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公开(公告)号：US10186540B2
公开(公告)日：2019-01-22
申请号：US14743073
申请日：2015-06-18
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H04N5/225 , H01L25/00 , G02B13/00 , G02B5/22 , F21V5/04 , G02B7/02 , H01L31/0203 , H01L33/48 , H01L23/00 , H01L31/054 , H01L33/58 , F21Y115/10
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
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公开(公告)号：US20180295453A1
公开(公告)日：2018-10-11
申请号：US15788267
申请日：2017-10-19
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jens Geiger , Markus Rossi , Hartmut Rudmann
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/096 , B81C1/00873 , H04R3/00 , H04R19/005 , H04R31/00
Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.
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3.发明申请公开(公告)号：US20170287963A1
公开(公告)日：2017-10-05
申请号：US15622813
申请日：2017-06-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jens Geiger , Peter Roentgen , Vincenzo Condorelli
IPC: H01L27/146
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14685
Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
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4.发明授权公开(公告)号：US09711552B2
公开(公告)日：2017-07-18
申请号：US14823174
申请日：2015-08-11
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jens Geiger , Peter Roentgen , Vincenzo Condorelli
IPC: H01L33/00 , H01L27/146
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14685
Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
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公开(公告)号：US20160293585A1
公开(公告)日：2016-10-06
申请号：US15037392
申请日：2014-11-18
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Jens Geiger
IPC: H01L25/16 , H01L25/00 , H01L31/173 , H01L23/00 , H01L27/146 , H01L31/0232
CPC classification number: H01L25/167 , G01S7/4813 , H01L24/97 , H01L25/50 , H01L27/14618 , H01L31/02325 , H01L31/167 , H01L31/173 , H01L33/44 , H01L33/486 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/00
Abstract: Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.
Abstract translation: 描述了紧凑的光电模块，在一些实施方式中，可以降低高度，同时具有非常小的光串扰或杂散光的检测。 具有光通道的光电子模块可以包括支撑件，其上安装有被布置成发射或检测特定一个或多个波长的光的光电子器件。 该模块具有包括光电子器件上的光学透射部分的盖。 光学透射部分由盖子的横截面围绕，对于一个或多个波长基本上不透明。 无光光学元件存在于光学透射部分的表面上。 间隔件将支架与盖分开。 盖可以相对薄，使得模块的整体高度相对较小。
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Patent Agency Ranking
6.发明申请OPTO-ELECTRONIC MODULES WITH MASKING FEATURE FOR REDUCING THE VISIBILITY OF INTERIOR COMPONENTS 有权具有掩蔽功能的光电模块，用于降低内部组件的可见性公开(公告)号：US20160072029A1
公开(公告)日：2016-03-10
申请号：US14649425
申请日：2013-12-17
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Jens Geiger , René Kromhof
CPC classification number: H01L33/58 , G02B5/003 , G03B7/16 , G03B15/04 , G03B15/05 , G03B29/00 , G03B2215/05 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/60 , H04N1/6086
Abstract: Opto-electronic modules include masking features that can help reduce the visibility of interior components or enhance the outer appearance of the module or of an appliance incorporating the module as a component. The modules can include an optical diode or saturable optical absorber.
Abstract translation: 光电模块包括掩蔽功能，可以帮助降低内部组件的可视性，或者增强模块或将模块作为组件结合的设备的外观。 模块可以包括光二极管或可饱和光吸收器。
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7.发明申请公开(公告)号：US20180372943A1
公开(公告)日：2018-12-27
申请号：US15992273
申请日：2018-05-30
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Frank Sobel , Alexander Bietsch , Jens Geiger
Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
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8.发明申请公开(公告)号：US20180059218A1
公开(公告)日：2018-03-01
申请号：US15689079
申请日：2017-08-29
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Bernhard Buettgen , Jens Geiger , Michael Kiy , Oliver Chidley , Markus Rossi
CPC classification number: G01S7/483 , G01S7/481 , G01S7/4813 , G01S7/497 , G01S17/026 , G01S17/36 , G01S17/42 , G01S2007/4975
Abstract: A time of flight-based system is operable for ambient light measurements. A method of operation includes detecting, in at least one active demodulation detection pixel, a first particular wavelength and generating amplitude data of the first particular wavelength; and detecting, in at least one spurious reflection detection pixel, a second particular wavelength and generating amplitude data of the second particular wavelength. In a computational device that stores spectrum data corresponding respectively to a plurality of different ambient light source types, an ambient lighting condition is determined based on the amplitude data of the first particular wavelength, the amplitude data of the second particular wavelength and the spectrum data of a particular one of the ambient light source types associated with the amplitude data of the first particular wavelength and the amplitude data of the second particular wavelength.
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公开(公告)号：US09859327B2
公开(公告)日：2018-01-02
申请号：US15367257
申请日：2016-12-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号：US09826316B2
公开(公告)日：2017-11-21
申请号：US14894059
申请日：2014-05-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jens Geiger , Markus Rossi , Hartmut Rudmann
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/096 , B81C1/00873 , H04R3/00 , H04R19/005 , H04R31/00
Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.
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