公开(公告)号：US09977153B2

公开(公告)日：2018-05-22

申请号：US15116599

申请日：2015-02-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi ,  Mario Cesana ,  Ohad Meitav ,  Peter Roentgen ,  Jukka Alasirniö ,  Stephan Heimgartner ,  Kai Engelhardt

IPC: G02B27/10 ,  G02B3/00 ,  G02B7/00 ,  G02B7/02 ,  G02B27/09

CPC classification number: G02B3/0062 ,  G02B7/003 ,  G02B7/021 ,  G02B7/022 ,  G02B27/0961

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

公开(公告)号：US09859327B2

公开(公告)日：2018-01-02

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US20170084663A1

公开(公告)日：2017-03-23

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US09490287B2

公开(公告)日：2016-11-08

申请号：US14366770

申请日：2012-12-18

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  HEPTAGON OY

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

IPC: G02B27/10 ,  H01L27/146 ,  H01L27/148

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤：a）提供包括至少一个光学结构的第一衬底，该至少一个光学结构包括至少部分地围绕所述主要部分的主要部分和环绕部分; 以及b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

公开(公告)号：US20150340265A1

公开(公告)日：2015-11-26

申请号：US14408890

申请日：2013-06-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Stephan Heimgartner ,  John A. Vidallon

IPC: H01L21/683 ,  B32B37/12 ,  B32B38/18 ,  B32B37/18

CPC classification number: H01L21/6838 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1858 ,  B32B2457/00 ,  B32B2551/00

Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

Abstract translation: 描述了用于保持晶片或晶片子堆以促进子堆的晶片的进一步处理的技术。 在一些实施方案中，晶片或晶片子堆叠由真空吸盘保持，以便有助于减小晶片或晶片子堆叠的弯曲。

公开(公告)号：US20150325613A1

公开(公告)日：2015-11-12

申请号：US14743073

申请日：2015-06-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  G02B7/02 ,  F21V5/04 ,  G02B13/00 ,  G02B5/22

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。

公开(公告)号：US20150036046A1

公开(公告)日：2015-02-05

申请号：US14339623

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H04N5/225 ,  H01L25/00

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

公开(公告)号：US20170309685A1

公开(公告)日：2017-10-26

申请号：US15516692

申请日：2015-10-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Peter Riel

IPC: H01L27/32 ,  G02B27/42 ,  G02B27/09 ,  H01L31/0232

Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.

公开(公告)号：US09634051B2

公开(公告)日：2017-04-25

申请号：US14413866

申请日：2013-03-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H04N5/225 ,  H01L31/0232 ,  H01L27/146 ,  G02B13/00 ,  H01L31/0203 ,  G02B21/36 ,  H01L31/054

CPC classification number: H01L27/14687 ,  G01J3/0208 ,  G01J3/0256 ,  G02B13/0085 ,  G02B21/367 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  H01L2924/00

Abstract: Then optical device comprises a first member (P) and a second member (O) and, arranged between said first and second members, a third member (S) referred to as spacer. The spacer (S) comprises —one or more portions referred to as distancing portions (Sd) in which the spacer has a vertical extension referred to as maximum vertical extension; —at least two separate portions referred to as open portions (4) in which no material of the spacer is present; and —one or more portions referred to as structured portions (Sb) in which material of the spacer is present and in which the spacer has a vertical extension smaller than said maximum vertical extension. Such optical devices can be used in or as multi-aperture cameras.

公开(公告)号：US20160154198A1

公开(公告)日：2016-06-02

申请号：US14905391

申请日：2014-07-16

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Jukka Alasimio Alasimio ,  Hartmut Rudmann ,  Mario Cesana ,  Stephan Heimgartner

IPC: G02B7/02 ,  H04N5/225

CPC classification number: G02B7/021 ,  G02B3/00 ,  G02B7/02 ,  G03B17/02 ,  G03B29/00 ,  H04N5/225 ,  H04N5/2254 ,  H04N5/2257

Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

Abstract translation: 相机模块包括透镜，透镜组和/或透镜阵列。 一个或多个透镜具有非圆形形状，这在一些情况下可以在模块的尺寸上提供更大的灵活性并且可以导致非常小的相机模块。