公开(公告)号：US11422291B2

公开(公告)日：2022-08-23

申请号：US16611338

申请日：2018-05-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Han Nee Ng ,  Tobias Senn ,  John A. Vidallon ,  Ramon Opeda, Jr. ,  Attilio Ferrari ,  Hartmut Rudmann ,  Martin Schubert

IPC: G02B3/00 ,  B29D11/00 ,  G03F7/00 ,  B29C43/36

Abstract: The method for manufacturing a multitude of devices comprises: providing a replication tool comprising a tool material; conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

公开(公告)号：US10199412B2

公开(公告)日：2019-02-05

申请号：US15329112

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Sonja Hanselmann ,  Qichuan Yu ,  Cris Calsena ,  Guo Xiong Wu ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L25/04

Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

公开(公告)号：US09977153B2

公开(公告)日：2018-05-22

申请号：US15116599

申请日：2015-02-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi ,  Mario Cesana ,  Ohad Meitav ,  Peter Roentgen ,  Jukka Alasirniö ,  Stephan Heimgartner ,  Kai Engelhardt

IPC: G02B27/10 ,  G02B3/00 ,  G02B7/00 ,  G02B7/02 ,  G02B27/09

CPC classification number: G02B3/0062 ,  G02B7/003 ,  G02B7/021 ,  G02B7/022 ,  G02B27/0961

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

公开(公告)号：US20180138222A1

公开(公告)日：2018-05-17

申请号：US15850003

申请日：2017-12-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L27/146 ,  H04N5/225 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L24/48 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/181 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US09859327B2

公开(公告)日：2018-01-02

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US09826316B2

公开(公告)日：2017-11-21

申请号：US14894059

申请日：2014-05-26

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jens Geiger ,  Markus Rossi ,  Hartmut Rudmann

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  H04R3/00

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00873 ,  H04R3/00 ,  H04R19/005 ,  H04R31/00

Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.

公开(公告)号：US20170235026A1

公开(公告)日：2017-08-17

申请号：US15441515

申请日：2017-02-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

IPC: G02B3/00 ,  H01L25/16 ,  B29D11/00

Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).

公开(公告)号：US09716081B2

公开(公告)日：2017-07-25

申请号：US14401606

申请日：2013-05-15

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L25/16 ,  H01L33/58 ,  H01L27/146 ,  H01L25/075 ,  H01L23/544

CPC classification number: H01L25/167 ,  H01L23/544 ,  H01L25/0753 ,  H01L25/162 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L33/58 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

公开(公告)号：US20170207374A1

公开(公告)日：2017-07-20

申请号：US15473935

申请日：2017-03-30

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US20170135617A1

公开(公告)日：2017-05-18

申请号：US15325811

申请日：2015-07-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Mario Cesana ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Pérez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: A61B5/1455 ,  A61B5/024 ,  G01J1/42 ,  G01S17/48 ,  G01S7/497

CPC classification number: A61B5/14551 ,  A61B5/02416 ,  A61B5/02433 ,  A61B5/14552 ,  G01J1/4204 ,  G01S7/497 ,  G01S17/48 ,  G01S2007/4975

Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).