-
公开(公告)号:US11422291B2
公开(公告)日:2022-08-23
申请号:US16611338
申请日:2018-05-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Qichuan Yu , Han Nee Ng , Tobias Senn , John A. Vidallon , Ramon Opeda, Jr. , Attilio Ferrari , Hartmut Rudmann , Martin Schubert
Abstract: The method for manufacturing a multitude of devices comprises: providing a replication tool comprising a tool material; conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.
-
2.
公开(公告)号:US11554563B2
公开(公告)日:2023-01-17
申请号:US16640530
申请日:2018-07-17
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: QiChuan Yu , Han Nee Ng , Tobias Senn , John A. Vidallon , Ramon Opeda , Attilio Ferrari , Harmut Rudmann , Martin Schubert
Abstract: The method regards manufacturing devices by replication, wherein each of the devices comprises a device surface. The method comprises producing the devices from a replication material by replication using a replication tool (1), wherein the replication tool (1) comprises a tool material comprising replication sites (4) comprising a replication surface (5) each. Each of the replication surfaces (5) corresponds to a negative of the device surface of a respective one of the devices. The tool material comprises, in addition to the replication sites, one or more mitigating features (7) for reducing asymmetric form errors of the device surfaces. Replication tools (1) and methods for manufacturing these are also described.
-