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公开(公告)号:US09977153B2
公开(公告)日:2018-05-22
申请号:US15116599
申请日:2015-02-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Markus Rossi , Mario Cesana , Ohad Meitav , Peter Roentgen , Jukka Alasirniö , Stephan Heimgartner , Kai Engelhardt
CPC classification number: G02B3/0062 , G02B7/003 , G02B7/021 , G02B7/022 , G02B27/0961
Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.
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公开(公告)号:US20180059218A1
公开(公告)日:2018-03-01
申请号:US15689079
申请日:2017-08-29
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Bernhard Buettgen , Jens Geiger , Michael Kiy , Oliver Chidley , Markus Rossi
CPC classification number: G01S7/483 , G01S7/481 , G01S7/4813 , G01S7/497 , G01S17/026 , G01S17/36 , G01S17/42 , G01S2007/4975
Abstract: A time of flight-based system is operable for ambient light measurements. A method of operation includes detecting, in at least one active demodulation detection pixel, a first particular wavelength and generating amplitude data of the first particular wavelength; and detecting, in at least one spurious reflection detection pixel, a second particular wavelength and generating amplitude data of the second particular wavelength. In a computational device that stores spectrum data corresponding respectively to a plurality of different ambient light source types, an ambient lighting condition is determined based on the amplitude data of the first particular wavelength, the amplitude data of the second particular wavelength and the spectrum data of a particular one of the ambient light source types associated with the amplitude data of the first particular wavelength and the amplitude data of the second particular wavelength.
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公开(公告)号:US09880391B2
公开(公告)日:2018-01-30
申请号:US15026721
申请日:2014-09-05
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Markus Rossi
CPC classification number: G02B27/1013 , G02B3/0031 , G02B3/0062 , G02B13/0065 , G02B13/007 , G02B13/0085 , G02B17/08 , G02B17/086 , G02B27/1066 , G02B27/123 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H04N5/2254
Abstract: A lens module includes a substrate, a first array of passive optical elements on the substrate, and a second array of passive optical elements separate from the first array. The optical elements of the first array and the optical elements of the second array form multiple optical channels, in which at least one optical channel is a catadioptric optical channel including a reflective optical element and a refractive optical element. The reflective optical element is arranged to reflect light toward the refractive optical element, each optical channel has a corresponding field-of-view, and the lens module has an overall field of view defined by the range of angles subtended by the field-of-view of the plurality of optical channels.
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公开(公告)号:US20170356622A1
公开(公告)日:2017-12-14
申请号:US15618253
申请日:2017-06-09
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Markus Rossi , Peter Riel , Peter Roentgen
IPC: F21V9/08 , F21V5/00 , F21V7/22 , F21Y2115/30
CPC classification number: F21V9/08 , F21V5/004 , F21V7/22 , F21V9/30 , F21Y2115/30
Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.
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公开(公告)号:US20170343889A1
公开(公告)日:2017-11-30
申请号:US15675955
申请日:2017-08-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
CPC classification number: G03B21/142 , G02B7/003 , G02B7/02 , G03B21/2033 , H01L27/14618 , H01L33/483 , H01L33/58 , H01L2933/0033 , H01L2933/0058
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
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公开(公告)号:US09826316B2
公开(公告)日:2017-11-21
申请号:US14894059
申请日:2014-05-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Jens Geiger , Markus Rossi , Hartmut Rudmann
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/096 , B81C1/00873 , H04R3/00 , H04R19/005 , H04R31/00
Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.
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公开(公告)号:US20170248467A1
公开(公告)日:2017-08-31
申请号:US15510316
申请日:2015-09-08
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Peter Roentgen , Markus Rossi
CPC classification number: G01J3/18 , G01J3/0205 , G01J3/0208 , G01J3/0256 , G01J3/0262 , G01J3/0291 , G01J3/10 , G01J3/1804 , G01J3/1895 , G01J3/2803 , G01J3/36 , G01J2003/2806 , G01J2003/2813 , G01N21/255 , G01N21/27 , G02B5/1809 , G02B5/1861 , G02B6/0026 , G02B6/005 , G02B6/0055
Abstract: An optoelectronic module includes a light guide arranged to receive light, such as ambient light or light reflected by an object. The light guide has a diffractive grating that includes multiple sections, each of which is tuned to a respective wavelength or narrow band of wavelengths. The module further includes multiple photosensitive elements, each of which is arranged to receive light diffracted by a respective one of the sections of the diffractive grating. The module can be integrated, for example, as part of a spectrometer or other apparatus for optically determining characteristics of an object.
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公开(公告)号:US20170207374A1
公开(公告)日:2017-07-20
申请号:US15473935
申请日:2017-03-30
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Simon Gubser , Mario Cesana , Markus Rossi , Hartmut Rudmann
IPC: H01L33/56 , H01L33/58 , H01L31/0232 , H01L31/0203 , H01L31/0216 , H01L33/44 , H01L33/48 , H01L33/54
Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
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公开(公告)号:US20170135617A1
公开(公告)日:2017-05-18
申请号:US15325811
申请日:2015-07-13
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Jukka Alasirniö , Tobias Senn , Mario Cesana , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Pérez Calero , Bassam Hallal , Jens Geiger
IPC: A61B5/1455 , A61B5/024 , G01J1/42 , G01S17/48 , G01S7/497
CPC classification number: A61B5/14551 , A61B5/02416 , A61B5/02433 , A61B5/14552 , G01J1/4204 , G01S7/497 , G01S17/48 , G01S2007/4975
Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).
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公开(公告)号:US09640709B2
公开(公告)日:2017-05-02
申请号:US14917104
申请日:2014-08-20
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Simon Gubser , Mario Cesana , Markus Rossi , Hartmut Rudmann
IPC: H01L31/18 , H01L31/0232 , H01L27/146 , H01L23/00 , H01L31/0203 , H01L33/00 , H01L33/56 , H01L33/58 , H01L51/52 , H01L51/56 , H01S5/00 , H01S5/02 , H01S5/183
CPC classification number: H01L33/56 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/02164 , H01L31/02327 , H01L31/186 , H01L33/0095 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/58 , H01L51/5237 , H01L51/5275 , H01L51/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/181 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01S5/005 , H01S5/02 , H01S5/183 , H01L2924/00012 , H01L2924/00
Abstract: A wafer-level method of fabricating optoelectronic modules performing a first vacuum injection technique, using a first vacuum injection tool, to surround optoelectronic devices laterally with a transparent overmold region, performing a replication technique to form a respective passive optical element on a top surface of each overmold region, and performing a second vacuum injected technique to form sidewalls laterally surrounding and in contact with sides of each overmold region. The replication technique and the second vacuum injection technique are performed using a combined replication and vacuum injection tool.
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