extracting high-frequency band luma components from the acquired images. A high-resolution luma image is generated using the high-frequency components and motion data for the acquired images. The high-resolution luma image is combined with an up-sampled color image, generated from the acquired images, to generate a super-resolved reconstructed color image of the scene.

公开(公告)号：US20170322376A1

公开(公告)日：2017-11-09

申请号：US15587687

申请日：2017-05-05

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Guo Xiong Wu ,  Cris Calsena ,  James Eilertsen ,  Qichuan Yu ,  Tobias Senn ,  Han Nee Ng

IPC: G02B6/13 ,  B29C65/48 ,  B29C65/14 ,  G02B6/12 ,  G02B6/122 ,  B29L11/00

CPC classification number: G02B6/13 ,  F16B11/006 ,  G02B6/12002 ,  G02B6/122 ,  G02B2006/121

Abstract: The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.

公开(公告)号：US20170148139A1

公开(公告)日：2017-05-25

申请号：US15350214

申请日：2016-11-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Florin Cutu ,  James Eilertsen

IPC: G06T3/40 ,  G06T5/00 ,  H04N9/78 ,  G06T7/20 ,  G06T11/60 ,  H04N5/232 ,  G06T7/40 ,  G06T5/20

CPC classification number: G06T3/4061 ,  G06T5/50 ,  G06T2207/10024 ,  G06T2207/20221 ,  H04N5/208 ,  H04N5/349 ,  H04N9/045 ,  H04N9/646

Abstract: Generating a super-resolved reconstructed image includes acquiring a multitude of monochromatic images of a scene and extracting high-frequency band luma components from the acquired images. A high-resolution luma image is generated using the high-frequency components and motion data for the acquired images. The high-resolution luma image is combined with an up-sampled color image, generated from the acquired images, to generate a super-resolved reconstructed color image of the scene.

公开(公告)号：US20190123213A1

公开(公告)日：2019-04-25

申请号：US16091352

申请日：2017-04-05

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/16 ,  H01L31/18 ,  H01L33/58 ,  H01L33/54 ,  H01L31/0216

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US20180129013A1

公开(公告)日：2018-05-10

申请号：US15805213

申请日：2017-11-07

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Martin Lukas Balimann ,  James Eilertsen

IPC: G02B7/02 ,  G02B19/00 ,  G02B1/02 ,  G02B26/00

Abstract: A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

公开(公告)号：US20190097066A1

公开(公告)日：2019-03-28

申请号：US15772581

申请日：2016-11-15

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Ghana Sambandam

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：US20190051762A1

公开(公告)日：2019-02-14

申请号：US16073418

申请日：2017-02-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang NG ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/00 ,  H01L33/44 ,  H01L33/58 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US20180301498A1

公开(公告)日：2018-10-18

申请号：US15766103

申请日：2016-09-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Bernhard Buettgen ,  James Eilertsen

IPC: H01L27/146 ,  H01L27/148 ,  H01L31/101

CPC classification number: H01L27/14647 ,  G01J3/0205 ,  G01S7/4914 ,  G01S17/10 ,  H01L27/14656 ,  H01L27/14831 ,  H01L31/1013

Abstract: Optoelectronic modules operable to collect distance data and spectral data include demodulation pixels operable to collect spectral data and distance data via a time-of flight approach. The demodulation pixels include regions with varying charge-carrier mobilities. Multi-wavelength electromagnetic radiation incident on the demodulation pixels are separated into different portions wherein the respective portions are used to determine the composition of the incident multi-wavelength electromagnetic radiation. Accordingly, the optoelectronic module is used, for example, to collect colour images and 3D images, and/or ambient light levels and distance data. The demodulation pixels comprise contact nodes that generate potential regions that vary in magnitude with the lateral dimension of the semiconductor substrate. The potential regions conduct the photo-generated charges from the photo-sensitive detection region to a charge-collection region. The photo-generated charges are conducted to the charge-collection region with respective drift velocities that vary in magnitude with the thickness of the semiconductor substrate.

公开(公告)号：US20180149751A1

公开(公告)日：2018-05-31

申请号：US15578350

申请日：2016-05-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jens Geiger ,  Peter Roentgen ,  Markus Rossi ,  James Eilertsen

IPC: G01S17/46 ,  G01S17/08 ,  G01S7/481

CPC classification number: G01S17/46 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4815 ,  G01S17/08 ,  G01S17/36

Abstract: Various optoelectronic modules are described that include an emitter operable to produce light (e.g., electromagnetic radiation in the visible or non-visible ranges), an emitter optical assembly aligned with the emitter so as to illuminate an object outside the module with light produced by the emitter, a detector operable to detect light at one or more wavelengths produced by the emitter, and a detector optical assembly aligned with the detector so as to direct light reflected by the object toward the detector. In some implementations, the modules include features for expanding or shifting the linear photocurrent response of the detector.